Patent application number | Description | Published |
20120328194 | IMAGE PROCESSING METHOD, IMAGE DISPLAY METHOD, IMAGE PROCESSING APPARATUS AND A NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM - An image processing method of picking up an image of a substrate and converting pixel values of the picked-up substrate image makes the pixel values of the picked-up substrate image into a histogram, and creates a tone curve T composed of a periodic function of a predetermined amplitude and a predetermined period based on a distribution of the pixel values in the histogram. The pixel values of the picked-up substrate image are converted using the tone curve T to obtain a substrate image with a high contrast. | 12-27-2012 |
20130088696 | SETTING METHOD OF EXPOSURE APPARATUS, SUBSTRATE IMAGING APPARATUS AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM - A method of setting an exposure apparatus to expose exposure sectors defined on a resist film formed on a surface of a substrate with proper values of an exposure amount and a focus value for forming a pattern having a predetermined dimension includes exposing and developing an exposure sector defined on a reference substrate by a first exposure apparatus having a first state, and imaging the same. The method exposes and develops exposure sectors defined on an inspection substrate by a second exposure apparatus having a second state where at least one of the exposure amount and the focus value is unknown, and forms and images a pattern on the inspection substrate. The method determines the proper values for the exposure amount and the focus value for the second state based on luminance of the exposure sector of reference data and luminances of the exposure sectors of inspection data. | 04-11-2013 |
20140054463 | INSPECTION DEVICE, BONDING SYSTEM AND INSPECTION METHOD - According to an embodiment of the present disclosure, an apparatus of inspecting an overlapped substrate obtained by bonding substrates together is provided. The apparatus includes a first holding unit configured to hold and rotate the overlapped substrate, and a displacement gauge configured to measure displacements of peripheral sides of a first substrate and a second substrate constituting the overlapped substrate while rotating the overlapped substrate held by the first holding unit. | 02-27-2014 |
20140055599 | INSPECTION DEVICE, BONDING SYSTEM AND INSPECTION METHOD - An inspection device for inspecting the interior of an overlapped substrate produced by bonding one substrate and another substrate, comprising: a first holding unit configured to hold the rear surface of the overlapped substrate and include a cutout formed to expose a portion of the rear surface of the overlapped substrate when viewed from the top; a second holding unit configured to hold and rotate the overlapped substrate; an infrared irradiator configured to irradiate the rear surface or front surface exposed from the cutout of the overlapped substrate held on the first holding unit with an infrared ray; and an image pickup unit configured to receive the infrared ray emitted from the infrared irradiator and image the overlapped substrate held on the first holding unit in division for each of regions exposed from the cutout. | 02-27-2014 |
20140152807 | SUBSTRATE DEFECT INSPECTION METHOD, SUBSTRATE DEFECT INSPECTION APPARATUS AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM - A method of inspecting a substrate for a defect on a basis of a substrate image imaged by an imaging apparatus, includes: imaging a substrate being an imaging object under a predetermined imaging condition; extracting a mode of pixel values of the imaged substrate image; calculating a correction value for the imaging condition on a basis of the extracted pixel value and preset imaging condition correction data; then changing the imaging condition on a basis of the correction value, and imaging again the substrate being the imaging object under the changed imaging condition; and inspecting the substrate for a defect on a basis of a substrate image imaged under the changed imaging condition. | 06-05-2014 |
20140160451 | SUBSTRATE REFERENCE IMAGE CREATION METHOD, SUBSTRATE DEFECT INSPECTION METHOD, SUBSTRATE REFERENCE IMAGE CREATION APPARATUS, SUBSTRATE DEFECT INSPECTION UNIT AND NON-TRANSITORY COMPUTER STORAGE MEDIUM - In the present invention, a planar distribution of pixel values in a picked-up substrate image is decomposed into a plurality of pixel value distribution components through use of a Zernike polynomial for each of substrate images; Zernike coefficients of the pixel value distribution components decomposed through use of the Zernike polynomial are calculated; a median value and values deviated from the median value by a predetermined value or more are extracted for every Zernike coefficients having a same couple of degrees from the calculated Zernike coefficients; substrate images having the extracted values are specified; and a substrate image being a defect inspection reference is created by combining the specified substrate images. | 06-12-2014 |
20150125068 | DEFECT ANALYZING APPARATUS, SUBSTRATE PROCESSING SYSTEM, DEFECT ANALYZING METHOD AND COMPUTER-READABLE STORAGE MEDIUM - A potential trouble can be in advance suppressed by analyzing a defect of a wafer. A defect analyzing apparatus of analyzing a defect of a substrate includes an imaging unit configured to image target substrates; a defect feature value extracting unit configured to extract a defect feature value in a surface of the substrate based on the substrate image; a defect feature value accumulating unit configured to calculate an accumulated defect feature value with respect to the substrates to create an accumulation data AH; a defect determination unit configured to determine whether the accumulated defect feature value exceeds a preset critical value; and an output display unit configured to output a determination result from the defect determination unit. | 05-07-2015 |
20150324970 | FILM THICKNESS MEASUREMENT APPARATUS, FILM THICKNESS MEASUREMENT METHOD, AND NON-TRANSITORY COMPUTER STORAGE MEDIUM - Film thickness measured values obtained by measurement in advance at a plurality of points on a measurement preparation substrate and coordinates corresponding to the film thickness measured values are acquired. A pixel value at each coordinates is extracted from a preparation imaged image obtained by imaging the measurement preparation substrate in advance by an imaging device. Correlation data between the pixel value extracted at each coordinates and the film thickness measured value at each coordinates is generated. A substrate being a film thickness measurement object is imaged by the imaging device to acquire an imaged image, and a film thickness of a film formed on the substrate being the film thickness measurement object is calculated on the basis of a pixel value of the imaged image and the correlation data. | 11-12-2015 |