Patent application number | Description | Published |
20080247116 | INTERPOSER, A METHOD FOR MANUFACTURING THE SAME AND AN ELECTRONIC CIRCUIT PACKAGE - An interposer including: a substrate including a first layer and second layer, wherein the first layer and second layer are positioned parallel to each other; electrodes each having a concave-convex structure formed on each facing surface of the first layer and second layer of the substrate; a dielectric layer sandwiched between the electrodes which are formed on each facing surface of the first layer and second layer of the substrate; a first conductive part which vertically passes through the first layer of the substrate from a first outer surface of the substrate and is electrically connected to an electrode formed on a surface of the second layer of the substrate that faces the first layer of the substrate; and a second conductive part which vertically passes through the second layer of the substrate from a second outer surface of the substrate and is electrically connected to an electrode formed on a surface of the first layer of the substrate that faces the second layer of the substrate. | 10-09-2008 |
20090173522 | INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER - An interposer having a support substrate, a first insulation layer made of an inorganic material and formed over the support substrate, and a second insulation layer formed over the first insulation layer. The first insulation layer has a first land, a second land and a first wiring electrically connecting the first land and the second land. The second insulation layer has a first pad positioned to load a first electronic component, a second pad positioned to load a second electronic component, a second wiring electrically connected to the second pad, a first via conductor electrically connecting the first land and the first pad, and a second via conductor electrically connecting the second land and the second wiring. The first wiring and second wiring electrically connect the first pad and the second pad, and the second wiring has a lower wiring resistance per unit length than the first wiring. | 07-09-2009 |
20090173530 | INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER - An interposer includes a first insulating layer made of an inorganic material and having a first land, a second land and a first wiring electrically connecting the first land and the second land, and a second insulating layer formed over a first surface of the first insulating layer and having a second wiring, a second pad for loading a second electronic component over the second insulating layer and a first via conductor electrically connecting the second land and the second wire. The first wiring and the second wiring electrically connect the first land and the second pad. The first land and second land are positioned such that a first electronic component is mounted over a second surface of the first insulating layer on the opposite side of the first surface. The second wiring has a longer wiring length and a greater thickness than the first wiring. | 07-09-2009 |
20100326709 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes a first insulation layer, a first conductive circuit formed on the first insulation layer, a second insulation layer formed on the first insulation layer and the first conductive circuit and having an opening portion reaching the first conductive circuit, a second conductive circuit formed on the second insulation layer, and a via conductor formed in the opening portion and connecting the first conductive circuit and the second conductive circuit. The via conductor is formed an inner-wall surface of the opening portion and has a seed layer including a nitride compound and/or a carbide compound containing Ti, Zr, Hf, V, Nb, Ta or Si and a plated-metal film formed in the opening portion, and the plated-metal film and the first conductive circuit have at least portions making direct contact. | 12-30-2010 |
20110265324 | INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER - A method for manufacturing an interposer including forming a first insulating layer comprising an inorganic material on a supporting substrate, forming a first wire in the first insulating layer, forming a second insulating layer on a first side of the first insulating layer, forming a second wire with a longer wire length and a greater thickness than the first wire on the second insulating layer, and removing the supporting substrate. | 11-03-2011 |
Patent application number | Description | Published |
20110156828 | SURFACE ACOUSTIC WAVE DEVICE, OSCILLATOR, MODULE APPARATUS - A surface acoustic wave device includes: a sapphire substrate having a C-plane main surface; comb-like electrodes which excite surface acoustic waves formed on the main surface of the sapphire substrate; an aluminum nitride film which covers the comb-like electrodes and the main surface; and a silicon dioxide film which is formed on the surface of the aluminum nitride film. | 06-30-2011 |
