Patent application number | Description | Published |
20130038368 | SEMICONDUCTOR DEVICE - A semiconductor device including a common delay circuit configured to delay an input signal in response to a delay control code to output a first delayed input signal and a second delayed input signal; a first delay circuit configured to delay the first delayed input signal in response to the delay control code and to output a first output signal; and a second delay circuit configured to delay the second delayed input signal in response to the delay control code and to output a second output signal. | 02-14-2013 |
20130039143 | SEMICONDUCTOR MEMORY DEVICE, SEMICONDUCTOR SYSTEM INCLUDING THE SEMICONDUCTOR MEMORY DEVICE, AND METHOD FOR OPERATING THE SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a first data input/output unit configured to receive a normal training data, whose data window is scanned based on an edge of a source clock, in response to a training input command, and output a data in a state where an edge of the data window is synchronized with the edge of the source clock in response to a training output command, and a second data input/output unit configured to receive a recovery information training data, whose data window is scanned based on the edge of the source clock, in response to the training input command, and output a data in a state where an edge of a data window is synchronized with the edge of the source clock in response to the training output command. | 02-14-2013 |
20130076401 | INPUT BUFFER CIRCUIT OF SEMICONDUCTOR APPARATUS - The input buffer circuit of a semiconductor apparatus includes a first buffering unit that that is activated by a voltage level difference between a first voltage terminal and a second voltage terminal, and generates a first compare signal and a second compare signal by comparing the voltage levels of reference voltage and an input signal; a control unit that controls the amount of current flowing between the second voltage terminal and a ground terminal by comparing the voltage levels of the reference voltage and the second compare signal; and a second buffering unit that generates an output signal by comparing the voltage levels of the input signal and the first compare signal. | 03-28-2013 |
20130078807 | WAFER LEVEL CHIP SCALE PACKAGE HAVING AN ENHANCED HEAT EXCHANGE EFFICIENCY WITH AN EMF SHIELD AND A METHOD FOR FABRICATING THE SAME - A wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield is presented. The wafer level chip scale package includes a semiconductor chip, an insulation layer, and a metal plate. The semiconductor chip has a plurality of bonding pads on an upper face thereof. The insulation layer is disposed over the upper face of the semiconductor chip and has openings that expose some portions of the bonding pads. The metal plate covers an upper face of the insulation layer and side faces of the semiconductor chip in which the metal plate is electrically insulated from the bonding pads. | 03-28-2013 |
20130082352 | STACK PACKAGE - A stack package includes a first semiconductor chip first pads and second pads disposed thereon and a second semiconductor chip having third pads and fourth pads electrically connected with the second pads disposed thereon. Capacitors are interposed between the first semiconductor chip and the second semiconductor chip, and include first electrodes electrically connected with the first pads of the first semiconductor chip, second electrodes electrically connected with the third pads of the second semiconductor chip, and dielectrics interposed between the first electrodes and the second electrodes. | 04-04-2013 |
20130087887 | STACK PACKAGE - A stack package includes a first semiconductor chip first pads and second pads disposed thereon and a second semiconductor chip having third pads and fourth pads electrically connected with the second pads disposed thereon. Capacitors are interposed between the first semiconductor chip and the second semiconductor chip, and include first electrodes electrically connected with the first pads of the first semiconductor chip, second electrodes electrically connected with the third pads of the second semiconductor chip, and dielectrics interposed between the first electrodes and the second electrodes. | 04-11-2013 |
20130093007 | SEMICONDUCTOR MEMORY APPARATUS AND METHOD FOR FABRICATING THE SAME - A method for fabricating a semiconductor memory apparatus is provided to minimize failure of the semiconductor memory apparatus and to secure a processing margin. The method also provides for minimizing the deterioration of an operating speed and the operational stability, and minimizing the increase of resistance occurring as a result of a reduced processing margin when forming a gate pattern in a peripheral region of the semiconductor memory apparatus. The method includes forming a connection pad in a peripheral region while forming a buried word line in a cell region, and forming a gate pattern in the peripheral region while forming a bit line in the cell region. | 04-18-2013 |
