Patent application number | Description | Published |
20130188169 | APPARATUS AND METHODS FOR DETERMINING COMMINGLING COMPATIBILITY OF FLUIDS FROM DIFFERENT FORMATION ZONES - An apparatus and a method including exposing a first fluid to a pre-filter, observing the first fluid, introducing a second fluid to the first fluid, exposing the first and second fluids to a filter, and observing the first and second fluids wherein the observing the first fluid and observing the first and second fluids comprise optical measurements and the first fluid comprises material from a subterranean formation. Some embodiments may compare the optical measurements of the first fluid and the first and second fluids and/or estimate the first fluid's likelihood of forming precipitants with other fluids and/or the first fluid's asphaltene content. An apparatus and method for characterizing a fluid property including a pre-filter in communication with a fluid from a formation, an optical sensor to observe the fluid from the pre-filter, a fluid combination device in communication with the fluid and a second fluid source, a filter in communication with the combination device, a second optical sensor to observe a third fluid from the filter, and a processor to compare data collected by the sensor and second sensor. | 07-25-2013 |
20130219997 | Systems and Methods of Determining Fluid Properties - Systems and methods of determining fluid properties are disclosed. An example apparatus to determine a saturation pressure of a fluid includes a housing having a detection chamber and a heater assembly partially positioned within the detection chamber to heat a fluid. The example apparatus also includes a sensor assembly to detect a property of the fluid and a processor to identify a saturation pressure of the fluid using the property of the fluid. | 08-29-2013 |
20140252250 | APPARATUS AND METHODS FOR THE CHARACTERIZATION OF THE DIELECTRIC RESPONSE OF FLUIDS - A method for characterizing the dielectric response of a fluid includes receiving the fluid into a portion of a flow line that is disposed proximate to a photonic bandgap (PBG) resonant cavity so that a dielectric permittivity of the fluid affects a frequency response of the resonant cavity. The method further includes providing electromagnetic waves to the resonant cavity and measuring a frequency response of the resonant cavity in the presence of the fluid in the flow line. The method further includes determining a property of a resonant mode of the resonant cavity using the frequency response and determining a property of the fluid using the property of the resonant mode. | 09-11-2014 |
20140268156 | METHOD AND SYSTEM FOR DETERMINING BUBBLE POINT PRESSURE - Method and systems for determining bubble point pressure of a fluid sample are described herein. The method includes transmitting light through the fluid sample and detecting transmitted light. The method also includes applying a series of thermal pulses to the fluid sample. The series of thermal pulses includes a time interval between each thermal pulse. The pressure of the fluid sample is varied and the bubble point pressure of the fluid sample is determined using an intensity of the transmitted light that corresponds to a time interval between the thermal pulses. | 09-18-2014 |
20150309002 | METHOD AND SYSTEM FOR DETERMINING ASPHALTENE ONSET PRESSURE USING A WAVELENGTH DEPENDENT SIGNAL - Methods and systems for determining asphaltene onset pressure of a formation fluid are disclosed herein. The method includes positioning a wellbore tool within a wellbore and drawing a formation fluid sample into the wellbore tool. The method further includes transmitting light through the sample and detecting light that is transmitted through the sample. The light is transmitted within the sample along a short path length of less than 2 mm. While the light is being transmitted, the pressure of the sample is varied. A wavelength dependent signal is determined using (i) the intensity of the transmitted light at a first wavelength and (ii) the intensity of the transmitted light at a second wavelength. The asphaltene onset pressure of the sample is determined by identifying a change in the wavelength dependent signal at a particular pressure. | 10-29-2015 |
20150309003 | METHOD AND SYSTEM FOR DETERMINING ASPHALTENE ONSET PRESSURE USING A USING DEPRESSURIZATION AND PRESSURIZATION - Methods and systems for determining for determining asphaltene onset pressure of a formation fluid are described herein. The method includes the following processes: (a) transmitting light through a sample of the formation fluid; (b) decreasing pressure of the sample; (c) detecting intensity of the transmitted light during depressurization; (d) identifying a change in intensity of the transmitted light during depressurization; (e) increasing pressure of the sample to a fixed pressure; and (f) detecting intensity of the transmitted light at the fixed pressure and at an equilibrated light intensity. Processes (a) to (f) are repeated for a number of different fixed pressures. The asphaltene onset pressure of the formation fluid sample can be determined using (i) the intensity of the transmitted light during each depressurization and (ii) the intensity of the transmitted light at each of the different fixed pressures. | 10-29-2015 |