20110156840 | SURFACE ACOUSTIC WAVE DEVICE, OSCILLATOR, MODULE APPARATUS - A surface acoustic wave device includes: a sapphire substrate having a C-plane main surface; an aluminum nitride film which is formed on the main surface of the sapphire substrate; comb-like electrodes which are formed on the surface of the aluminum nitride film to excite surface acoustic waves; and a silicon dioxide film which covers the comb-like electrodes and the surface of the aluminum nitride film. | 06-30-2011 |
20120111615 | FUNCTIONAL DEVICE, METHOD OF MANUFACTURING THE FUNCTIONAL DEVICE, PHYSICAL QUANTITY SENSOR, AND ELECTRONIC APPARATUS - A functional device according to an embodiment of the invention includes: an insulating substrate; a movable section; movable electrode fingers provided in the movable section; and fixed electrode fingers provided on the insulating substrate and arranged to be opposed to the movable electrode fingers. The fixed electrode fingers include: first fixed electrode fingers arranged on one side of the movable electrode fingers; and second fixed electrode fingers arranged on the other side of the movable electrode fingers. The first fixed electrode fingers and the second fixed electrode fingers are arranged to be spaced apart from each other. | 05-10-2012 |
20120267150 | FUNCTIONAL ELEMENT, SENSOR ELEMENT, ELECTRONIC APPARATUS, AND METHOD FOR PRODUCING A FUNCTIONAL ELEMENT - A functional element including a substrate having a principal surface, a groove portion (a first groove portion, a second groove portion) disposed on the principal surface, and a fixed electrode section (a first fixed electrode finger, a second fixed electrode finger) laid across the groove portion on the substrate, wherein, in the groove portion, a raised portion formed by using at least one of the substrate and the fixed electrode section is provided in a position overlapping with the fixed electrode section in a plan view, the raised portion has a bonded surface (an end face), a wiring line (a first wiring line, a second wiring line) is disposed on the bonded surface, and the substrate and the fixed electrode section are connected with the wiring line sandwiched between the substrate and the fixed electrode section. | 10-25-2012 |
Patent application number | Description | Published |
20150014902 | DIE FOR EXTRUSION MOLDING, METHOD OF PRODUCING DIE FOR EXTRUSION MOLDING, AND METHOD OF PRODUCING HONEYCOMB STRUCTURED BODY - A die for extrusion molding includes a first face, a second face, a raw material supply section, a molding section, and a structure. The molding section has a second through hole that extends from the second face toward the first face so as to communicate with a first through hole. The structure is such that a material for the die is machined to form the material into a predetermined shape and to provide a machining-affected layer on an inner wall surface of the second through hole in the molding section, an oxidized layer is provided by heating the machining-affected layer to oxidize the machining-affected layer so as to convert the machining-affected layer into the oxidized layer, the oxidized layer is removed so that a treated surface is provided, and the treated surface is nitrided by ion implantation to provide a nitride layer. | 01-15-2015 |
20150014903 | DIE FOR EXTRUSION MOLDING, METHOD OF PRODUCING DIE FOR EXTRUSION MOLDING, AND METHOD OF PRODUCING HONEYCOMB STRUCTURED BODY - A die for extrusion molding includes a first face, a second face, a raw material supply section, a molding section, and a treated surface. The second face is provided opposite the first face. The molding section has a second through hole that extends from the second face toward the first face so as to communicate with a first through hole. The treated surface is provided on an inner wall surface of the second through hole to have a structure such that a material for the die is machined to form the material into a die shape and to provide a machining-affected layer on the inner wall surface of the second through hole in the molding section, an oxidized layer is provided by heating the machining-affected layer to oxidize the machining-affected layer so as to convert the machining-affected layer into the oxidized layer, and the oxidized layer is removed. | 01-15-2015 |
20150017343 | DIE FOR EXTRUSION MOLDING, METHOD OF PRODUCING DIE FOR EXTRUSION MOLDING, EXTRUDER, AND METHOD OF PRODUCING HONEYCOMB STRUCTURED BODY - A die for extrusion molding includes a first face, a second face, a raw material supply section, and a molding section. The second face is provided opposite the first face. The raw material supply section includes a first through hole that extends from the first face toward the second face. The molding section includes a second through hole and a nitride layer. The second through hole extends from the second face toward the first face so as to communicate with the first through hole. The nitride layer is provided on an inner wall surface of the second through hole. | 01-15-2015 |