20130093484 | DELAY CIRCUIT AND METHOD FOR DRIVING THE SAME - A delay circuit includes a pulse generation unit configured to generate a pulse signal, which is activated in response to an input signal and has a pulse width corresponding to delay information, and an output unit configured to activate a final output signal in response to a deactivation of the pulse signal. | 04-18-2013 |
20130094285 | PHASE CHANGE MEMORY DEVICE HAVING MULTI-LEVEL AND METHOD OF DRIVING THE SAME - A phase change memory device having a multi-level and a method of driving the same are presented. The disclosed phase change memory device includes variable resistors and shifting units. The variable resistors are interchanged into set and reset states in response to an applied current. The shifting units, which are connected to the variable resistors, shift resistance distribution in the set and reset state of the variable resistors by a predetermined level. | 04-18-2013 |
20130102106 | IMAGE SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME - An image sensor module includes a transparent substrate having recesses defined in a lower face thereof. A light concentration member includes transparent light concentration parts each of which are disposed in a corresponding one of the recesses. Color filters are disposed over each of the light concentration parts and photo diode units having photo diodes are disposed over each of the color filters. An insulation member covers the photo diode units and input/output terminals disposed over the insulation member are each electrically connected to a corresponding photo diode unit. | 04-25-2013 |
20130102118 | SEMICONDUCTOR DEVICE WITH ONE-SIDE-CONTACT AND METHOD FOR FABRICATING THE SAME - A method for fabricating a semiconductor device includes forming a first conductive layer doped with an impurity for forming a cell junction over a semiconductor substrate, forming a second layer over the first conductive layer, forming a plurality of active regions by etching the second layer and the first conductive layer, the plurality of the active regions being separated from one another by trenches, forming a side contact connected to a sidewall of the first conductive layer, and forming a plurality of metal bit lines each connected to the side contact and filling a portion of each trench. | 04-25-2013 |
20130102146 | SEMICONDUCTOR INTEGRATED CIRCUIT AND METHOD FOR FABRICATING THE SAME - A semiconductor integrated circuit includes: a semiconductor chip; a through-chip via passing through a conductive pattern disposed in the semiconductor chip and cutting the conductive pattern; and an insulation pattern disposed on an outer circumference surface of the through-chip via to insulate the conductive pattern from the through-chip via. | 04-25-2013 |
20130119464 | SEMICONDUCTOR DEVICE WITH ONE-SIDE-CONTACT AND METHOD FOR FABRICATING THE SAME - A method for fabricating a semiconductor device includes forming a first conductive layer doped with an impurity for forming a cell junction over a semiconductor substrate, forming a second layer over the first conductive layer, forming a plurality of active regions by etching the second layer and the first conductive layer, the plurality of the active regions being separated from one another by trenches, forming a side contact connected to a sidewall of the first conductive layer, and forming a plurality of metal bit lines each connected to the side contact and filling a portion of each trench. | 05-16-2013 |
20130120042 | DELAY LOCKED LOOP - A delay locked loop includes a closed loop circuit configured to generate preliminary delay information, a control unit configured to update the preliminary delay information into delay information in response to a control signal, and a first delay unit configured to delay an input clock signal by a first delay value determined by the delay information and generate an output clock signal. | 05-16-2013 |
20130121069 | INTERNAL VOLTAGE GENERATING CIRCUIT OF PHASE CHANGE RANDOM ACCESS MEMORY DEVICE AND METHOD THEREOF - An internal voltage generating circuit includes a divided voltage generator configured to generate a divided voltage by dividing a feedback internal voltage level at a division ratio corresponding to an operation mode control signal, a voltage detector configured to detect a level of the divided voltage based on a reference voltage level, an internal voltage generator configured to receive a supply voltage as power source and generate the internal voltage in response to an output signal of the voltage detector, and an under-driving unit configured to under-drive an internal voltage terminal to a supply voltage in an under-driving operation region that is determined in response to the operation mode control signal. | 05-16-2013 |
