Patent application number | Description | Published |
20140071434 | OPTICAL TOMOGRAPHIC IMAGE ACQUISITION APPARATUS - The optical tomographic image acquisition apparatus is based on FD-OCT. A detection unit | 03-13-2014 |
20140233030 | SPECTRAL IMAGING DEVICE ADJUSTMENT METHOD AND SPECTRAL IMAGING SYSTEM - A method of adjusting a spectroscopic imaging device is provided with which a relative arrangement relationship among components can be easily adjusted in the spectroscopic imaging device. A spectroscopic imaging device | 08-21-2014 |
20150077748 | SPECTROSCOPIC IMAGING DEVICE ADJUSTING METHOD AND SPECTROSCOPIC IMAGING SYSTEM - A spectroscopic imaging device adjusting method adjusts a relative arrangement relationship among a collimating lens, a diffraction grating, a condensing lens and an array type light receiving part so as to maximize the value of the following expression (1) for an output values ƒ | 03-19-2015 |
20150077757 | OPTICAL TOMOGRAPHIC IMAGE ACQUIRING DEVICE - An optical tomographic image acquiring device which can suppress the occurrence of an artifact, and which can obtain an exact optical tomographic image of a measurement object includes a light source, a detector, an analysis unit, a circulator, a coupler, condensing lenses, optical fibers, and a reference mirror. Let Δk be a maximum value of intervals in wavenumber of lights received by adjacent two light receiving elements in the detector, an optical path length L | 03-19-2015 |
20150173607 | METHOD FOR ACQUIRING OPTICAL TOMOGRAPHIC IMAGE - A method for acquiring an optical tomographic image is disclosed. The method acquires the optical tomographic image based on a result of a Fourier transform of an interference light spectrum obtained by dividing light into first branched light and second branched light and causing mutual interference between reflected light and diffused reflected light. The reflected light arises at a reflecting body when the first branched light is irradiated onto the reflecting body. The diffused reflected light arises when the second branched light is irradiated onto an examination region. The acquisition method includes: acquiring a first optical tomographic image when an examination object is arranged in the examination region; acquiring a second optical tomographic image when the examination object is not arranged in the examination region; and acquiring the optical tomographic image based on a difference between the first optical tomographic image and the second optical tomographic image. | 06-25-2015 |
20160091707 | MICROSCOPE SYSTEM FOR SURGERY - From a first image indicating an intensity distribution of radiation from a subject | 03-31-2016 |
Patent application number | Description | Published |
20090275059 | Marker proteins for diagnosing liver disease and method of diagnosing liver disease using the same - Using the protein chip technology, biological samples such as sera are subjected to proteome analysis. Thus, a protein which is a human fibrinogen α-E chain decomposition product and has a molecular weight of 5,900, a protein which is an apolipoprotein AII decomposition product and has a molecular weight of 7,800, and a protein which is an apolipoprotein AI decomposition product and has a molecular weight of 28,000, each showing an increase or a decrease with the habit of drinking, are newly found out. By detecting or quantifying these proteins, a liver disease in a subject such as one having a problem of drinking can be diagnosed at the early stage. | 11-05-2009 |
20110108722 | Novel Biomarkers Of Biliary Tract Cancer - A method of detecting an abnormal amount of a biomarker associated with biliary tract cancer in a subject can comprise: a) quantitating an amount of a fragment of prothrombin having an m/z value of about 4204 m/z in a biological sample from the subject; and b) comparing the quantitated value obtained in (a) with a threshold value. | 05-12-2011 |
20120276562 | 5.9 kDa PEPTIDE IMMUNOASSAY METHOD - Disclosed is an immunoassay method whereby a 5.9 kDa peptide which results from the degradation of the α-E chain and α chain of human fibrinogens and which is used as a peptide marker for diagnosing hepatic disease can be specifically assayed in a biological sample containing contaminating peptides by bringing antibodies that recognize the N terminal of said peptide marker and antibodies that recognize the C terminal of said peptide marker into contact with said peptide marker, forming immune complexes of said peptide marker and the two antibodies, and immunoassaying the obtained immune complexes. | 11-01-2012 |
20120282638 | METHOD FOR IMMUNOASSAY OF AUTOANTIBODY AGAINST KU86, KIT FOR USE IN SAME, AND METHOD FOR DETERMINATION OF PRIMARY HEPATOCELLULAR CARCINOMA USING SAME - An autoantibody against Ku86 can be measured by reacting the autoantibody contained in a sample with a Ku86 antigen (which serves as a reagent) to produce an immune complex of the autoantibody and the Ku86 antigen and measuring the immune complex using a labeled anti-human immunoglobulin antibody. The measurement of the autoantibody enables the determination of primary hepatocellular carcinoma. | 11-08-2012 |
20120309034 | METHOD FOR MEASURING IMMUNITY OF COMPLEX OF Ku86 AND AUTOANTIBODY THEREOF, KIT USED THEREFOR, AND METHOD FOR DETERMINING CANCER USING SAME - A reaginic antibody of Ku86 and a substance capable of binding with the autoantibody of Ku86 are acted on a complex of Ku86 and the autoantibody thereof in a subject. Said complex can be measured by measuring the obtained immune complex of the aforementioned complex, reaginic antibody, and substance capable of binding with the autoantibody of Ku86. As a consequence, it is possible to determine whether the cancer is a primary hepatoma, colon cancer, stomach cancer, pancreatic cancer, breast cancer, lung cancer, or an esophageal cancer. | 12-06-2012 |