20150354345 | Methods and Systems for Analyzing Flow - Methods and systems for determining the presence and/or rate of a flow of a fluid sample include transmitting light through the fluid sample are disclosed. The methods comprise, applying a series of thermal pulses to the fluid sample, the series comprises a time interval between each thermal pulse, detecting transmitted light using a light detector; and determining at least one of (a) whether or not the fluid is flowing and (b) a flow rate of the fluid, based on an intensity of the transmitted light corresponding to at least one time interval. | 12-10-2015 |
20160040533 | Pressure Volume Temperature System - A method and an apparatus for characterizing a fluid including a phase transition cell to receive the fluid, a piston to control fluid pressure, a pressure gauge to measure the fluid pressure and to provide information to control the piston, and connectors to connect the cell, piston, and gauge. The exterior volume of the phase transition cell, piston, gauge, and connectors is less than about 10 liters. A method and an apparatus to characterize a fluid including observing a fluid in an phase transition cell, measuring a pressure of the fluid, and adjusting a pressure control device in response to the measuring. | 02-11-2016 |
Patent application number | Description | Published |
20160062980 | Question Correction and Evaluation Mechanism for a Question Answering System - Mechanisms are provided in a question answering (QA) system comprising a QA system pipeline that analyzes an input question and generates an answer to the input question, for pre-processing the input question. The mechanisms receive an input question and input the input question to a pre-processor flow path having one or more pre-processors. The one or more pre-processors transform the input question into a transformed question by correcting errors in a formulation of the input question that are determined to be detrimental to efficient and accurate processing of the input question by a QA system pipeline of the QA system. The transformed question is then input to the QA system pipeline of the QA system which processes the transformed question to generate and output an answer to the input question. | 03-03-2016 |
20160098387 | Natural Language Processing Utilizing Propagation of Knowledge through Logical Parse Tree Structures - Mechanisms are provided for processing logical relationships in natural language content. A logical parse of a first parse of a natural language content is generated by identifying latent logical operators within the first parse indicative of logical relationships between elements of the natural language content. The logical parse comprises nodes and edges linking nodes. At least one knowledge value is associated with each node in the logical parse. The at least one knowledge value of at least a subset of the nodes in the logical parse is propagated to one or more other nodes in the logical parse based on propagation rules. A reasoning operation is performed on the logical parse to generate a knowledge output indicative of knowledge associated with one or more of the logical relationships between elements of the natural language content. | 04-07-2016 |
20160098389 | Natural Language Processing Utilizing Transaction Based Knowledge Representation - Mechanisms are provided for processing logical relationships in natural language content. A logical parse of a first parse of the natural language content is generated by identifying latent logical terms within the first parse indicative of logical relationships between elements of the natural language content. The logical parse comprises nodes and edges linking nodes. At least one knowledge value is associated with each node in the logical parse. The at least one knowledge value associated with at least a subset of the nodes in the logical parse is propagated to one or more other nodes in the logical parse based on propagation rules. The propagating of the at least one knowledge value generates transaction records in a transaction knowledgebase data structure. A reasoning operation is executed based on the transaction knowledgebase data structure. | 04-07-2016 |
20160098394 | Natural Language Processing Utilizing Logical Tree Structures - Mechanisms are provided for processing logical relationships in natural language content. Natural language content is received, upon which a reasoning operation is to be performed. A first parse representation of the natural language content is generated, by a parser, by performing natural language processing on the natural language content. A logical parse of the first parse is generated by identifying latent logical operators within the first parse indicative of logical relationships between elements of the natural language content. A reasoning operation on the logical parse is executed to generate a knowledge output indicative of knowledge associated with one or more of the logical relationships between elements of the natural language content. | 04-07-2016 |
Patent application number | Description | Published |
