Patent application number | Description | Published |
20090078985 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND A METHOD OF MANUFACTURING THE SAME - The memory cell transistor includes, in a first well region, a pair of memory electrodes, one of which serves as source electrode and the other serves as drain electrode and a channel region interposed between the pair of memory electrodes. There is, on a channel region, a first gate electrode disposed near its corresponding memory electrode with an insulating film interposed therebetween, and a second gate electrode disposed through insulating films and a charge storage region and electrically isolated from the first gate electrode. A first negative voltage is applied to the first well region to form a state of reverse bias greater than or equal to a junction withstand voltage between the second gate electrode and the memory electrode near the second gate electrode, thereby enabling injection of hot electrons into the charge storage region and injection of electrons from the well region to the charge storage region. | 03-26-2009 |
20090233431 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND A METHOD OF MANUFACTURING THE SAME - Manufacturing technique for an IC device which includes forming the first conductor film over a memory cell forming region and over a peripheral circuit forming region of a semiconductor substrate, patterning the first conductive film lying over the memory cell forming region to form a first conductive pattern which serves as a first or control gate electrode of a memory cell and leaving the first conductive film over the peripheral circuit forming region, forming a second conductive film over both the memory cell forming region and the first conductive film in the peripheral circuit forming region, etching the second conductive film to form a second or memory gate electrode of the memory cell on at least a side wall of the first conductive pattern, and followed by the formation of a gate electrode of a peripheral circuit transistor by etching the first conductive film in the peripheral circuit forming region. | 09-17-2009 |
20100320524 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND A METHOD OF MANUFACTURING THE SAME - A semiconductor device having a nonvolatile memory cell which includes a semiconductor substrate, a first insulating film formed over the semiconductor substrate, a control electrode formed over the first insulating film, the first insulating film acting as a gate insulator for the control gate electrode, a second insulating film formed over the semiconductor substrate, and a memory gate electrode formed over the second insulating film and being adjacent to the control gate electrode, the second insulating film acting as a gate insulator for the memory gate electrode and featuring a non-conductive charge trap film, the control gate electrode having a different type conductivity than that of the memory gate electrode. The second insulating film may be a laminated multi-layered insulator featuring a non-conductive charge trap film as an intermediate layer therein which is made of a silicon nitride film. | 12-23-2010 |
20110198681 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND A METHOD OF MANUFACTURING THE SAME - A semiconductor device having a nonvolatile memory cell which includes a semiconductor substrate, a first insulating film formed over the semiconductor substrate, a control electrode formed over the first insulating film, the first insulating film acting as a gate insulator for the control gate electrode, a second insulating film formed over the semiconductor substrate, and a memory gate electrode formed over the second insulating film and being adjacent to the control gate electrode, the second insulating film acting as a gate insulator for the memory gate electrode and featuring a non-conductive charge trap film, the control gate electrode having a different type conductivity than that of the memory gate electrode. A manufacturing technique for a semiconductor device including a nonvolatile memory cell having control gate and memory gate electrodes is also featured. | 08-18-2011 |
20120261743 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND A METHOD OF MANUFACTURING THE SAME - A semiconductor device having plural memory cell regions featuring nonvolatile memory cells, each nonvolatile memory cell including a first insulating film formed over a semiconductor substrate, a control electrode formed over the first insulating film, the first insulating film acting as a gate insulator for the control gate electrode, a second insulating film formed over the semiconductor substrate, and a memory gate electrode formed over the second insulating film and arranged adjacent with the control gate electrode through the second gate insulating film, the second insulating film acting as a gate insulator for the memory gate electrode and featuring a non-conductive charge trap film, wherein each of the nonvolatile memory cells of a first memory cell region and each of the nonvolatile memory cells of a second memory cell region are formed adjacent to one another such that a drain region is shared between them. | 10-18-2012 |
20130313630 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND A METHOD OF MANUFACTURING THE SAME - Semiconductor device including a memory cell featuring a first gate insulating film over a semiconductor substrate, a control gate electrode over the first gate insulating film, a second gate insulating film over the substrate and a side wall of the control gate electrode, a memory gate electrode over the second gate insulating film arranged adjacent with the control gate electrode through the second gate insulating film, first and second semiconductor regions in the substrate positioned on a control gate electrode side and a memory gate side, respectively, the second gate insulating film featuring a first film over the substrate, a charge storage film over the first film and a third film over the second film, the first film having a first portion between the substrate and memory gate electrode and a thickness greater than that of a second portion between the control gate electrode and the memory gate electrode. | 11-28-2013 |
20140197474 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND A METHOD OF MANUFACTURING THE SAME - Semiconductor device including a memory cell featuring a first gate insulating film over a semiconductor substrate, a control gate electrode over the first gate insulating film, a second gate insulating film over the substrate and a side wall of the control gate electrode, a memory gate electrode over the second gate insulating film arranged adjacent with the control gate electrode through the second gate insulating film, first and second semiconductor regions in the substrate positioned on a control gate electrode side and a memory gate side, respectively, the second gate insulating film featuring a first film over the substrate, a charge storage film over the first film and a third film over the second film, the first film having a first portion between the substrate and memory gate electrode and a thickness greater than that of a second portion between the control gate electrode and the memory gate electrode. | 07-17-2014 |
20150155294 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND A METHOD OF MANUFACTURING THE SAME - Semiconductor device including a memory cell featuring a first gate insulating film over a semiconductor substrate, a control gate electrode over the first gate insulating film, a second gate insulating film over the substrate and a side wall of the control gate electrode, a memory gate electrode over the second gate insulating film arranged adjacent with the control gate electrode through the second gate insulating film, first and second semiconductor regions in the substrate positioned on a control gate electrode side and a memory gate side, respectively, the second gate insulating film featuring a first film over the substrate, a charge storage film over the first film and a third film over the second film, the first film having a first portion between the substrate and memory gate electrode and a thickness greater than that of a second portion between the control gate electrode and the memory gate electrode. | 06-04-2015 |