Patent application number | Description | Published |
20090314474 | HEAT SINK FOR POWER MODULE - A heat sink for a power module able to realize a further improvement of heat radiating performance and a further improvement of a mounting property is provided. | 12-24-2009 |
20100002397 | BASE FOR POWER MODULE - A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components required for a power module, such as a casing, can be attached onto the component attachment plate. | 01-07-2010 |
20110180248 | Method for Surface Treating a Heat Exchanger, Hydrophilizing Treatment Agent, and Aluminum Heat Exchanger - A method for surface treating a heat exchanger, a hydrophilizing treatment agent used in this method, and an aluminum heat exchanger obtained from this method are provided that excel in the initial adherence, hydrophilicity, and odor suppressibility, and can maintain these abilities for an extended time, while having little burden on the environment and the human body. The method for surface treating an aluminum heat exchanger that is brazed includes (1) a pickling treatment step; (2) a chemical conversion treatment step; and (3) a hydrophilization treatment step, in which the acidic cleaning agent contains nitric acid and sulfuric acid and contains ferric salt in a predetermined amount, the hydrophilizing treatment agent contains silica grains coated with a vinyl alcohol polymer and a polyallylamine resin. | 07-28-2011 |
20110180249 | METHOD FOR SURFACE TREATING A HEAT EXCHANGER, SURFACE TREATMENT AGENT, AND ALUMINUM HEAT EXCHANGER - A method for surface treating a heat exchanger and an aluminum heat exchanger obtained from this method are provided that can effectively suppress the foul odor characteristic to flux that emanates following degradation of a hydrophilic coating film and a chemical conversion coating film in a non-corrosive flux brazed heat exchanger on which flux easily remains. The method for surface treating a non-corrosive flux brazed heat exchanger made of an aluminum material conducts a pickling treatment step, a chemical conversion treatment step, and a deodorizing treatment step on the heat exchanger, in which the acidic cleaning agent contains nitric acid and sulfuric acid as well as a predetermined amount of ferric salt, and the surface treatment agent contains silica grains coated by a vinyl alcohol polymer and polyallylamine resin such that the total content of the silica grains and the vinyl alcohol polymer is a predetermined amount. | 07-28-2011 |
Patent application number | Description | Published |
20080290499 | Semiconductor device - A semiconductor device is disclosed that includes a ceramic substrate having first and second surfaces, a semiconductor element, a radiator, and an interposed portion located between the second surface and the radiator. The interposed portion has coupling regions that couple the second surface to the radiator, and non-coupling regions that do not couple the second surface to the radiator. Each non-coupling region is formed as an elongated groove. In the group of the non-coupling regions, the width of the outermost non-coupling region in the interposed portion is greater than the width of the innermost non-coupling region in the interposed portion. Regarding an adjacent pair of the non-coupling regions in the width direction, the width of the outer non-coupling region is greater than or equal to the width of the inner non-coupling region. | 11-27-2008 |
20080290500 | Semiconductor device - A semiconductor device has a ceramic substrate having a first surface and a second surface, a metal layer that is coupled to the second surface, a heat sink that is coupled to the metal layer and a stress relaxation member. The stress relaxation member is arranged between the metal layer and the heat sink and has a first surface that is coupled to the metal layer and a second surface that is coupled to the heat sink. A plurality of stress relaxation spaces are provided over the entire surface of at least one of the first and second surfaces of the stress relaxation member. The stress relaxation spaces that are arranged at the outermost portions of the stress relaxation member are deeper than the other stress relaxation spaces. | 11-27-2008 |
20090139704 | HEAT SINK DEVICE - A heat radiator | 06-04-2009 |
20090174063 | Semiconductor Module - A semiconductor module | 07-09-2009 |
20090200065 | HEAT DISSIPATION DEVICE AND POWER MODULE - A heat radiator | 08-13-2009 |
20090302458 | Heat Sink For Power Module - A heat sink ( | 12-10-2009 |
20120113598 | BASE FOR POWER MODULE - A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components for a power module, such as a casing, can be attached onto the component attachment plate. | 05-10-2012 |
20140140004 | HEAT SINK FOR POWER MODULE - A power module includes a power device and a heat sink. The heat sink includes a refrigerant passage in which a cooling medium flows and a corrugated fin body arranged in the refrigerant passage. The refrigerant passage is defined by a surface and a backside, and the power device is disposed in proximity to the surface. The corrugated fin body has crests and troughs that extend in the flow direction of the cooling medium and side walls each of which connects the corresponding one of the crests with the adjacent one of the troughs. Each adjacent pair of the side walls and the corresponding one of the crests or the corresponding one of the troughs arranged between the adjacent side walls form a fin. A guide that extends in the flow direction of the cooling medium and operates to stir the cooling medium is arranged in each of the fins. | 05-22-2014 |