20130121082 | METHOD OF OPERATING NONVOLATILE MEMORY DEVICE - A method of operating a nonvolatile memory device includes determining whether a program operation is performed on even memory cells coupled to even bit lines of a selected page, setting a coupling resistance value between odd bit lines of the selected page and page buffers depending on whether the program operation for the even memory cells is performed, performing a program operation on the odd memory cells coupled to the odd bit lines, and coupling the odd bit line to the page buffer based on the set coupling resistance value and performing an verification operation for verifying whether threshold voltages of the odd memory cells on which the program operation is performed are a target voltage or more. | 05-16-2013 |
20130130454 | METHOD FOR FABRICATING VERTICAL CHANNEL TYPE NONVOLATILE MEMORY DEVICE - A method for fabricating a vertical channel type nonvolatile memory device includes: stacking a plurality of interlayer insulating layers and a plurality of gate electrode conductive layers alternately over a substrate; etching the interlayer insulating layers and the gate electrode conductive layers to form a channel trench exposing the substrate; forming an undoped first channel layer over the resulting structure including the channel trench; doping the first channel layer with impurities through a plasma doping process; and filling the channel trench with a second channel layer. | 05-23-2013 |
20130134383 | NON-VOLATILE MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME - A non-volatile memory device and a method of manufacturing the same are provided. A first portion stack having a first circuit element including at least one layer selected from at least one diode layer, at least one variable resistive layer, and interconnection layer is formed on a first substrate. A second portion stack having a second circuit element including at least the other layer selected from the at least one diode layer, the at least variable resistive layer, and the at least interconnection layer is formed on a second substrate. The first circuit element and the second circuit element are bonded together and the second substrate is removed. | 05-30-2013 |
20130134508 | SEMICONDUCTOR DEVICE WITH SIDE-JUNCTION AND METHOD FOR FABRICATING THE SAME - A method for fabricating a semiconductor device includes forming a plurality of bodies that are each isolated from another by a trench and each include a diffusion barrier region with a sidewall exposed to the trench, forming a doped layer gap-filling the trench, forming a sidewall junction at the exposed sidewall of the diffusion barrier region by annealing the doped layer, and forming a conductive line coupled with the sidewall junction to fill the trench. | 05-30-2013 |
20130137228 | METHOD FOR FABRICATING VERTICAL CHANNEL TYPE NONVOLATILE MEMORY DEVICE - A method for fabricating a vertical channel type nonvolatile memory device includes: stacking a plurality of interlayer insulating layers and a plurality of gate electrode conductive layers alternately over a substrate; etching the interlayer insulating layers and the gate electrode conductive layers to form a channel trench exposing the substrate; forming an undoped first channel layer over the resulting structure including the channel trench; doping the first channel layer with impurities through a plasma doping process; and filling the channel trench with a second channel layer. | 05-30-2013 |
20130137258 | METHOD FOR FABRICATING BURIED GATES USING PRE LANDING PLUGS - A method for fabricating a semiconductor device is provided, the method includes forming a plug conductive layer over an entire surface of a substrate, etching the plug conductive layer to form landing plugs, etching the substrate between the landing plugs to form a trench, forming a gate insulation layer over a surface of the trench and forming a buried gate partially filling the trench over the gate insulation layer. | 05-30-2013 |
20130141998 | METHOD OF OPERATING NONVOLATILE MEMORY DEVICE - A method of operating a nonvolatile memory device comprises reading erase number information which is updated and stored whenever erasure is performed, setting program start voltages and step voltages based on the erase number information, and performing a program operation based on the program start voltages and the step voltages. | 06-06-2013 |
20130146831 | PHASE-CHANGE MEMORY DEVICE HAVING MULTIPLE DIODES - A phase-change memory device with an improved current characteristic is provided. The phase-change memory device includes a metal word line, a semiconductor layer of a first conductivity type being in contact with the metal word line, and an auxiliary diode layer being in contact with metal word line and the semiconductor layer, | 06-13-2013 |
