Patent application number | Description | Published |
20080273351 | Light Source Device and Vehicle Lighting Device - An LED light source device and an illumination device using the same, including vehicle lighting devices, can have a light weight and thin profile and can form a desired light distribution pattern while employing a simple configuration. The light source device can include a plate shaped light guide member made of a material that is transparent in a visible range. The light guide member can have a front surface serving as a light emitting surface and having a plate shape, and a rear surface having a luminance control element for controlling a luminance distribution on the light emitting surface. A point or linear light source facing towards an end surface of the light guide member can be provided. The luminance control element controls light reaching the element from the end surface of the light guide member and configures the luminance distribution on the light emitting surface, the luminance distribution being obtained by reducing a light distribution pattern to be projected (and in some cases horizontally and vertically reversing the pattern). | 11-06-2008 |
20080291689 | LIGHT SOURCE DEVICE AND VEHICLE LIGHTING DEVICE - An LED light source device can have a simple configuration which can easily create a desired light distribution pattern with a low profile and light weight. An illumination apparatus and a vehicle lighting device can also be configured to use the LED light source device. The light source device can include a light guide plate made of a flat plate-like material that is transparent in the visible range, and which has a front surface serving as a light emission surface. A point light source can be opposed to an end surface of the light guide plate. A rear surface of the light guide plate can include a luminance control element configured to control a luminance distribution on the light emission surface. The luminance control element controls light from the light source, incident through the end surface of the light guide plate, so that a reduced inversion of a light distribution pattern that is to be emitted is formed on the light emission surface as the luminance distribution. The light guide plate can include a polarizing film for making the light emission surface emit p-polarized (parallel polarized) light. | 11-27-2008 |
20090147529 | VEHICLE LAMP - A vehicle lamp can include a light source unit including a light guide plate with a light emission surface, and a point or line light source opposed to one end face of the light guide plate. The light guide plate can be made of a transparent plate-like material. A convex projection lens can be configured to focus light emitted from the light source unit and project the light forward in a direction of light illumination. The light guide plate can have a prism array on a rear surface thereof extending with a serrated cross section from the one end face to the opposite end face of the light guide plate, and in a direction parallel with the end face. The prism array can include a plurality of prism surfaces, with each prism surface being obliquely formed so that when light enters the light guide plate from the light source side and impinges thereon, a substantial amount of the light can be totally reflected into small angles of incidence to the emission surface. The projection lens can be disposed such that a focus thereof on a light source unit side is located on the light emission surface of the light guide plate. | 06-11-2009 |
20090262547 | Vehicle Lamp - A vehicle lamp can create a desired distribution pattern easily with a simple configuration while having a thin body and light weight. The vehicle lamp can include a light source unit and a convex projection lens configured to project light from the light source unit forward in the direction of light illumination. The light source unit can include a light guide plate having a light emission surface and made of a transparent material to the visible light range and can include a light source disposed in front of one end face of the light guide plate. The projection lens can have a focus arranged on or near the light emission surface of the light guide plate. The light source unit can include a reflection sheet configured to reflect light from the light guide plate back into the light guide plate and can have a shape configured to provide a cutoff pattern. The reflection sheet can be located adjacent an edge of the light guide plate adjacent the light source. A high beam light source unit can be disposed adjacent or on the reflection sheet closer to the projection lens. | 10-22-2009 |
20100079702 | SURFACE LIGHT SOURCE DEVICE AND LCD UNIT - The disclosed subject matter includes providing a surface light source device using a plurality of different color light-emitting chips that can emit light with uniform color and a LCD unit having the same qualities. The surface light source device can include a light guide having a light incoming surface and a light-emitting surface, and light sources including the light-emitting chips located adjacent the light incoming surfaces. The light-emitting surface can include a light-mixing area that is spaced a distance L away from the light incoming surface, and the widest interval between the adjacent light-emitting chips is configured to be L/27 or less. Light emitted from the light sources can generate a mixture light with very little color variability in the light-mixing area, and the light can be emitted from the light-emitting surface other than the light-mixing area. Therefore, the LCD unit that includes a LCD located toward the light guide can illuminate the display with uniform color light. | 04-01-2010 |
Patent application number | Description | Published |
20090041563 | Wafer Transferring Apparatus, Polishing Apparatus, and Wafer Receiving Method - A wafer transferring apparatus includes a top ring ( | 02-12-2009 |
