Patent application number | Description | Published |
20090059543 | ELECTRONIC DEVICE MANUFACTURING METHOD USING LDS AND ELECTRONIC DEVICE MANUFACTURED BY THE METHOD - Disclosed is a method for manufacturing an electronic device using LDS and an electronic manufacturing by the method, in which resin for LDS is adhered to an inner surface of an external case by double injection or insert injection so as to implement a circuit. The electronic device using LDS includes upper and lower external cases, wherein resin for LDS is adhered to an inner surface of the lower external case by double injection or insert injection. Components of the electronic device are mounted on the resin, and the upper and lower external case are assembled with each other. | 03-05-2009 |
20090139758 | Printed circuit board assembly and manufacturing method for the same - A printed circuit board (PCB) assembly is disclosed, which includes a first PCB on which a plurality of first electrode terminals are arranged at intervals from one another; a second PCB on which a plurality of second electrode terminals respectively connected with the first electrode terminals are arranged at intervals from one another; and separation preventing member which prevents the first and the second electrode terminals from deviating from their correct positions when the first and the second electrode terminals are ultrasonically-welded to each other. Accordingly, lateral movement of the first and the second PCBs relative to each other is restricted owing to the separation preventing member, the plurality of first electrode terminals and second electrode terminals can be bonded to each other without deviating from their correct positions. | 06-04-2009 |
20100243309 | Connecting structure for circuit board and connecting method using the same - Disclosed is a connection structure for a circuit board using a solder bump to arrange circuit boards. The circuit board connection structure includes a solder bump prepared on one of two circuit boards and a perforated part formed at the other of the circuit boards to receive the solder bump. Facing both circuit boards towards each other and inserting the solder bump into the perforated part, the circuit boards are desirably arranged. | 09-30-2010 |
20100248505 | Printed circuit board assembly and connecting method thereof - Disclosed herein is a printed circuit board and a connecting method thereof. The connecting method of the circuit board assembly may include molding the printed circuit board assembly by applying a resin to the printed circuit board assembly, exposing ends of the electrode terminals of a connector mounted on a printed circuit board by partially removing the molded printed circuit board assembly, and connecting a connection member to the exposed ends of the electrode terminals of the connector. Therefore, even if the whole of the printed circuit board assembly is molded, the connection member may be freely connected to the connector of the printed circuit board assembly. | 09-30-2010 |
20110026233 | Apparatus and method for manufacturing elastic cable and electronic device using the same - Disclosed herein is an apparatus for manufacturing an elastic cable including conductor tracks arranged in a zigzag shape between elastic films. The apparatus may include a conductor track supplying unit to supply at least one conductor track, an aligning unit to align the at least one conductor track supplied from the conductor track supplying unit, a film supplying unit to supply elastic films such that the at least one conductor track is surrounded by the elastic films, and a thermal lamination roller unit to thermally laminate the at least one conductor track arranged between the elastic films, wherein the aligning unit is reciprocally movable to arrange the at least one conductor track in a zigzag shape between the elastic films when the at least one conductor track is supplied to the thermal lamination roller unit. | 02-03-2011 |
20110116778 | ZOOM SWITCH ASSEMBLY, IMAGE PHOTOGRAPHING APPARATUS HAVING THE SAME, AND METHOD OF CONTROLLING ZOOM LENS - A zoom switch assembly for an image photographing apparatus includes a fixing member which includes a flat unit, a rotating member which is mounted rotatably with respect to the fixing member, an electric conductivity unit which is mounted on the rotating member to rotate opposite the flat member, and a position detection pattern which is formed along a rotation trace of the electric conductivity unit on the flat unit of the fixing member, and through which electricity flows selectively according to a rotation angle of the electric conductivity unit. | 05-19-2011 |
20110272181 | Multilayer Stretchable Cable - According to an example embodiment, the multilayer stretchable cable includes a multilayer stretchable film and a plurality of conductive lines in the stretchable film. The conductive lines are in at least two different layers of the multilayer stretchable film in a thickness direction of the stretchable film, at least one conductive line is a signal line and at least one other conductive line in a layer adjacent to the signal line is a ground line. The signal line and the ground line are in zigzag patterns and are parallel to a width direction of the multilayer stretchable film. | 11-10-2011 |