20130147060 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a substrate, a first semiconductor chip module attached to the substrate, a conductive connection member attached to the first semiconductor chip module, and a second semiconductor chip module attached to the conductive connection member. The first and second semiconductor chip modules are formed to have step like shapes and extend laterally in opposite directions so as to define a zigzag arrangement together. | 06-13-2013 |
20130147517 | SEMICONDUCTOR DEVICE AND OPERATION METHOD THEREOF - A semiconductor device includes a clock delay unit configured to delay a source clock by a given delay amount and generate a delayed source clock, a driving signal generation unit configured to decide logic levels of first and second driving signals based on a value of input data, to select one of the source clock and the delayed source clock based on current logic levels of the first and second driving signals, which are detected based on the source clock, and to use a selected clock as a reference of an operation for determining next logic levels of the first and second driving signals, and an output pad driving unit configured to drive a data output pad with a first voltage in response to the first driving signal, and to drive the data output pad with a second voltage in response to the second driving signal. | 06-13-2013 |
20130148449 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR OPERATING THE SAME - A semiconductor memory device includes first and second write driving blocks to perform a data write operation on first and second memory banks in response to first and second bank strobe signals, respectively, and a common input driving block to transmit data to the first and second write driving blocks through a common data line in response to access information of the first and second memory banks. | 06-13-2013 |
20130157427 | ETCHING COMPOSITION AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME - The present invention provides an etching composition, comprising a silyl phosphate compound, phosphoric acid and deionized water, and a method for fabricating a semiconductor, which includes an etching process employing the etching composition. The etching composition of the invention shows a high etching selectivity for a nitride film with respect to an oxide film. Thus, when the etching composition of the present invention is used to remove a nitride film, the effective field oxide height (EEH) may be easily controlled by controlling the etch rate of the oxide film. In addition, the deterioration in electrical characteristics caused by damage to an oxide film or etching of the oxide film may be prevented, and particle generation may be prevented, thereby ensuring the stability and reliability of the etching process. | 06-20-2013 |
20130157434 | PHASE CHANGE MEMORY APPARATUS AND FABRICATION METHOD THEREOF - A phase change memory apparatus is provided that includes a first electrode of a bar type having a trench formed on an active region of a semiconductor substrate, a second electrode formed in a bottom portion of the trench, and a bottom electrode contact formed on the second electrode. | 06-20-2013 |
20130162316 | PULSE GENERATION CIRCUIT, BURST ORDER CONTROL CIRCUIT, AND DATA OUTPUT CIRCUIT - A pulse generation circuit includes a control unit configured to activate one or more of control clocks among a plurality of control clocks, and to activate one or more of select signals among a plurality of select signals, in response to one or more of sequence signals; a plurality of shifting units each configured to generate one or more of output signals, and to sequentially activate the one or more of output signals by shifting an input pulse when a corresponding control clock among the plurality of control clocks is activated; and a signal transfer unit configured to transfer one or more of output signals of a shifting unit corresponding to an activated select signal among the plurality of shifting units, as one or more of pulses. | 06-27-2013 |
20130162353 | SIGNAL AMPLIFICATION CIRCUIT - A signal amplification circuit includes a differential amplifier configured to receive a first signal and a second signal and generate an output signal, a differential amplifier configured to receive first and second signals and generate an output signal; and a controller configured to control an amount of current flowing in the differential amplifier using the output signal. | 06-27-2013 |
20130163362 | PRECHARGE CIRCUIT AND NON-VOLATILE MEMORY DEVICE - A precharge circuit includes a precharge unit configured to apply a voltage of a precharge voltage terminal to a data line during a precharge operation, and a sensing unit configured to disable the precharge unit by sensing the voltage of the precharge voltage terminal, The precharge circuit may control a precharge operation by sensing a change in the voltage level of the precharge voltage terminal. | 06-27-2013 |
