| Patent application number | Description | Published |
|---|
| 20080241743 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME - A positive resist composition, includes: (B) a resin containing a repeating unit represented by formula (Ia) or (Ib) as defined in the specification, which decomposes under an action of an acid to increase a solubility of the resin (B) in an aqueous alkali solution; and (A) a compound capable of generating an acid upon irradiation with actinic rays or radiation, and a pattern forming method uses the composition. | 10-02-2008 |
| 20080241750 | RESIST COMPOSITION AND PATTERN FORMATION METHOD USING THE SAME - A resist composition includes: (A) a resin that includes: a repeating unit represented by a following formula (I), and a repeating unit represented by a following formula (II); and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation: | 10-02-2008 |
| 20080248419 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME - A positive resist composition, includes: (A) a resin that has a group having absorption at 248 nm at a main chain terminal of the resin (A), and a pattern forming method uses the composition. | 10-09-2008 |
| 20090087784 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME - A positive resist composition includes: (A) a resin containing a repeating unit represented by formula (I) or (I′) as defined in the specification, of which solubility in an alkali developer increases under an action of an acid; and (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation: | 04-02-2009 |
| 20090087789 | RESIST COMPOSITION AND PATTERN-FORMING METHOD USING THE SAME - A resist composition includes (A) a resin including: a repeating unit capable of decomposing by the action of an acid to increase solubility in an alkali developing solution and represented by formula (I), and a repeating unit represented by formula (II); and (B) a compound capable of generating an acid upon irradiation with actinic ray or radiation: | 04-02-2009 |
| 20100152401 | POLYMERIZABLE COMPOUND AND POLYMER COMPOUND OBTAINED BY USING THE SAME - Provided is a polymerizable compound represented by the following general formula (ca-1) or (cb-1): | 06-17-2010 |
| 20100216072 | POSITIVE PHOTOSENSITIVE COMPOSITION, PATTERN FORMING METHOD USING THE COMPOSITION AND RESIN FOR USE IN THE COMPOSITION - A positive photosensitive composition ensuring wide exposure latitude and reduced line edge roughness not only in normal exposure (dry exposure) but also in immersion exposure, a pattern forming method using the positive photosensitive composition, and a novel resin contained in the positive photosensitive composition are provided, which are a positive photosensitive composition comprising (A) a resin having a specific lactone structure in the side chain and being capable of increasing the solubility in an alkali developer by the action of an acid and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, a pattern forming method using the positive photosensitive composition, and a novel resin contained in the positive photosensitive composition. | 08-26-2010 |
| 20100248146 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME - A positive resist composition comprising (A) a resin which contains all of the repeating units represented by formulae (I) to (III), and becomes soluble in an alkali developer by the action of an acid, and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; and a pattern forming method using the composition. A represents a group capable of decomposing and leaving by the action of an acid, each R | 09-30-2010 |
