Patent application number | Description | Published |
20080202678 | PRODUCTION METHOD OF ELECTRONIC APPARATUS, PRODUCTION METHOD OF ELECTRONIC EQUIPMENT IN WHICH ELECTRONIC APPARATUS IS PACKAGED, AND PRODUCTION METHOD OF ARTICLE IN WHICH ELECTRONIC APPARATUS IS MOUNTED - A production method of an electronic apparatus includes: a step of making a thermosetting adhesive adhere to a face of a base where an antenna pattern is formed on a film made of a resin material, the face being a face which the antenna pattern is formed on; a step of mounting a circuit chip connected to the antenna pattern, on the base through the thermosetting adhesive; a preheating step of heating the thermosetting adhesive on a first heating condition by which the thermosetting adhesive becomes a first cured state; and a main heating step of fixing the circuit chip to the antenna pattern by heating and curing the thermosetting adhesive on a second heating condition by which the thermosetting adhesive becomes a second cured state harder than the first cured state, with the base being clamped and pressurized from both of the circuit chip side and the film side. | 08-28-2008 |
20080216917 | RESIN FILLING APPARATUS, FILLING METHOD, AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE - A resin filling apparatus, a filling method, and a method of manufacturing an electronic device fill a cavity between a substrate and an electronic component mounted on the substrate with resin. The resin filling apparatus includes a stage for supporting the substrate in an inclined state, and an application head for filling the cavity with resin from a lower side of the inclined substrate. | 09-11-2008 |
20090053852 | MANUFACTURING APPARATUS AND METHOD FOR AN ELECTRONIC APPARATUS - A manufacturing method for an electronic apparatus and manufacturing apparatus are provided. The manufacturing method includes applying to a surface of a sheet an adhesive to be charged into a space between a mounting board and an electronic component mounted on the mounting board, bringing the one surface of the sheet into contact with a back surface of the electronic component mounted on the mounting board and charging the adhesive into the space by bringing the adhesive into contact with a peripheral portion of the electronic component under a low pressure, and pressing a heating head against the other surface of the sheet and heating the sheet with the heating head via the sheet to set the adhesive under atmospheric pressure, in a state that the sheet is in contact with the electronic component. | 02-26-2009 |
20090146652 | Slider tester - A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part | 06-11-2009 |
20090146653 | Slider tester - A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part | 06-11-2009 |
20090170245 | ELECTRONIC APPARATUS MANUFACTURING METHOD - An electronic apparatus manufacturing method comprises applying a first adhesive agent to a mounting portion, a first heating, in such a way that connection pads and bumps, come into contact, by pressing a heating head against a non-mounting surface of the electronic component, heating the electronic component, hardening the first adhesive agent, affixing the mounting substrate and electronic component, filling a space between the mounting substrate and the electronic component with a second adhesive agent under reduced pressure, and a second heating step of,, from being under reduced pressure to being under atmospheric pressure, by pressing the heating head against the non-mounting surface of the electronic component, heating the electronic component, as well as hardening the second adhesive agent, melting the connection pads, and joining the connection pads and the bumps. | 07-02-2009 |
20090243006 | ELECTRONIC PART WITH AFFIXED MEMS - According to an aspect of the invention, an electronic part includes a substrate having a first planar surface, a first bump affixed to the first planar surface of the substrate, a second bump affixed to the first planar surface of the substrate a predetermined distance from the first bump, a MEMS chip including a element, the MEMS chip coupled to the first bump and the second bump, the MEMS chip distanced from the first planar surface, an adhesive region bonding with the first bump, the substrate and the MEMS chip. | 10-01-2009 |
20090243062 | IC TAG AND MANUFACTURING METHOD OF THE SAME - An IC tag comprises a substrate on which a wiring pattern is formed, an IC chip which is bonded and mounted to the substrate by bringing a bump into press-contact with the wiring pattern, a repulsive member that is arranged on the surface opposite to the surface of the substrate on which surface the IC chip is mounted, and that is made of a material having higher rigidity than the substrate, and an exterior package member which is configured to cover the substrate, the IC chip, and the repulsive member. | 10-01-2009 |
20100001081 | ELECTRONIC DEVICE, ELECTRONIC APPARATUS MOUNTED WITH ELECTRONIC DEVICE, ARTICLE EQUIPPED WITH ELECTRONIC DEVICE AND METHOD OF PRODUCING ELECTRONIC DEVICE - An electronic device includes: a base; a conductor pattern formed on the base; a circuit chip electrically connected to the conductor pattern; and a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which has such an internal structure that a plurality of columns extending in the thickness direction of the base are dispersed in a predetermined substrate. The electronic device further includes a sealing member which fills an inside of the reinforcing member while covering the top of the circuit chip, thereby sealing the circuit chip on the base. | 01-07-2010 |