20130166949 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR OPERATING THE SAME - A semiconductor memory device includes, a memory cell array configured to include a plurality of memory cells each having a plurality of logic pages, an error detector configured to detect a recovery target data among the data stored in the memory cell array, and output a logic page information of the recovery target data, a data recoverer configured to recover the recovery target data by using adjustment of a read reference voltage in response to the logic page information of the recovery target data, and a page buffer configured to read the recovery target data output from the memory cell array and write a recovered data output from the data recoverer in the memory cell array. | 06-27-2013 |
20130168634 | RESISTIVE RANDOM ACCESS MEMORY DEVICE - A resistive memory device includes a lower electrode disposed on a substrate, first and second resistance layers respectively disposed on opposite sides of the lower electrode and exhibiting resistance variation at different voltages, respectively, and an upper electrode disposed on and the first and second resistance layers. | 07-04-2013 |
20130175602 | Non-Volatile Memory Device Having Three Dimensional, Vertical Channel, Alternately Stacked Gate Electrode Structure - A method for fabricating a non-volatile memory device, the method includes alternately stacking inter-layer dielectric layers and sacrificial layers over a substrate, etching the inter-layer dielectric layers and the sacrificial layers to form trenches to expose a surface of the substrate, etching the inter-layer dielectric layers exposed by the trenches to a predetermined thickness, forming junction layers over etched portions of the inter-layer dielectric layers, and burying a layer for a channel within the trenches in which the junction layers have been formed to form a channel. | 07-11-2013 |
20130175603 | VERTICAL CHANNEL TYPE NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME - A method for fabricating a vertical channel type nonvolatile memory device includes: alternately forming a plurality of sacrificial layers and a plurality of interlayer dielectric layers over a semiconductor substrate; etching the sacrificial layers and the interlayer dielectric layers to form a plurality of first openings for channel each of which exposes the substrate; filling the first openings to form a plurality of channels protruding from the semiconductor substrate; etching the sacrificial layers and the interlayer dielectric layers to form second openings for removal of the sacrificial layers between the channels; exposing side walls of the channels by removing the sacrificial layers exposed by the second openings; and forming a tunnel insulation layer, a charge trap layer, a charge blocking layer, and a conductive layer for gate electrode on the exposed sidewalls of the channels. | 07-11-2013 |
20130176794 | METHOD OF OPERATING SEMICONDUCTOR MEMORY DEVICE - A method of operating a semiconductor memory device includes applying a program pass voltage to unselected word lines, applying a program voltage of a third level to a selected word line in order to raise threshold voltages of third memory cells, decreasing a level of the program voltage from the third level to a second level and discharging channel regions of second cell strings including second memory cells in order to raise threshold voltages of second memory cells, and decreasing a level of the program voltage from the second level to a first level and discharging channel regions of first cell strings including first memory cells in order to raise threshold voltages of first memory cells. The cell strings are disconnected from a bit line while a voltage level of the unselected word lines rises to a level of the program pass voltage. | 07-11-2013 |
20130214389 | INTEGRATED CIRCUIT - An integrated circuit includes a first chip having a plurality of through-chip vias, and a second chip stacked on the first chip and having a plurality of through-chip vias which are disposed at positions corresponding to the plurality of through-chip vias of the first chip and each of which is connected with at least one through-chip via of the first chip arranged in an oblique direction, which is not on a straight line extending in a chip stacking direction, among the plurality of through-chip vias of the first chip, wherein the first chip inputs/outputs a signal through a through-chip via which is selected by first repair information among the plurality of through-chip vias of the first chip, and the second chip inputs/outputs a signal through a through-chip via which is selected by second repair information among the plurality of through-chip vias of the second chip. | 08-22-2013 |