Patent application number | Description | Published |
20100041860 | POLYIMIDE, DIAMINE COMPOUND AND METHOD FOR PRODUCING THE SAME - A polyimide obtained by reacting a tetracarboxylic acid component with a diamine component containing a diamine compound represented by the following general formula (1): | 02-18-2010 |
20120288621 | POLYIMIDE FILM AND WIRING BOARD - A polyimide film for production of a wiring board having a metal wiring, which is formed by forming a metal layer on one side (Side B) of the polyimide film, and etching the metal layer; the polyimide film is curled toward the side (Side A) opposite Side B; and the curling of the polyimide film is controlled so as to reduce the drooping of the wiring board having a metal wiring formed thereon. The handling characteristics and productivity in IC chip mounting may be improved by the use of the polyimide film. | 11-15-2012 |
20130046074 | Polyamide Resin - This is to provide a polyamide resin which can sufficiently ensure all of a relative viscosity ηr (high degree of polymerization), moldable temperature range estimated from a temperature difference (Td−Tm), heat resistance estimated from a melting point Tm, melt moldability estimated from a temperature difference (Tm−Tc), and low water absorbability as compared with the conventional polyoxamide resin. | 02-21-2013 |
20130172520 | POLYOXAMIDE RESIN HAVING EXCELLENT IMPACT RESISTANCE AND IMPACT-RESISTANT PART - Provided is a polyoxamide resin which has excellent impact resistance and is characterized in that the polyoxamide resin is obtained from a diamine in which the diamine component has 10 to 18 carbons and in that the polyoxamide resin has a relative viscosity (ηr) of 2.1 or greater as determined at 25° C. using 96% sulfuric acid as a solvent and a solution having a concentration of 1.0 g/dL, and also provided is an impact-resistant part comprising this resin. The polyoxamide resin has a higher molecular weight than a conventional polyoxamide resin, a large moldable temperature range as estimated from the difference between the melting point and the thermal decomposition temperature and therefore excellent molten moldability, and furthermore excellent impact resistance when compared to a conventional aliphatic polyoxamide resin without losing the low water absorbency, chemical resistance, hydrolysis resistance, high elasticity, and high strength seen with aliphatic straight-chain polyoxamide resins. | 07-04-2013 |
20130295309 | RESIN COMPOSITION AND BONDED COMPOSITE - A resin composition, preferably an adhesive composition, comprising a polyether polyamide elastomer capable of being strongly bended with a polyimide resin, preferably strongly bended through an easy process to form an interface between the polyimide resin and the composition, and a bonded composite having the resin composition and a polyimide resin which together form an interface to be bonded with each other. A resin composition for forming an interface together with a polyimide resin for bonding, wherein the resin composition comprises a polyether polyamide elastomer (component R) obtained by subjecting a specific aminocarboxylic acid compound A1 and/or lactam compound A2, polyether compound B, and dicarboxylic acid compound C to polymerization, wherein the content of the component R in the resin composition is 80 to 100% by weight. | 11-07-2013 |
20150069012 | POLYIMIDE FILM AND WIRING BOARD - A polyimide film for production of a wiring board having a metal wiring, which is formed by forming a metal layer on one side (Side B) of the polyimide film, and etching the metal layer; the polyimide film is curled toward the side (Side A) opposite Side B; and the curling of the polyimide film is controlled so as to reduce the drooping of the wiring board having a metal wiring formed thereon. The handling characteristics and productivity in IC chip mounting may be improved by the use of the polyimide film. | 03-12-2015 |