20100001387 | ELECTRONIC DEVICE, ELECTRONIC APPARATUS MOUNTED WITH ELECTRONIC DEVICE, ARTICLE EQUIPPED WITH ELECTRONIC DEVICE AND METHOD OF PRODUCING ELECTRONIC DEVICE - An electronic device includes: a base; a conductor pattern formed on the base; and a circuit chip electrically connected to the conductor pattern. The electronic device further includes a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which includes layers stacked in the thickness direction of the base. The lowermost layer of the layers is closest to the base and softer than the layer that is at least one of the remaining layers. The electronic device further includes a sealing member which fills an inside of the reinforcing member while covering the top of the circuit chip, thereby sealing the circuit chip on the base. | 01-07-2010 |
20100001388 | ELECTRONIC DEVICE, ELECTRONIC APPARATUS MOUNTED WITH ELECTRONIC DEVICE, ARTICLE EQUIPPED WITH ELECTRONIC DEVICE AND METHOD OF PRODUCING ELECTRONIC DEVICE - An electronic device includes: a base; a conductor pattern formed on the base; a circuit chip electrically connected to the conductor pattern; and a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which includes concentric rings as an internal structure. The electronic device further includes a sealing member which fills an inside of the reinforcing member while covering the top of the circuit chip, thereby sealing the circuit chip on the base. | 01-07-2010 |
20100258640 | RFID TAG AND MANUFACTURING METHOD THEREOF - An RFID tag includes an inlet on which an antenna pattern serving as an antenna for communication and an IC chip electrically connected to the antenna pattern are mounted. The RFID tag also includes an exterior body that encloses the inlet from outside and a hollow space that is formed by the inlet and the exterior body and that is filled with gas or a gel material. | 10-14-2010 |
20100328917 | MULTICHIP MODULE, PRINTED CIRCUIT BOARD UNIT, AND ELECTRONIC APPARATUS - A multichip module includes a package substrate, a first semiconductor device, a second semiconductor device and a conductive bump. The first semiconductor device is flip-chip bonded to the package substrate. The first semiconductor device includes a first chip pad on a surface thereof. The second semiconductor device is mounted on the first semiconductor device. The second semiconductor device includes a second chip pad facing the first chip pad. The conductive bump connects the first chip pad to the second chip pad. The conductive bump includes a first metallic body that has a first diffusion rate and a second metallic body that has a second diffusion rate lower than the first diffusion rate. | 12-30-2010 |
20110278056 | MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD UNIT, MANUFACTURING APPARATUS THEREOF, MANUFACTURING METHOD OF ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT - A manufacturing method of a printed circuit board unit is provided. A portion of bumps which is arranged on an electronic component is pressed to lower heights of the portion of bumps as compared to other bumps. | 11-17-2011 |
20120080219 | METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE - A method of manufacturing an electronic device in which an electronic component is flip-chip mounted on a circuit board, the method includes supplying, on an electrode of the circuit board or a terminal of the electronic component, a first resin material of a thickness smaller than a gap between the circuit board and the electronic component, after supplying the first resin material, connecting the terminal to the electrode by melting a solder material disposed on the electrode or the terminal at a first temperature with keeping the terminal in contact with the electrode, after connecting the terminal to the electrode, filling the gap between the circuit board and the electronic component with a second resin material, and heating the second resin material at a second temperature lower than the first temperature. | 04-05-2012 |
20120080220 | ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE - An electronic device includes a circuit board including a first electrode and a second electrode; and an electronic component including a first terminal and a second terminal, wherein the first electrode includes a first pad portion to which the first terminal is connected and a first protrusion portion disposed in a first direction in parallel with a straight line passing through the first electrode and the second electrode with respect to the first pad portion and being into contact with the first terminal, the second electrode includes a second pad portion to which the second terminal is connected and a second protrusion portion disposed in a second direction opposite to the first direction with respect to the second pad portion and being into contact with the second terminal. | 04-05-2012 |
20120230001 | ELECTRONIC DEVICE, PORTABLE ELECTRONIC TERMINAL, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - An electronic device includes an interposer, a first chip being mounted on a first surface of the interposer, the first chip having a first surface facing the first surface of the interposer and a second surface opposite to the first surface of the first chip, a second chip being mounted on a second surface of the interposer opposite to the first surface of the interposer, the second chip having a first surface facing the second surface of the interposer and a second surface opposite to the first surface of the second chip, a first metal plate being connected to the second surface of the first chip, a second metal surface being provided over the second surface of the second chip, and a via penetrating through the interposer and connected to the first metal plate and the second metal plate. | 09-13-2012 |