20090067959 | Substrate processing apparatus, substrate transfer apparatus, substrate clamp apparatus, and chemical liquid treatment apparatus - The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections ( | 03-12-2009 |
20090247057 | Polishing platen and polishing apparatus - The present invention provides a polishing platen which does not require a large force for removing a polishing pad from an upper surface of the polishing platen and can thus make it relatively easy to remove the polishing pad therefrom. The present invention also provides a polishing apparatus having such polishing platen. The polishing platen ( | 10-01-2009 |
20110159782 | SUBSTRATE POLISHING APPARATUS, SUBSTRATE POLISHING METHOD, AND APPARATUS FOR REGULATING TEMPERATURE OF POLISHING SURFACE OF POLISHING PAD USED IN POLISHING APPARATUS - An apparatus for polishing a substrate is provided. The apparatus includes: a rotatable polishing table supporting a polishing pad; a substrate holder configured to hold a substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate; a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad; a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface; and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector. | 06-30-2011 |
20120193506 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE TRANSFER APPARATUS, SUBSTRATE CLAMP APPARATUS, AND CHEMICAL LIQUID TREATMENT APPARATUS - The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections each for polishing a semiconductor wafer (W), and a swing transporter for transferring the wafer (W). The swing transporter includes a wafer clamp mechanism adapted to clamp the wafer (W), a vertically moving mechanism for vertically moving the wafer clamp mechanism along a frame of a casing of the polishing section, and a swing mechanism for swinging the wafer clamp mechanism about a shaft adjacent to the frame. | 08-02-2012 |
20120220196 | POLISHING APPARATUS HAVING TEMPERATURE REGULATOR FOR POLISHING PAD - A substrate polishing apparatus includes: a polishing table supporting a polishing pad; a top ring configured to press the substrate against the polishing pad; and a pad temperature regulator configured to regulate a surface temperature of the polishing pad. The pad temperature regulator includes a pad contact element and a liquid supply system configured to supply a temperature-controlled liquid to the pad contact element. The pad contact element has a space therein and a partition that divide the space into a first liquid passage and a second liquid passage that are connected in series. At least one baffle substantially perpendicular to a radial direction of the polishing table is provided in each of the first liquid passage and the second liquid passage. | 08-30-2012 |
20130210324 | POLISHING APPARATUS - The present invention relates to a polishing apparatus for polishing an object to be polished (substrate) such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table configured to support a polishing pad, a polishing head having a top ring configured to press an object to be polished against the polishing pad while the object to be polished is rotated, and a dresser head having a dresser configured to dress the polishing pad. The polishing apparatus has a head cover having a purge gas introducing unit configured to introduce a purge gas into the head cover and an exhausting unit configured to exhaust the interior of the head cover. The pressure in the head cover is set to a pressure level slightly higher than the pressure outside the head cover, and main components of the polishing head are housed in the head cover. | 08-15-2013 |
20130240000 | GAS-LIQUID SEPARATOR AND POLISHING APPARATUS - A gas-liquid separator separates gas-liquid two-phase flow into a gas and a liquid. The gas-liquid separator includes: a container having a bottom and a side portion, the bottom having a liquid discharge outlet and the side portion having a gas discharge outlet; a gas-liquid introduction pipe for introducing a gas-liquid two-phase flow into the container, the gas-liquid introduction pipe extending downward from above the container and having a lower end located in an interior of the container, the gas discharge outlet of the container being located above the lower end of the gas-liquid introduction pipe; and a guide device disposed in the gas-liquid introduction pipe and configured so as to impart a swirling motion to the gas-liquid two-phase flow in the gas-liquid introduction pipe. | 09-19-2013 |
20140030048 | WORKPIECE TRANSPORT DEVICE - A workpiece transport device for transporting a workpiece having a substrate layer and a layer to be processed on a portion of the substrate layer is provided. This workpiece transport device has a workpiece holding mechanism arranged to operate so as to hold and release the workpiece. The workpiece holding mechanism has at least one tapered workpiece holding surface on which the substrate layer of the workpiece is held in a state where the layer to be processed is positioned below the substrate layer. The tapered workpiece holding surface is formed so that a clearance equal to or larger than a predetermined distance R exists between the workpiece holding surface and the layer to be processed of the workpiece when the workpiece is held by the workpiece holding mechanism. | 01-30-2014 |
20140080385 | POLISHING APPARATUS - A polishing apparatus is used for polishing and planarizing a surface of a substrate such as a semiconductor wafer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring configured to hold a substrate and press the substrate against the polishing surface. The top ring has an extendable and contractable connection sheet configured to cover a gap between a retainer ring guide fixed to a top ring body and a retainer ring guided by the retainer ring guide to move vertically. The polishing apparatus has a nozzle configured to eject a cleaning liquid in a horizontal direction toward the connection sheet and apply a flow of the cleaning liquid directly onto the connection sheet for cleaning the connection sheet. | 03-20-2014 |