20100013107 | INTERCONNECT STRUCTURES FOR INTEGRATION OF MULTI-LAYERED INTEGRATED CIRCUIT DEVICES AND METHODS FOR FORMING THE SAME - Semiconductor devices comprise at least one integrated circuit layer, at least one conductive trace and an insulative material adjacent at least a portion of the at least one conductive trace. At least one interconnect structure extends through a portion of the at least one conductive trace and a portion of the insulative material, the at least one interconnect structure comprising a transverse cross-sectional dimension through the at least one conductive trace which differs from a transverse cross-sectional dimension through the insulative material. Methods of forming semiconductor devices comprising at least one interconnect structure are also disclosed. | 01-21-2010 |
20110195547 | METHODS FOR FORMING INTERCONNECT STRUCTURES FOR INTEGRATION OF MULTI LAYERED INTEGRATED CIRCUIT DEVICES - Semiconductor devices comprise at least one integrated circuit layer, at least one conductive trace and an insulative material adjacent at least a portion of the at least one conductive trace. At least one interconnect structure extends through a portion of the at least one conductive trace and a portion of the insulative material, the at least one interconnect structure comprising a transverse cross-sectional dimension through the at least one conductive trace which differs from a transverse cross-sectional dimension through the insulative material. Methods of forming semiconductor devices comprising at least one interconnect structure are also disclosed. | 08-11-2011 |
20140175653 | SEMICONDUCTOR DEVICES COMPRISING INTERCONNECT STRUCTURES AND METHODS OF FABRICATION - Semiconductor devices comprise at least one integrated circuit layer, at least one conductive trace and an insulative material adjacent at least a portion of the at least one conductive trace. At least one interconnect structure extends through a portion of the at least one conductive trace and a portion of the insulative material, the at least one interconnect structure comprising a transverse cross-sectional dimension through the at least one conductive trace which differs from a transverse cross-sectional dimension through the insulative material. | 06-26-2014 |
20150311437 | METHODS OF FORMING A MEMORY CELL MATERIAL, AND RELATED METHODS OF FORMING A SEMICONDUCTOR DEVICE STRUCTURE, MEMORY CELL MATERIALS, AND SEMICONDUCTOR DEVICE STRUCTURES - A method of forming a memory cell material comprises forming a first portion of a dielectric material over a substrate by atomic layer deposition. Discrete conductive particles are formed on the first portion of the dielectric material by atomic layer deposition. A second portion of the dielectric material is formed on and between the discrete conductive particles by atomic layer deposition. A memory cell material, a method of forming a semiconductor device structure, and a semiconductor device structure are also described. | 10-29-2015 |
20150357284 | SEMICONDUCTOR DEVICES COMPRISING INTERCONNECT STRUCTURES AND METHODS OF FABRICATION - Semiconductor devices comprise at least one integrated circuit layer, at least one conductive trace and an insulative material adjacent at least a portion of the at least one conductive trace. At least one interconnect structure extends through a portion of the at least one conductive trace and a portion of the insulative material, the at least one interconnect structure comprising a transverse cross-sectional dimension through the at least one conductive trace which differs from a transverse cross-sectional dimension through the insulative material. | 12-10-2015 |
Patent application number | Description | Published |
20100319744 | THERMOELECTRIC MODULES AND RELATED METHODS - An example method for making thermoelectric modules generally includes coupling a first wafer and a second wafer together, processing the first and second wafers to produce a first thermoelectric element and a second thermoelectric element where the first thermoelectric element and the second thermoelectric element are coupled together, coupling the first thermoelectric element to a first conductor, coupling the second thermoelectric element to a second conductor, separating the first thermoelectric element and the second thermoelectric element, coupling the first thermoelectric element to a third conductor whereby the first thermoelectric element, the first conductor, and the third conductor form at least part of a thermoelectric module, and coupling the second thermoelectric element to a fourth conductor whereby the second thermoelectric element, the second conductor, and the fourth conductor form at least part of another thermoelectric module. | 12-23-2010 |
20100321895 | MEMORY MODULES INCLUDING COMPLIANT MULTILAYERED THERMALLY-CONDUCTIVE INTERFACE ASSEMBLIES - According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may generally include a flexible heat-spreading material having first and second sides and one or more perforations extending through the flexible heat-spreading material from the first side to the second side. The flexible heat-spreading material may be sandwiched between first and second layers of soft thermal interface material. A portion of the soft thermal interface material may be disposed within the one or more perforations. The thermally-conductive interface assembly may be positioned relative to one or more components of a memory module to provide a thermally-conductive heat path from the one or more components to the first layer of soft thermal interface material. | 12-23-2010 |