20150104816 | MARKER FOR DETECTING PANCREATIC CANCER - A marker for detecting pancreatic cancer, said marker comprising a glycoprotein C4BPA or PIGR, whereby a pancreatic cancer patient can be distinguished from a chronic pancreatitis patient or a normal subject and thus specifically diagnosed. Also, the marker is usable in monitoring the postoperative prognosis of a pancreatic cancer patient. When the aforesaid marker is used in combination with another pancreatic cancer marker such as CA19-9, furthermore, a pancreatic cancer patient can be distinguished from a chronic pancreatitis patient or a normal subject and diagnosed more specifically. | 04-16-2015 |
Patent application number | Description | Published |
20080224271 | Semiconductor Device and Method of Manufacturing Same, Wiring Board and Method of Manufacturing Same, Semiconductor Package, and Electronic Device - Passivation films | 09-18-2008 |
20090065921 | Electronic Package Device, Module, and Electronic Apparatus - There is provided an electronic device package and the like in which it is not likely that damage occurs in a wiring pattern of an interposer substrate in a gap section formed, for example, between an electronic device and an insertion substrate. The semiconductor package in accordance with the present invention is a package of fan-out type including an interposer substrate | 03-12-2009 |
20090140146 | VACUUM PACKAGE AND MANUFACTURING PROCESS THEREOF - A vacuum package has a chamber in which pressure is reduced to less than the atmospheric pressure, a functional component sealed in the chamber, and a material forming at least a part of the chamber. The material has at least one through hole to evacuate the chamber. In a cross section perpendicular to the material taken along the through hole, an edge portion of the material forming the through hole has an obtuse angle. The through hole is sealed with a sealing material. | 06-04-2009 |
20090174052 | ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE - In a conventional UBM made of, for example, Cu, Ni, or NiP, there has been a problem that when an electronic component is held in high-temperature conditions for an extended period, the barrier characteristic of the UBM is lost and the bonding strength decreases due to formation of a brittle alloy layer at a bonding interface. The present invention improves the problem of decrease in long-term connection reliability of a solder connection portion after storage at high temperatures. An electronic component comprises the electronic component includes an electrode pad formed on a substrate or a semiconductor element and a barrier metal layer formed to cover the electrode pad and the barrier metal layer comprises a CuNi alloy layer on the side opposite the side in contact with the electrode pad, the CuNi alloy layer containing 15 to 60 at % of Cu and 40 to 85 at % of Ni. | 07-09-2009 |
20100246144 | ELECTRONIC DEVICE PACKAGE, MODULE, AND ELECTRONIC DEVICE - The present invention is directed to provide a semiconductor package and the like realizing reduced manufacturing cost and improved reliability by enhancing a ground line and/or a power supply line. A semiconductor package | 09-30-2010 |
20110114840 | ENCAPSULATING PACKAGE, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ENCAPSULATING PACKAGE - The present invention is: a package main body section having a hollow section; and an electronic device provided in the hollow section in the package main body section, in the package main body section, there being formed a through hole, through which the hollow section communicates with outside of the package main body section, and in the through hole, there being provided a sealing section in which a vicinity of the through hole is partly heated and a constituent material of the package main body section is melted to thereby block the through hole. | 05-19-2011 |
20110304029 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, WIRING BOARD AND MANUFACTURING METHOD THEREOF, SEMICONDUCTOR PACKAGE, AND ELECTRONIC APPARATUS - A terminal pad is formed on an active surface of an LSI chip, and a composite barrier metal layer is provided over this terminal pad. In the composite barrier metal layer, a plurality of low-elasticity particles composed of a silicone resin is dispersed throughout a metal base phase composed of NiP. The composite barrier metal layer has a thickness of, e.g., 3 μm, and the low-elasticity particles have a diameter of, e.g., 1 μm. A semiconductor device is mounted on a wiring board by bonding a solder bump to the composite barrier metal layer. The low-elasticity particles are thereby allowed to deform according to the applied stress when the semiconductor device is bonded to the wiring board via the solder bump, whereby the stress can be absorbed. | 12-15-2011 |
20130234295 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME, WIRING BOARD AND METHOD OF MANUFACTURING SAME, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE - Passivation films | 09-12-2013 |
20130291380 | ENCAPSULATING PACKAGE, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ENCAPSULATING PACKAGE - The present invention is: a package main body section having a hollow section; and an electronic device provided in the hollow section in the package main body section, in the package main body section, there being formed a through hole, through which the hollow section communicates with outside of the package main body section, and in the through hole, there being provided a sealing section in which a vicinity of the through hole is partly heated and a constituent material of the package main body section is melted to thereby block the through hole. | 11-07-2013 |