Patent application number | Description | Published |
20110051202 | Traveling unit driving apparatus and image reading apparatus provided with the driving apparatus - Provided is a traveling unit driving apparatus where a driving belt of the traveling unit is manufactured with ease, and concurrently therewith, can be coupled reliably to the unit in a state with high durability. | 03-03-2011 |
20120307322 | IMAGE READING APPARATUS - An apparatus is provided capable of guiding regular reflected light from a reading surface to a reflecting mirror when light is irradiated from two directions from light sources to the reading surface, and is suitable to read a gloss image. The light sources for irradiating light to the reading surface from the two directions of different angles are configured of a first light emitter and a second light emitter, a mirror reflecting surface for specularly reflecting light and a translucent surface for passing light therethrough being formed on the surface of a reflecting member for deflecting light from the reading surface to a predetermined reading light path direction, the first light emitter being arranged between the platen and the platen side surface of the reflecting member, the second light emitter being arranged at the back surface of the reflecting member so as to irradiate light on the reading surface through the translucent surface. | 12-06-2012 |
20130314756 | ILLUMINATION DEVICE - To provide an illumination device in which there is no variation in light intensity distribution of the illumination device, and in which illumination spots, particularly light intensity spots, are not prone to occur in a read image in an image reading device, by maintaining a constant gap between a light source and an end face of a light guide. The illumination device includes: a light guide having an end face for taking in light, a diffuse reflecting surface for diffusely reflecting the light taken in from the end face, and a light exit surface for emitting the light that is diffusely reflected at the diffuse reflecting surface towards an irradiation surface. The illumination device further include a reflector having a diffuse reflecting surface that reflects light from the light source toward the one end face of the light guide. The light guide has, at the one end, a flange portion that abuts the reflector, the light source is mounted to a circuit board, and the reflector is held between the flange portion of the light guide and circuit board so as to maintain a predetermined gap between the light source and light guide. | 11-28-2013 |
20140111835 | IMAGE SCANNING UNIT - Provided is an image scanning unit which makes it possible to improve scanning accuracy while also making the overall body thinner by appropriately positioning a plurality of reflection members within an effective space in a carriage frame without wasting space. An image scanning unit, wherein a frame is divided into at least two spaces facing an irradiation surface, a first accommodation unit for accommodating a light source unit is formed in one of the spaces, a second accommodation unit for accommodating at least one reflection member is formed in the other adjacent space, a first reflection member for initially receiving light reflected from the irradiation surface is positioned at the side opposite the irradiation surface with the first accommodation unit positioned therebetween, and a light-shielding member is provided between the first reflection member and the reflection member positioned in the other space and prevents light that has strayed from a scanning light path from the first reflection member from being incident on the reflection member in the other space. | 04-24-2014 |
20150288842 | ILLUMINATION DEVICE AND IMAGE READING DEVICE USING SAID ILLUMINATION DEVICE - Provided are: an illumination device having a configuration in which a temperature rise of a radiation member is suppressed in a limited volume to thereby maintain a temperature of an LED at a predetermined value or less and an image reading device provided with the illumination device. In order to release heat generated by the LED from a substrate on which the LED is mounted, a first heat radiation plate ( | 10-08-2015 |
20150288844 | DOCUMENT READING DEVICE - Provided is a document reading device capable of performing shading correction and making it difficult for foreign matters to enter inside the device. A document reading device includes a reading unit, a glass unit, and a closing member. The reading unit has a light source and reads a document. The glass unit has a glass plate that transmits light emitted from the light source and a reference member serving as a reference for shading correction of a reading optical system. The glass unit is disposed with a space provided with respect to the reading unit and slid between a first position where the light emitted from the light source transmits the glass plate and a second position where the light emitted from the light source reaches the reference member with the space being maintained. The closing member is positioned downstream of the glass plate and the reference member of the glass unit in a document conveying direction and fills at least a part of the space provided between the reading unit and the glass unit. | 10-08-2015 |
Patent application number | Description | Published |