20100321897 | COMPLIANT MULTILAYERED THERMALLY-CONDUCTIVE INTERFACE ASSEMBLIES - According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies. In exemplary embodiments, thermal interface material is disposed on or along one side of a flexible thermally-conductive sheet. In other embodiments, a flexible thermally-conductive sheet is bonded to, encapsulated within, or sandwiched between first and second layers of a thermal interface material. The flexible thermally-conductive sheet may be a flexible perforated graphite sheet. The thermal interface material may be thermally-conductive polymer. The perforations in the graphite sheet may enable a polymer-to-polymer bond to form that may help mechanically bond the first and second layers to the graphite sheet and/or may help provide heat conduction between the first and second layers. | 12-23-2010 |
20110000516 | FLEXIBLE ASSEMBLIES WITH INTEGRATED THERMOELECTRIC MODULES SUITABLE FOR USE IN EXTRACTING POWER FROM OR DISSIPATING HEAT FROM FLUID CONDUITS - In one exemplary embodiment, an assembly includes one or more thermoelectric modules, a compliant thermal interface, and a heat spreader. The compliant thermal interface is configured such that it may substantially conform against and intimately thermally contact an outer surface of a fluid conduit. The heat spreader is disposed generally between and thermally coupled to the compliant thermal interface and the one or more thermoelectric modules. The heat spreader may have greater flexibility than the one or more thermoelectric modules. The heat spreader may also have a thermal conductivity greater than the compliant thermal interface. The assembly may have sufficient flexibility to be circumferentially wrapped at least partially around a portion of the fluid conduit's outer surface, with the compliant thermal interface in substantial conformance against and in intimate thermal contact with the fluid conduit's outer surface portion. Accordingly, a thermally-conducting heat path may thus be established from the fluid conduit to the one or more thermoelectric modules via the compliant thermal interface and the heat spreader. | 01-06-2011 |
20110030754 | THERMOELECTRIC MODULES AND RELATED METHODS - An example thermoelectric module of the present disclosure generally includes a first laminate having a dielectric layer and an electrically conductive layer coupled to the dielectric layer, a second laminate having a dielectric layer and an electrically conductive layer coupled to the dielectric layer, and thermoelectric elements disposed generally between the first and second laminates. At least one of the dielectric layers is a polymeric dielectric layer. The electrically conductive layer of the first laminate is at least partially removed to form electrically conductive pads on the first laminate. The electrically conductive layer of the second laminate is at least partially removed to form electrically conductive pads on the second laminate. The thermoelectric elements are coupled to the electrically conductive pads of the first and second laminates for electrically coupling the thermoelectric elements together. | 02-10-2011 |
20120061135 | COMPLIANT MULTILAYERED THERMALLY-CONDUCTIVE INTERFACE ASSEMBLIES HAVING EMI SHIELDING PROPERTIES - According to various aspects of the present disclosure, exemplary embodiments are disclosed of EMI shielding, thermally-conductive interface assemblies. In various exemplary embodiments, an EMI shielding, thermally-conductive interface assembly includes a thermal interface material and a sheet of shielding material, such as an electrically-conductive fabric, mesh, foil, etc. The sheet of shielding material may be embedded within the thermal interface material and/or be sandwiched between first and second layers of thermal interface material. | 03-15-2012 |
20120087094 | Memory Modules Including Compliant Multilayered Thermally-Conductive Interface Assemblies - According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may generally include a flexible heat-spreading material having first and second sides and one or more perforations extending through the flexible heat-spreading material from the first side to the second side. The flexible heat-spreading material may be sandwiched between first and second layers of soft thermal interface material. A portion of the soft thermal interface material may be disposed within the one or more perforations. The thermally-conductive interface assembly may be positioned relative to one or more components of a memory module to provide a thermally-conductive heat path from the one or more components to the first layer of soft thermal interface material. | 04-12-2012 |
20120201008 | CIRCUIT ASSEMBLIES INCLUDING THERMOELECTRIC MODULES - A circuit assembly generally includes a circuit board and at least one electrical pathway configured to couple a thermoelectric module to the circuit board for use as a heat pump in the circuit assembly. The circuit board and the at least one electrical pathway form part of the thermoelectric module when the thermoelectric module is coupled to the circuit board via the at least one electrical pathway. The thermoelectric module, including the portion of the circuit board forming part of the thermoelectric module, defines a footprint that is smaller than a footprint of the circuit board. As such, the circuit board is capable of supporting electrical components on the circuit board in a position outside the footprint defined by the thermoelectric module. | 08-09-2012 |
