Patent application number | Description | Published |
20090283895 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device including a metal frame having a penetrating opening; a semiconductor chip provided in the opening; an insulating layer provided on the upper surface of the metal frame such that the insulating layer covers the upper surface, which is the circuit-formed surface of the semiconductor chip; an interconnect layer provided only on the upper-surface side of the metal frame with intervention of the insulating material and electrically connected to a circuit of the semiconductor chip; a via conductor provided on the upper surface of said semiconductor chip to electrically connect the circuit of the semiconductor chip and the interconnect layer; and a resin layer provided on the lower surface of the metal frame. | 11-19-2009 |
20090294951 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device that can be readily manufactured, can include a large number of pads, and can be thin, and a method for manufacturing the same are provided. The semiconductor device is characterized in that the semiconductor device includes an LSI chip, an insulating layer provided on the LSI chip and made of a nonphotosensitive resin, the insulating layer including a via hole in the position corresponding to an externally connected pad, and a wiring layer extending along the insulating layer through the via hole to the externally connected pad, and at least part of the via hole is formed by irradiating the insulating layer with laser light. | 12-03-2009 |
20100044845 | CIRCUIT SUBSTRATE, AN ELECTRONIC DEVICE ARRANGEMENT AND A MANUFACTURING PROCESS FOR THE CIRCUIT SUBSTRATE - [Problem to be Solved] There are provided a circuit substrate, an electronic device arrangement and a manufacturing process for the circuit substrate which enable to directly implement the surface mounting and so on of electronic components on the conductive wiring without forming solder resist, and also which enable to enhance high speed transmission characteristics and to enlarge wiring rule for the electrode terminal of the function element to be contained therein, and to implement with excellent workability and reliability when connecting the electronic device. | 02-25-2010 |
20110215478 | SEMICONDUCTOR ELEMENT-EMBEDDED WIRING SUBSTRATE - In a wiring substrate containing a semiconductor element, the wiring substrate includes a supporting substrate; a semiconductor element provided on the supporting substrate; a peripheral insulating layer covering at least an outer circumferential side surface of the semiconductor element; and upper surface-side wiring provided on the upper surface side of the wiring substrate. The semiconductor element includes a semiconductor substrate; a first wiring-structure layer including first wiring and a first insulating layer alternately formed on the semiconductor substrate; and a second wiring-structure layer including second wiring and a second insulating layer alternately formed on the first wiring-structure layer. The upper surface-side wiring includes fan-out wiring led out from immediately above the semiconductor element to a peripheral region external to an outer edge of the semiconductor element. The fan-out wiring is electrically connected to the first wiring through the second wiring. The second wiring is thicker than the first wiring but thinner than the upper surface-side wiring. The second insulating layer is formed of a resin material and is thicker than the first insulating layer. | 09-08-2011 |
20120300425 | FUNCTIONAL ELEMENT BUILT-IN SUBSTRATE AND WIRING SUBSTRATE - An object of the present invention is to propose a functional element built-in substrate which enables an electrode terminal of a functional element to be well connected to the back surface on the side opposite to the electrode terminal of the functional element, and which can be miniaturized. According to the present invention, there is provided a functional element built-in substrate including a functional element provided with an electrode terminal on one surface side of the functional element, and a wiring substrate including a laminated structure in which the functional element is embedded so that the electrode terminal of the functional element faces the front surface side of the structure, and which is formed at least in a side surface region of the functional element by laminating a plurality of wiring insulating layers each including a wiring, the functional element built-in substrate being featured in that the electrode terminal and the back surface side of the wiring substrate are electrically connected to each other through the wiring of the laminated structure, and in that, in a pair of the wiring insulating layers included in the laminated structure and that are in contact with each other, the cross-sectional shape of the wiring in each of the wiring insulating layers, which cross-sectional shape is taken along the plane perpendicular to the extension direction of the wiring in the wiring insulating layer, has a relationship that the cross-sectional area of the wiring in the back surface side wiring insulating layer is larger than the cross-sectional area of the wiring in the front surface side wiring insulating layer. | 11-29-2012 |
20130009325 | SEMICONDUCTOR ELEMENT-EMBEDDED SUBSTRATE, AND METHOD OF MANUFACTURING THE SUBSTRATE - A semiconductor element-embedded substrate includes a semiconductor element; a chip component; a peripheral insulating layer covering at least the outer circumferential side surfaces thereof; an upper surface-side wiring line provided on the upper surface side of the substrate; and a lower surface-side wiring line provided on the lower surface side of the substrate. The built-in semiconductor element includes a terminal on the upper surface side thereof, and this terminal is electrically connected to the upper surface-side wiring line. The built-in chip component includes an upper surface-side terminal electrically connected to the upper surface-side wiring line; a lower surface-side terminal electrically connected to the lower surface-side wiring line; | 01-10-2013 |
20130026632 | SEMICONDUCTOR ELEMENT-EMBEDDED WIRING SUBSTRATE - A wiring substrate in which a semiconductor element is built includes a semiconductor element; a peripheral insulating layer covering at least an outer circumferential side surface of this semiconductor element; and an upper surface-side wiring line provided on the upper surface side of the wiring substrate. The semiconductor element includes an internal terminal electrically connected to the upper surface-side wiring line on the upper surface side of the semiconductor element. This internal terminal includes a first conductive part exposed out of an insulating surface layer of the semiconductor element; an adhesion layer on this first conductive part; and a second conductive part on this adhesion layer. The adhesion layer covers an exposed surface of the first conductive part, and is formed on a portion of the insulating surface layer around the exposed surface of the first conductive part, and the adhesion layer extends around the outer side of an outer edge of this second conductive part so as to surround the second conductive part. | 01-31-2013 |
20150053474 | FUNCTIONAL ELEMENT BUILT-IN SUBSTRATE AND WIRING SUBSTRATE - An object of the present invention is to propose a functional element built-in substrate which enables an electrode terminal of a functional element to be well connected to the back surface on the side opposite to the electrode terminal of the functional element, and which can be miniaturized. According to the present invention, there is provided a functional element built-in substrate including a functional element provided with an electrode terminal on one surface side of the functional element, and a wiring substrate including a laminated structure in which the functional element is embedded so that the electrode terminal of the functional element faces the front surface side of the structure, and which is formed at least in a side surface region of the functional element by laminating a plurality of wiring insulating layers each including a wiring, the functional element built-in substrate being featured in that the electrode terminal and the back surface side of the wiring substrate are electrically connected to each other through the wiring of the laminated structure, and in that, in a pair of the wiring insulating layers included in the laminated structure and that are in contact with each other, the cross-sectional shape of the wiring in each of the wiring insulating layers, which cross-sectional shape is taken along the plane perpendicular to the extension direction of the wiring in the wiring insulating layer, has a relationship that the cross-sectional area of the wiring in the back surface side wiring insulating layer is larger than the cross-sectional area of the wiring in the front surface side wiring insulating layer. | 02-26-2015 |