20120018084 | Printed Circuit Board Assembly Manufacturing Device And Method - Disclosed herein is a printed circuit board assembly manufacturing device and method of manufacturing a printed circuit board assembly. The printed circuit board assembly manufacturing device may include a fusing unit configured to cure a conductive adhesive used to fix electronic components having different heights to a printed circuit board. The fusing unit may be configured to cure the conductive adhesive while simultaneously applying pressure to the electronic components having different heights. | 01-26-2012 |
20120018186 | CASE STRUCTURE HAVING FILM TYPE ELECTRONIC CIRCUIT AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a case structure of an electronic product to which a film-type electronic circuit is adhered. The case structure may include a case of an electronic product and a first film adhered to the case. The case structure may further include a second film adhered to the first film such that one surface of the second film contacts the first film, and an electronic circuit layer adhered to the first film. The electronic circuit layer may be arranged between the first film and the second film, wherein the first film is thermally adhered to the case. The first film may have a melting at a melting point that is lower than a heat-resistant temperature of the case. | 01-26-2012 |
20120043116 | Interconnection Structure Of Interposer With Low CTE And Packaging Component Having The Same - Disclosed herein are printed circuit board assemblies made of a brittle material such as silicon, glass or ceramic and provided with a connector to electrically connect the same to an external connection member, and a method for molding the printed circuit board assembly wherein the printed circuit board assembly is molded by applying a polymer resin thereto to impart hardness to the printed circuit board assembly, and an electrode terminal to connect the same to the external connection member is exposed to the outside. Disclosed herein is also an interconnection structure of an interposer, the interconnection structure electrically connected to a main printed circuit board (PCB) through a solder joint is interposed between the interposer and the solder joint to prevent or reduce concentration of stress on the solder joint caused by differences in coefficients thermal expansion between the interposer and the main PCB. | 02-23-2012 |
20120045910 | MOLDING METHOD OF PRINTED CIRCUIT BOARD ASSEMBLY - Disclosed is a printed circuit board assembly PBA on which a connector for electrical connection to an external connection element is mounted. Such an assembly may be formed with a molding method of a PBA which includes applying a polymer resin to the PBA to mold the PBA in order to offer stiffness thereto. The foregoing method of molding the PBA according to the present disclosure is a molding method of a PBA including a PCB and a connector mounted on the PCB to electrically connect the same to an external connection element. The method includes combining the connector with a connector cover, applying a resin to the PBA combined with the connector cover to execute molding of the PBA, and separating the connector cover from the molded PBA to expose the electrode terminal for an external connection element. | 02-23-2012 |
20120122324 | CIRCUIT CONNECTION ASSEMBLY - A circuit connection structure is disclosed. A disclosed example circuit connection structure includes circuit board including a plurality of connection terminals; a housing for supporting the circuit board; and a circuit supporting unit including a plurality of circuit patterns on a surface thereof, formed of an electrical insulating material, and coupled to the housing so that the circuit patterns contact the connection terminals. | 05-17-2012 |
20120212917 | Three-Dimensional Stack Structure Of Wafer Chip Using Interposer - The three-dimensional stack structure includes a printed circuit board, a first wafer chip mounted on the printed circuit board, a second wafer chip stacked above the first wafer chip, and first interposers interposed between the second wafer chip and the printed circuit board. The first interposers are configured to electrically connect the second wafer chip to the printed circuit board. | 08-23-2012 |
20130077265 | PRINTED CIRCUIT BOARD ASSEMBLY - A printed circuit board assembly capable of having an electronic component mounted at a wafer level by using a wafer itself as a printed circuit board, the printed circuit board assembly including a plurality of electronic components, a printed circuit board having the plurality of electronic components mounted thereon, a protection body configured to entirely cover the printed circuit board, and a connection unit having one end that is exposed to an outside of the protection body for the printed circuit board to be electrically connected to a sub board, wherein the printed circuit board comprises a wafer printed circuit board formed with a wafer. | 03-28-2013 |
20130213247 | STENCIL APPARATUS FOR PRINTING SOLDER PASTE - A solder paste printing stencil apparatus for printing a solder paste on a printed circuit board includes a plate-shaped stencil mask made of fine stainless steel grains to suppress a phenomenon in which the solder paste adheres to the stencil mask. | 08-22-2013 |