20140150839 | CIRCUIT ASSEMBLIES INCLUDING THERMOELECTRIC MODULES - A circuit assembly generally includes a circuit board and at least one electrical pathway configured to couple a thermoelectric module to the circuit board. The circuit board and the at least one electrical pathway form part of the thermoelectric module when the thermoelectric module is coupled to the circuit board via the at least one electrical pathway. The thermoelectric module, including the portion of the circuit board forming part of the thermoelectric module, defines a footprint that is smaller than a footprint of the circuit board. As such, the circuit board is capable of supporting electrical components on the circuit board in a position outside the footprint defined by the thermoelectric module. | 06-05-2014 |
20140374080 | COMPLIANT MULTILAYERED THERMALLY-CONDUCTIVE INTERFACE ASSEMBLIES - According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may generally include a flexible heat-spreading material having first and second sides and one or more perforations extending through the flexible heat-spreading material from the first side to the second side. The flexible heat-spreading material may be sandwiched between first and second layers of soft thermal interface material. A portion of the soft thermal interface material may be disposed within the one or more perforations. The thermally-conductive interface assembly may be positioned relative to one or more components of a memory module to provide a thermally-conductive heat path from the one or more components to the first layer of soft thermal interface material. | 12-25-2014 |
Patent application number | Description | Published |
20080196340 | Arch drywall trim product - A notched drywall trim piece that can take the form of a bead, hinged trim piece or bullnose piece that generally is constructed from a semi-rigid core that forms two flanges. At least one of the flanges is notched allowing the piece to follow the shape of an arch or arbitrarily curved corner. The product can generally be installed without any mechanical fasteners since the inner or wall-facing surface of the product is prepared or treated to bond directly with drywall mud or other mastic. In this manner, the piece can be installed using only wet mud or other mastic. The installation process can be aided by the used of a corner roller common in the industry to help set and align the material with the corner being trimmed. The outer or room-facing surface can optionally be treated or prepared to bond with the mud or can be prepared to directly receive paint or texture. The preparation of the flange surface can take the form of a paper or other fibrous layer, scoring, frocking (bonding a powered fibrous material), roughing, protrusions, or a water-activated adhesive or pressure sensitive (or any other) adhesive may be used. | 08-21-2008 |
20090255635 | Powered drywall trim cutter - A power cutter tool for applying drywall tape or trim that contains a powered blade that can cut the tape or trim material by simply pressing a trigger. The cutter can be powered by a spring or springs, a motor, hydraulically or by any other means. The trigger can be a button, lever, valve or any other means for releasing a powered blade. | 10-15-2009 |
20100218444 | Expandable Drywall Corner Piece - A drywall corner piece with flange surfaces forming a near right angle forming a cup for fitting over drywall corners where the web sections of the flanges have at least one strain relief channel allowing the piece to flex to different angles. | 09-02-2010 |
20100218445 | Boxable Mesh Adhesive Drywall Corner Trim - A boxable drywall corner trim including an elongated semi-rigid member that forms a pair of flanges joined at a grooved hinge along a centerline. Each of the flanges can have a thinner part and a thicker part joined at a step that is approximately parallel to the centerline a predetermined distance from the centerline. The thicker part of the flanges can form a protruding nose member that makes the piece boxable by preventing the cross-over of wet drywall mastic or mud from one flange to the other. The thinner portion of the flange may optionally be perforated with a pattern of punched holes of any configuration throughout the flange assembly. The piece can have a wall-facing paper or other fibrous layer of material that has a tacky adhesive on its wall-facing side. The adhesive can be in a pattern of dots, ridges, lines or any other pattern, or the adhesive can be continuously coated on the surface. A layer of mesh can be trapped between the semi-rigid member and the outer paper layer, the mesh may or may not optionally penetrate into the plastic or other material of the semi-rigid member. When the entire piece is hot extruded, the mesh normally penetrates the plastic. | 09-02-2010 |
20100242386 | Drywall Edge Clip - A drywall or sheet rock edge clip device that can hold joints of drywall together at the apex of vaulted ceilings or at any other drywall seam at any angle. The device can include tabs and a head or cross member coupled by a stem that fits through the seam or joint and pulls and holds it together. A wire-tie version of the invention can have serrations along the stem and pull up and tighten like a wire-tie. The unused tail section can be broken off by bending it from side to side. | 09-30-2010 |