20140162536 | POLISHING APPARATUS AND POLISHING METHOD - A polishing apparatus includes: a rotatable polishing table for supporting a polishing pad having a polishing surface; a top ring head having a top ring; a top ring head cover surrounding the top ring head; a dresser head having a dresser configured to dress the polishing surface; a dresser head cover surrounding the dresser head; a spray nozzle configured to spray a cleaning liquid onto an upper surface of the top ring and an outer surface of the top ring head cover when the top ring is in the substrate transfer position; and a spray nozzle configured to spray a cleaning liquid onto an outer surface of the dresser head cover when the dresser is in the retreated position. | 06-12-2014 |
20140213158 | POLISHING APPARATUS - A polishing apparatus is used for polishing a substrate such as a semiconductor. The polishing apparatus includes a polishing table configured to hold a polishing tool having a polishing surface, a polishing head having a top ring configured to press a substrate against the polishing surface, and a polishing head cover configured to cover the polishing head. The polishing apparatus further includes a first cleaning liquid supply mechanism configured to supply a cleaning liquid to an outer surface of the polishing head cover, and a second cleaning liquid supply mechanism configured to supply a cleaning liquid to an inner surface of the polishing head cover. | 07-31-2014 |
20140295737 | POLISHING APPARATUS AND WEAR DETECTION METHOD - There is provided a polishing apparatus capable of detecting uneven wear occurring on a polishing pad and detecting an appropriate replacement timing of the polishing pad. The polishing apparatus detects, every predetermined time, a value of rotation speed or a value of rotation torque of a table drive shaft for rotationally driving a polishing table or a dresser drive shaft for driving a dresser, or a value of swing torque of a dresser swing shaft for driving the dresser; calculates a change quantity thereof based on the value of the detected rotation speed, the value of the detected rotation torque, or the value of the detected swing torque; determines whether or not the change quantity exceeds a predetermined value; and notifies a user of a warning when a determination is made that the change quantity exceeds the predetermined value. | 10-02-2014 |
20140364040 | SUBSTRATE POLISHING APPARATUS, SUBSTRATE POLISHING METHOD, AND APPARATUS FOR REGULATING TEMPERATURE OF POLISHING SURFACE OF POLISHING PAD USED IN POLISHING APPARATUS - An apparatus for polishing a substrate includes a rotatable polishing table supporting a polishing pad, a substrate holder configured to hold the substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate, and a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad. The apparatus also includes a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface, and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector. | 12-11-2014 |
20150082613 | LIFTING DEVICE, SUBSTRATE PROCESSING APPARATUS HAVING LIFTING DEVICE, AND UNIT TRANSFERRING METHOD - [Problem] An object of the present invention is to facilitate height level adjustment of a substrate processing apparatus regardless of size thereof. | 03-26-2015 |
20150118944 | POLISHING APPARATUS, METHOD FOR ATTACHING POLISHING PAD, AND METHOD FOR REPLACING POLISHING PAD - The work of replacing a polishing pad is easily performed, and thermal damage is prevented from occurring in a polishing table. A polishing apparatus | 04-30-2015 |
20150273659 | SUBSTRATE POLISHING APPARATUS - To provide a substrate polishing apparatus capable of effectively trapping a harmful substance suspended in a polishing chamber. The substrate polishing apparatus includes a polishing portion ( | 10-01-2015 |
20150290769 | ROTARY JOINT AND POLISHING APPARATUS - The invention suppresses generation of noises attributable to rotation of a rotary joint. | 10-15-2015 |
20150314418 | SUBSTRATE POLISHING APPARATUS - A substrate polishing apparatus includes a polishing table 30 having a polishing surface 10 in the upper surface, a substrate holding portion 31 that holds a substrate W having a surface to be polished in the lower surface, and a holding portion cover 36 that covers the outer side of the substrate holding portion 31. Between the lower portion of the holding portion cover 36 and the upper surface of the polishing table 30, a gap portion for intake 37 is provided, and in the upper portion of the holding portion cover 36, a pipe for exhaust 39 connected to an exhaust mechanism 38 is provided. By operating the exhaust mechanism 38, a rising air current from the gap portion 37 toward the pipe 39 is formed between the outer surface of the substrate holding portion 31 and the inner surface of the holding portion cover 36. | 11-05-2015 |
20150364391 | POLISHING APPARATUS AND WEAR DETECTION METHOD - There is provided a polishing apparatus capable of detecting uneven wear occurring on a polishing pad and detecting an appropriate replacement timing of the polishing pad. The polishing apparatus detects, every predetermined time, a value of rotation speed or a value of rotation torque of a table drive shaft for rotationally driving a polishing table or a dresser drive shaft for driving a dresser, or a value of swing torque of a dresser swing shaft for driving the dresser; calculates a change quantity thereof based on the value of the detected rotation speed, the value of the detected rotation torque, or the value of the detected swing torque; determines whether or not the change quantity exceeds a predetermined value; and notifies a user of a warning when a determination is made that the change quantity exceeds the predetermined value. | 12-17-2015 |