Patent application number | Description | Published |
20110199121 | SMART EDGE DETECTOR - In some embodiments related to a smart edge detector, the smart edge detector uses a second clock in a receiver domain (e.g., clock CLK_D | 08-18-2011 |
20120280718 | SMART EDGE DETECTOR - This description relates to an edge detector including a pulse generator configured to generate a first pulse when a first clock and a second clock are at a same logic level and generate a second pulse when the first clock and the second clock are at different logic levels. The edge detector further includes a first RC circuit configured to charge the first pulse and a second RC circuit configured to charge the second pulse. The edge detector further includes a circuitry that, based on a width of the first pulse or of the second pulse, is configured to provide a select signal to select an edge of the second clock for triggering. | 11-08-2012 |
20140003551 | SYSTEM AND METHOD FOR CHIP SYSTEM TIMING COMPENSATION | 01-02-2014 |
20150091130 | VERTICAL NOISE REDUCTION IN 3D STACKED SEMICONDUCTOR DEVICES - A stacked three dimensional semiconductor device includes multiple thin substrates stacked over one another and over a base substrate. The thin substrates may include a thickness of about 0.1 μm. In some embodiments, a noise suppression tier is vertically interposed between active device tiers. In some embodiments, each tier includes active device portions and noise suppression portions and the tiers are arranged such that noise suppression portions are vertically interposed between active device portions. The noise suppression portions include decoupling capacitors in a power/ground mesh and alleviate vertical noise. | 04-02-2015 |
Patent application number | Description | Published |
20110000645 | HEAT DISSIPATING BOARD STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A heat dissipating board structure includes a heat dissipating board body having a first face with at least one groove; and at least one heat pipe correspondingly received in the at least one groove to flush with the first face. To manufacture the heat dissipating board structure, first provide at least one heat pipe and a heat dissipating board body; then, form at least one groove on a first face of the board body, place the heat pipe in the groove, and press the board body with a press machine to associate the heat pipe with the groove while flatten a top of the heat pipe; and finally, flush the heat pipe with the first face by removing extra material of the heat pipe that is protruded from the first face. The completed heat dissipating board structure provides upgraded heat dissipation efficiency and eliminates the problem of thermal resistance. | 01-06-2011 |
20110030922 | BOARD-SHAPED HEAT DISSIPATING DEVICE AND METHOD OF MANUFACTURING THE SAME - A board-shaped heat dissipating device includes a board body having a plane face with a recess formed thereon, a heat conducting element fitted in the recess, at least one groove formed on any one of the board body and the heat conducting element, and at least one heat pipe pressed into the groove to flush with an open side of the groove. After the heat pipe is pressed into the groove and the heat conducting element is firmly fitted in the recess, portions of the heat conducting element that are higher than the plane face are removed through a cut operation, so that the heat conducting element is flush with the plane face of the board body to reduce the space occupied by the heat dissipating device. With the above arrangements, the problem of thermal resistance can be avoided and upgraded overall heat dissipation efficiency can be achieved. | 02-10-2011 |
20120117804 | BOARD-SHAPED HEAT DISSIPATING METHOD OF MANUFACTURING - A board-shaped heat dissipating device includes a board body having a plane face with a recess formed thereon, a heat conducting element fitted in the recess, at least one groove formed on any one of the board body and the heat conducting element, and at least one heat pipe pressed into the groove to flush with an open side of the groove. After the heat pipe is pressed into the groove and the heat conducting element is firmly fitted in the recess, portions of the heat conducting element that are higher than the plane face are removed through a cut operation, so that the heat conducting element is flush with the plane face of the board body to reduce the space occupied by the heat dissipating device. With the above arrangements, the problem of thermal resistance can be avoided and upgraded overall heat dissipation efficiency can be achieved. | 05-17-2012 |