20160029807 | BOTTOM FOR BED APPARATUS - To provide a bottom for a bed apparatus that can make the user feel comfortable when lying on the bed apparatus. The bottom for a bed apparatus, which is height adjustable and is mounted on the top of a bed apparatus, comprising a plurality of parts each formed of a resin plate having a thickness, including a back bottom, a hip bottom, a knee bottom and a foot bottom. Of the parts, essential parts are joined by connecting parts, and the connecting parts are formed of the same material with, to be thinner than, and integrally with, the essential parts, and, depressed portions are formed on the top surface of the bottom around the center in the width direction of the bottom, and a plurality of passage holes are perforated in the depressed portions from the top surface to the undersurface of the bottom. | 02-04-2016 |
20160037936 | BOTTOM FOR BED APPARATUS - To provide a bottom for a bed apparatus that can relieve the sensation of being pressed and that at the same time is lightweight, easy to transport and can be cleaned easily. A bottom for a bed apparatus having a back-raising mechanism, includes a flexing bottom that is arranged between a back bottom and a hip bottom and can be flexed. In a back-raising operation, the flexing bottom flexes between the back bottom and the hip bottom whilst sliding downward over the surface of the uprising back bottom. | 02-11-2016 |
20160051428 | BED APPARATUS AND BED APPARATUS CONTROL METHOD - In the present invention, in accordance with a tilt and back-raising command (Step S | 02-25-2016 |
20160067127 | BED APPARATUS - A bed apparatus including, at least, two drivers or a first driver and a second driver, the first driver being in linkage with the second driver, comprises: a calculating means for calculating a calculated bed state value, based on the first driver and the second driver; an error detecting means for detecting error between the calculated bed state value and a designated bed state value designated by the user; and, an error correcting means for correcting the detected error when an error is detected by the error detecting means. As a result, it is possible to provide a bed apparatus that can coincide the designated state of the bed apparatus with the actual state of the bed apparatus by appropriately correcting the error between the drivers. | 03-10-2016 |
Patent application number | Description | Published |
20100208437 | MULTILAYER WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A multilayer wiring substrate of the present invention has a laminated structure composed of conductor layers and resin insulating layers stacked alternately. A plurality of surface connection terminals to which terminals of a chip component are to be surface-connected are formed on a main face of the laminated structure. A plurality of via conductors connected to the plurality of surface connection terminals are formed in the resin insulating layers. Each of the plurality of surface connection terminals has a structure in which a copper layer, a nickel layer, and a gold layer are stacked in this sequence. The gold layer is larger in diameter than at least the copper layer. The gold layer has an overhanging portion which extends radially outward from a circumference of the copper layer. | 08-19-2010 |
20100208442 | WIRING BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF - A wiring board assembly includes a rectangular plate-shaped wiring board having a plurality of resin insulation layers and conduction layers alternately laminated together to define opposite first and second main surfaces and a plurality of connection terminals arranged on the first main surface for surface contact with terminals of a chip and a rectangular frame-shaped reinforcing member fixed to the first main surface of the wiring board with the connection terminals exposed through an opening of the reinforcing member. The reinforcing member has a plurality of structural pieces separated by slits extending from an inner circumferential surface to an outer circumferential surface of the reinforcing member. | 08-19-2010 |
20110155438 | Multilayer Wiring Substrate - A multilayer wiring substrate has a multilayer wiring laminate portion in which a plurality of resin insulation layers made primarily of the same resin insulation material, and a plurality of conductive layers are laminated alternately. A plurality of first-main-surface-side connection terminals are disposed on one side of the laminate structure where a first main surface thereof is present, and a plurality of second-main-surface-side connection terminals being disposed on an other side of the laminate structure where a second main surface thereof is present. The plurality of conductive layers are formed in the plurality of resin insulation layers and interconnected by means of via conductors whose diameters increase toward the first main surface or the second main surface. The plurality of first-main-surface-side connection terminals comprising at least two types of terminals for connection of different articles-to-be-connected. Top surfaces of the plurality of first-main-surface-side connection terminals differ in height according to types of the articles-to-be-connected. | 06-30-2011 |
20110155443 | Method of Manufacturing Multilayer Wiring Substrate, and Multilayer Wiring Substrate - In a build-up step, a plurality of resin insulation layers and a plurality of conductive layers are alternately laminated in multilayer arrangement on a metal foil separably laminated on a side of a base material, thereby forming a wiring laminate portion. In a drilling step, a plurality of openings are formed in an outermost resin insulation layer through laser drilling so as to expose connection terminals. Subsequently, in a desmear step, smears from inside the openings are removed. In a base-material removing step performed after the build-up step, the base material is removed and the metal foil is exposed. | 06-30-2011 |
