Shive
Bryan S. Shive, Myerstown, PA US
Patent application number | Description | Published |
---|---|---|
20110067636 | INDEXED FEED DISPENSING MECHANISM - An improved livestock feeder provided with an adjustable feed dispensing mechanism including control levers which are operatively connected to the feed metering gates to control the flow of feed to livestock. The dispensing mechanism features a control lever which engage an array of indexing holes formed in the feeder to position the feed gate within the opening to adjust the amount of feed dispensed from the hopper. The dispensing mechanism includes a graduated scale corresponding to each of the index holes to provide a standard setting for the feeder which can be utilized by an animal producer to supply of feed flow at a given stage in the animal's life cycle to obtain a desired growth rate. | 03-24-2011 |
20110253052 | INDEXED FEED DISPENSING MECHANISM - An improved livestock feeder provided with an adjustable feed dispensing mechanism including control levers which are operatively connected to the feed metering gates to control the flow of feed to livestock. The dispensing mechanism features a control lever which engage an array of indexing holes formed in the feeder to position the feed gate within the opening to adjust the amount of feed dispensed from the hopper. The dispensing mechanism includes a graduated scale corresponding to each of the index holes to provide a standard setting for the feeder which can be utilized by an animal producer to supply of feed flow at a given stage in the animal's life cycle to obtain a desired growth rate. | 10-20-2011 |
20130160713 | INDEXED FEED DISPENSING MECHANISM - An improved livestock feeder provided with an adjustable feed dispensing mechanism including control levers which are operatively connected to the feed metering gates to control the flow of feed to livestock. The dispensing mechanism features a control lever which engage an array of indexing holes formed in the feeder to position the feed gate within the opening to adjust the amount of feed dispensed from the hopper. The dispensing mechanism includes a graduated scale corresponding to each of the index holes to provide a standard setting for the feeder which can be utilized by an animal producer to supply of feed flow at a given stage in the animal's life cycle to obtain a desired growth rate. | 06-27-2013 |
20140060440 | Indexed Feed Dispensing Mechanism - An improved livestock feeder provided with an adjustable feed dispensing mechanism including control levers which are operatively connected to the feed metering gates to control the flow of feed to livestock. The dispensing mechanism features a control lever which engage an array of indexing holes formed in the feeder to position the feed gate within the opening to adjust the amount of feed dispensed from the hopper. The dispensing mechanism includes a graduated scale corresponding to each of the index holes to provide a standard setting for the feeder which can be utilized by an animal producer to supply of feed flow at a given stage in the animal's life cycle to obtain a desired growth rate. | 03-06-2014 |
20150034015 | INDEXED FEED DISPENSING MECHANISM - An improved livestock feeder provided with an adjustable feed dispensing mechanism including control levers which are operatively connected to the feed metering gates to control the flow of feed to livestock. The dispensing mechanism features a control lever which engage an array of indexing holes formed in the feeder to position the feed gate within the opening to adjust the amount of feed dispensed from the hopper. The dispensing mechanism includes a graduated scale corresponding to each of the index holes to provide a standard setting for the feeder which can be utilized by an animal producer to supply of feed flow at a given stage in the animal's life cycle to obtain a desired growth rate. | 02-05-2015 |
John C. Shive, High Point, NC US
Patent application number | Description | Published |
---|---|---|
20160029809 | ENCASED ASYMMETRIC COIL INNERSPRINGS WITH ALTERNATING COIL SPRING ORIENTATIONS - Encased coil innersprings with alternating spring coil orientations utilize a common coil configuration and a uniform encasement or pocket configuration, and wherein the coils have an asymmetrical configuration and the vertical end-up orientation of the coils that is alternated or otherwise varied. Selected coils in different areas or patterns in the array of pocketed coils that form the spring core are inverted, relative to a support surface of the spring core, within the individual pockets. The inverted coils have spring characteristics including spring rate, stiffness and initial deflection force which are different from the spring characteristics of the non-inverted coils due to the asymmetry of the coils along a longitudinal axis. | 02-04-2016 |
Larry W. Shive, St. Charles, MO US
Patent application number | Description | Published |
---|---|---|
20100304022 | Methods of Making Wafer Supports - A method is disclosed for sandblasting a wafer support platform to create a surface having a uniform roughness. Contaminants become embedded in the surface during the sandblasting procedure. A layer is applied over the surface to isolate the contaminants from a supported wafer while maintaining the uniform roughness. | 12-02-2010 |
20110146717 | Systems And Methods For Analysis of Water and Substrates Rinsed in Water - A system and method are disclosed for predicting the amount of contaminants deposited on a substrate, such as a semiconductor wafer, after contact the wafer with water in a container. The contaminants may includes materials that negatively affect the properties of the wafer even when the amount of contaminants deposited on the surface of the wafer is below the threshold level of detection of known systems. The method includes contacting the wafer with water for a first period of time, the wafer having wafer surfaces, drying the wafer, analyzing the wafer to determine contaminants on the wafer surfaces, and predicting the amount of contaminants deposited on the wafer when contacting the wafer with water for a second period of time shorter than the first period of time. | 06-23-2011 |
20140096793 | UV TREATMENT OF POLISHED WAFERS - A method is provided for cleaning a surface of a semiconductor wafer comprising: (a) contacting the front surface of the wafer with a slurry comprising an abrasive agent and a polymeric rheological modifier; (b) contacting the front surface of the semiconductor wafer with an oxidant; and (c) irradiating the front surface of the semiconductor wafer with ultraviolet light. | 04-10-2014 |
Larry Wayne Shive, St. Charles, MO US
Patent application number | Description | Published |
---|---|---|
20100098519 | SUPPORT FOR A SEMICONDUCTOR WAFER IN A HIGH TEMPERATURE ENVIRONMENT - A wafer support for supporting a semiconductor wafer during a process including varied temperature. The wafer support includes a body having a top surface adapted to receive the semiconductor wafer so a portion of the top surface supports the wafer. The top surface has a recessed area including an inclined surface rising from a bottom of the recessed area. The inclined surface has an incline angle that is no more than about ten degrees. | 04-22-2010 |
20130133407 | Methods For Analysis Of Water And Substrates Rinsed In Water - A method is disclosed for determining metal content in a container of water. The method includes contacting a substrate with the water for a predetermined period of time. The substrate is then dried and analyzed to determine the metal content of the substrate surface. A determination is then made of the metal content in the water from the metal content on the substrate surface. | 05-30-2013 |
20140144846 | Methods For The Recycling of Wire-Saw Cutting Fluid - A process is provided for treating coolant fluid used in wire-saw cutting of semiconductor wafers and which contains silicon-containing impurities. The process comprises changing the properties of the used coolant fluid so that the silicon-containing impurities may be filtered and separated from the coolant fluid to thereby yield a coolant fluid filtrate suitable for use in a wire-saw cutting operation. | 05-29-2014 |
20140145309 | Systems For The Recycling of Wire-Saw Cutting Fluid - A process is provided for treating coolant fluid used in wire-saw cutting of semiconductor wafers and which contains silicon-containing impurities. The process comprises changing the properties of the used coolant fluid so that the silicon-containing impurities may be filtered and separated from the coolant fluid to thereby yield a coolant fluid filtrate suitable for use in a wire-saw cutting operation. | 05-29-2014 |