Patent application number | Description | Published |
20090035453 | Pattern forming system, pattern forming method, and electronic apparatus - A pattern forming system including a feeding reel for feeding a tape form substrate that is wound up, a winding reel for winding up the tape form substrate that is fed up, and a droplet discharge apparatus for discharging a droplet onto the tape form substrate, between the feeding reel and the winding reel, to form a pattern, wherein the droplet discharge apparatus includes a table that can move while sucking the tape form substrate, with a slack mechanism for the tape form substrate being placed on the both ends of the table in the longitudinal direction of the tape form substrate. | 02-05-2009 |
20110097515 | PATTERN FORMING SYSTEM, PATTERN FORMING METHOD, AND ELECTRONIC APPARATUS - A pattern forming system including a feeding reel for feeding a tape form substrate that is wound up, a winding reel for winding up the tape form substrate that is fed up, and a droplet discharge apparatus for discharging a droplet onto the tape form substrate, between the feeding reel and the winding reel, to form a pattern, wherein the droplet discharge apparatus includes a table that can move while sucking the tape form substrate, with a slack mechanism for the tape form substrate being placed on the both ends of the table in the longitudinal direction of the tape form substrate. | 04-28-2011 |
Patent application number | Description | Published |
20090071706 | METHOD FOR PRODUCING MULTILAYERED WIRING SUBSTRATE, MULTILAYERED WIRING SUBSTRATE, AND ELECTRONIC APPARATUS - A method for producing a multilayered wiring substrate includes forming a lyophobic area on a first conductive layer, forming an insulating layer with an opening portion on the first conductive layer by applying a functional liquid containing an insulating layer forming material on a periphery of the lyophobic area, laminating the first conductive layer and a second conductive layer via the insulating layer, and electrically connecting the first and the second conductive layers to each other via the opening portion formed in the insulating layer. In the method, when forming the insulating layer, the functional liquid is applied such that an angle of a portion of the functional liquid in contact with the lyophobic area becomes larger than a forward contact angle of the functional liquid, thereby allowing a position of the portion of the functional liquid in contact with the lyophobic area to move inside the lyophobic area to form the opening portion having an opening size smaller than a size of the lyophobic area. | 03-19-2009 |
20090077798 | METHOD FOR FORMING CONDUCTIVE POST, METHOD FOR MANUFACTURING MULTILAYERED WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS - A method for forming a conductive post include: a) forming a liquid repellent portion having a thickness of 100 nm or less by disposing a liquid repellent material in a conductive post forming region on a conductive layer; b) forming an insulation layer having an opening in a region overlapping with the conductive post forming region by disposing a liquid including an insulation layer forming material on the conductive layer having the liquid repellent portion formed thereon and polymerizing the insulation layer forming material; c) disposing metal particulates in the opening; and d) heating the metal particulates at a fusing temperature of the metal particulates or higher so as to fusion bond the metal particulates to each other in order to form the conductive post, and to fusion bond the metal particulates and the conductive layer in order to couple the conductive post with the conductive layer. | 03-26-2009 |
20090162536 | METHOD FOR FORMING FILM PATTERN, METHOD FOR FORMING CONTACT HOLE, METHOD FOR FORMING BUMP, AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE - A method for forming a film pattern disposed adjacent to a pattern non-forming region by coating a pattern forming region with a functional liquid, includes (a) forming a liquid repellent film by coating the pattern non-forming region with a droplet containing a liquid repellent material having repellency to the functional liquid, and (b) forming the film pattern by coating the pattern forming region adjacent to the liquid repellent film with the functional liquid. The step (a) of forming of the liquid repellent film and the step (b) of forming of the film pattern are alternately repeated at least two times, respectively. | 06-25-2009 |