Patent application number | Description | Published |
20100078205 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a built-in electronic component includes a core substrate having a penetrating hole formed in the core substrate, an electronic component accommodated in the penetrating hole in the core substrate, a conductive pattern layer formed on a first surface of the core substrate and including a first conductive pattern and a second conductive pattern, and an interlayer insulation layer formed over the conductive pattern layer and the first surface of the core substrate. The second conductive pattern is formed adjacent to a periphery of the penetrating hole and contoured such that a sheet for positioning the electronic component in the penetrating hole is laminated horizontally with respect to the first surface of the core substrate over the penetrating hole. | 04-01-2010 |
20100300737 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board is formed with a substrate designating either the upper surface or the lower surface as a first surface and the other as a second surface; an electronic component arranged inside the substrate; and a first conductive layer formed on the first-surface side of the substrate by means of a first insulation layer made up of a first lower insulation layer and a first upper insulation layer. In such a wiring board, the first lower insulation layer and the first upper insulation layer are made of different materials from each other. Moreover, the first lower insulation layer is positioned on the first surface of the substrate and the electronic component, and the material that forms the first lower insulation layer fills a clearance between the substrate and the electronic component. | 12-02-2010 |
20110240354 | WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD - A wiring board including a substrate having a cavity, an electronic component accommodated in the cavity of the substrate, a first conductive pattern formed on a surface of the substrate and having a frame shape surrounding the opening of the cavity, a second conductive pattern formed on the surface of the substrate and outside the frame shape of the first conductive pattern, and an insulation layer formed on the surface of the substrate and covering the first conductive pattern, the second conductive pattern and the opening of the cavity. The first conductive pattern has a slit extending from the outside of the frame shape to the inside of the frame shape. | 10-06-2011 |
20120085572 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board including a core substrate having an accommodation portion, an electronic component in the accommodation portion having a substrate, a resin layer on a surface of the substrate and an electrode on the resin layer, a first interlayer resin insulation layer on a surface of the core substrate and a surface of the substrate of the component, and a second interlayer resin insulation layer on the opposite surface of the core substrate and a surface of the substrate having the resin layer and electrode. The first insulation layer has resin in the amount greater than the amount of resin in the second insulation layer such that the total amount of resin component including the resin in the first insulation layer is adjusted to be substantially the same as the total amount of resin component including the resin in the second insulation layer and resin in the resin layer. | 04-12-2012 |
20120142147 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a built-in electronic component includes a core substrate having a penetrating hole formed in the core substrate, an electronic component accommodated in the penetrating hole in the core substrate, a conductive pattern layer formed on a first surface of the core substrate and including a first conductive pattern and a second conductive pattern, and an interlayer insulation layer formed over the conductive pattern layer and the first surface of the core substrate. The second conductive pattern is formed adjacent to a periphery of the penetrating hole and contoured such that a sheet for positioning the electronic component in the penetrating hole is laminated horizontally with respect to the first surface of the core substrate over the penetrating hole. | 06-07-2012 |
20120186866 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a core substrate having an opening portion and a through hole adjacent to the opening portion, a capacitor positioned in the opening portion, and a through-hole conductor formed in the through hole of the core substrate and having a conductor filling the through hole. The core substrate has a first surface and a second surface on the opposite side of the first surface, the opening portion of the core substrate penetrates from the first surface to the second surface, the through-hole conductor has a first conductive portion and a second conductive portion connected to the first conductive portion in the core substrate, the first conductive portion of the through-hole conductor becomes narrower from the first surface toward the second surface, and the second conductive portion of the through-hole conductor becomes narrower from the second surface toward the first surface. | 07-26-2012 |
20120188734 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board including an insulative substrate having a cavity portion, an electronic device positioned in the cavity portion of the insulative substrate, an interlayer insulation layer made of an insulative material and formed on the insulative substrate and on the electronic device, and a conductive layer having a conductive pattern and formed on the interlayer insulation layer. The insulative substrate has a gap formed with respect to the electronic device in the cavity portion, the gap between the electronic device in the cavity portion and the insulative substrate is filled with an insulator made of the insulative material derived from the interlayer insulation layer, and the conductive pattern of the conductive layer has an enlarged-width portion across and directly over the gap. | 07-26-2012 |
20120250277 | PRINTED WIRING BOARD - A printed wiring board includes a core substrate having a penetrating hole extending through the core substrate, an electronic component accommodated in the penetrating hole of the core substrate, a filler resin filling clearance between the component and the core substrate, a first resin insulation layer formed on the component and a first surface of the core substrate, and a second resin insulation layer formed on the component and a second surface of the core substrate on the opposite side of the first surface of the core substrate. The filler resin has elastic modulus which is set to be lower than 0.2 Gpa and thermal expansion coefficient which is set to be higher than 100 ppm and lower than 200 ppm, and the core substrate has elastic modulus which is set to be higher than 30 Gpa, and thermal expansion coefficient which is set to be lower than 10 ppm. | 10-04-2012 |
20130192883 | PRINTED WIRING BOARD - A printed wiring board includes a substrate having an accommodation section having multiple opening portions, multiple electronic components accommodated in the opening portions, respectively, a filler resin provided in the opening portions in the substrate such that the electronic components are secured in the opening portions in the substrate, a resin insulation layer formed over the substrate and the electronic components, a conductive layer formed on the resin insulation layer, and via conductors formed in the resin insulation layer and connecting the conductive layer and the electronic components. The opening portions are connected to each other. | 08-01-2013 |
20130194764 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having an opening portion, electronic components positioned in the opening portion of the substrate and including first and second electronic components, and an insulation layer formed over the substrate and the first and second components. The first component has first and second electrodes having side portions on side surfaces of the first component, the second component has first and second electrodes having side portions on side surfaces of the second component, the first electrode of the first component and the first electrode of the second component are set to have substantially the same electric potential, and the first component and the second component are positioned in the opening portion of the substrate such that the side portion of the first electrode of the first component is beside the side portion of the first electrode of the second component. | 08-01-2013 |
20140247571 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a built-in electronic component includes a core substrate having a penetrating hole formed in the core substrate, an electronic component accommodated in the penetrating hole in the core substrate, a conductive pattern layer formed on a first surface of the core substrate and including a first conductive pattern and a second conductive pattern, and an interlayer insulation layer formed over the conductive pattern layer and the first surface of the core substrate. The second conductive pattern is formed adjacent to a periphery of the penetrating hole such that the second conductive pattern is formed along an outline of the periphery of the penetrating hole. | 09-04-2014 |
20150022982 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having an opening portion, electronic components positioned in the opening portion of the substrate and including first and second electronic components, and an insulation layer formed over the substrate and the first and second components. The first component has first and second electrodes having side portions on side surfaces of the first component, the second component has first and second electrodes having side portions on side surfaces of the second component, the first electrode of the first component and the first electrode of the second component are set to have substantially the same electric potential, and the first component and the second component are positioned in the opening portion of the substrate such that the side portion of the first electrode of the first component is beside the side portion of the first electrode of the second component. | 01-22-2015 |