20110297078 | Drywall Mud Hopper for Inside and Outside Corners - A drywall hopper assembly that contains a double blade that can apply drywall mud to both interior and exterior drywall corners with no blade change. A zigzag blade can contain two grooves, one for interior corners and one for exterior corners. With this blade arrangement, an operator can quickly move from one type of corner to another without using multiple tools, multiple blades or hand application methods to apply mud. The present invention can contain a pliable release port to present mud equally to an interior or an exterior corner. There can be such a port on both the top and bottom of the blade so that mud is smoothly applied as trim moves through the hopper or the hopper is moved along the trim. | 12-08-2011 |
20120324739 | Powered Drywall Tape Cutter - A power cutter tool for applying drywall tape or plastic drywall trim product that contains a powered blade that can cut the tape or trim material by simply pressing a trigger. The cutter can be powered by a spring or springs, a motor, hydraulically or by any other means. The trigger can be a button, lever, valve or any other means for releasing a powered blade. | 12-27-2012 |
20150202785 | Powered Drywall Trim Cutter - A powered cutter for cutting drywall tape or plastic drywall trim. The cutter can contain a blade, a means to move the blade through the material or move the material over the blade, a source of power to create the movement, a means for the user to release the power initiating the movement to create the cut. The cutter can be powered by springs, a motor, hydraulics, or by any other means. The preferred embodiment is a spring-powered cutter where the spring is cocked with a lever and released with a trigger. The spring causes a mass to rotate that carries enough angular momentum to cause the blade to cut through the drywall trim material. If the spring is of sufficient power a mass may not be needed. | 07-23-2015 |
20150300032 | Drywall trim autofolder, mastic applicator and cutter - A drywall trim application device that can hold a large role of drywall flex corner trim material and, as the material is being dispensed, pre-crease or form the material for use on an inside or outside corner, or any angle within the range of the trim material, apply a mastic material (drywall mud, adhesive or any other bonding medium) to the flex trim material, and cut the material at any desired length automatically. Measurements may be either input by hand or downloaded from an electronic measurement tool into this device. This invention can generally store multiple measurements such as length and angles, measure the length of flex trim material as it is dispensed from the device, crease the material, apply predetermined amount of mastic, and automatically cut the flex trim material to each length previously input. | 10-22-2015 |
Patent application number | Description | Published |
20090069223 | Method for treatment of vascular hyperpermeability - A method for the treatment of apoptotic-induced vascular hyperpermeability is disclosed herein. Administration of various compounds including intrinsic mitochondrial regulatory proteins, certain pharmaceuticals, antioxidants and endothelial growth factors alone or in combination results in elevating the threshold for apoptosis in patients with hemorrhagic shock. Elevating the threshold for apoptosis in patients with hemorrhagic shock decreases the amount of vascular hyperpermeability exhibited by the injured patient. Decreasing the amount of vascular hyperpermeability in a traumatized patient facilitates resuscitation and recovery from trauma and decreases the mortality and morbidity rate in injured patients. | 03-12-2009 |
20100189802 | Method for treatment of vascular hyperpermeability - A method comprising preparing a vascular hyperpermeability treatment composition comprising an apoptosis regulating protein, a antioxidant, a mitochondrial modulator, a biological effector molecule, or combinations thereof in a form deliverable to a mammal; whereby an effective amount of the composition raises the threshold for apoptosis and/or prevents or lessens the occurrence of vascular hyperpermeability. A method comprising preventing hyperpermeability associated with hemorrhagic shock via preparing a composition in a form deliverable to a mammal, the composition comprising an apoptosis regulating protein, a antioxidant, a mitochondrial modulator, a biological effector molecule, or combinations thereof; and raising the threshold for apoptosis in a mammal's endothelial cells by administering an effective amount of said antioxidant; whereby said raising the threshold for apoptosis prevents said hyperpermeability. | 07-29-2010 |
20110229499 | METHOD FOR TREATMENT OF VASCULAR HYPERPERMEABILITY - A method for treating or preventing hemorrhagic shock comprising administering a composition comprising stem cells or a soluble factor produced by stem cells, such as stem cell factor (SCF) to a subject. For example, stem cells for use according to the invention can express elevated levels of an anti-apoptotic protein. | 09-22-2011 |