20110156272 | Multilayered Wiring Substrate - A multilayered wiring substrate, comprising: a plurality of first main surface side connecting terminals arranged in a first main surface of a stack structure; and a plurality of second main surface side connecting terminals being arranged in a second main surface of the stack structure; wherein a plurality of conductor layers are alternately formed in a plurality of stacked resin insulation layers and are operably connected to each other through via conductors tapered such that diameters thereof are widened toward the first or the second main surface, wherein a plurality of openings are formed in an exposed outermost resin insulation layer in the second main surface, and terminal outer surfaces of the second main surface side connecting terminals arranged to match with the plurality of the openings are positioned inwardly from an outer main surface of the exposed outermost resin insulation layer, and edges of terminal inner surfaces are rounded. | 06-30-2011 |
20110198114 | Multilayer Wiring Substrate, and Method of Manufacturing the Same - A plurality of openings are formed in a resin insulation layer on a top surface side of a wiring laminate portion, and a plurality of openings are formed in a resin insulation layer on a bottom surface side thereof. A plurality of connection terminals are disposed to correspond to the openings. Peripheral portions of terminal outer surfaces of the connection terminals are covered by the resin insulation layer on the top surface side, and peripheral portions of terminal outer surfaces of the connection terminals are covered by the resin insulation layer on the bottom surface side. Each of the second-main-surface-side connection terminals has a concave portion at the center of the terminal outer surface, and the deepest portion of the concave portion is located on the interior side in relation to the peripheral portion of the terminal outer surface. | 08-18-2011 |
20110200788 | Method of Manufacturing Multilayer Wiring Substrate, and Multilayer Wiring Substrate - A plurality of openings are formed in a resin insulation layer on a bottom surface side of a wiring laminate portion which constitutes a multilayer wiring substrate. A plurality of motherboard connection terminals are disposed to correspond to the openings. The motherboard connection terminals are primarily comprised of a copper layer, and peripheral portions of terminal outer surfaces thereof are covered by the outermost resin insulation layer. A dissimilar metal layer made of at least one metal which is lower in etching rate than copper is formed between an inner main surface of the outermost resin insulation layer and peripheral portions of the terminal outer surfaces. | 08-18-2011 |
20110209910 | Multilayered Wiring Board and Method of Manufacturing the Same - A multilayered wiring board having a stack structure multilayered by alternately stacking a plurality of conductor layers and a plurality of resin insulation layers, wherein a solder resist is provided on at least one of a first main surface side and a second main surface side of the stack structure, a plurality of openings are formed in an outermost resin insulation layer that contacts with the solder resist, a plurality of the first main surface side connecting terminals or a plurality of the second main surface side connecting terminals being made of a copper layer as a main component and positioned in a plurality of the openings, terminal outer surfaces being positioned inwardly from an outer surface of the outermost resin insulation layer, and the solder resist extends into the plurality of openings and makes contact with an outer circumference portion of each of the terminal outer surfaces. | 09-01-2011 |
20110211320 | Multilayer Wiring Substrate and Method of Manufacturing the Same - A multilayer wiring substrate includes first principal surface side connection terminals arranged on a first principal surface of a stacked configuration; wherein, the first principal surface side connection terminals include an IC chip connection terminal, and a passive element connection terminal; the IC chip connection terminal is located in an opening formed in a resin insulating layer of an uppermost outer layer; the passive element connection terminal is formed of an upper terminal part formed on the resin insulating layer, and a lower terminal part located in an opening formed at a portion of an inner side of the upper terminal part in the resin insulating layer; and, wherein an upper face of the upper terminal part is higher than a reference surface, and an upper face of the IC chip connection terminal and the lower terminal part are identical in height to or lower in height than the reference surface. | 09-01-2011 |
20110232951 | MULTILAYER WIRING SUBSTRATE - In a wiring laminate portion of a multilayer wiring substrate, a solder resist layer having a plurality of openings is disposed on a main surface side of the laminate structure, and connection terminals are embedded in an outermost resin insulation layer in contact with the solder resist layer. Each of the connection terminals comprises a copper layer and a metallic layer formed of at least one type of metal other than copper. A main-surface-side circumferential portion of the copper layer is covered by the solder resist layer. At least a portion of the metallic layer is located in a recess in a main-surface-side central portion of the copper layer. At least a portion of the metallic layer is exposed via a corresponding opening. | 09-29-2011 |
20110284269 | MULTILAYER WIRING SUBSTRATE - To provide a multilayer wiring substrate which can prevent migration of copper between wiring traces to thereby realize a higher degree of integration, a solder resist layer | 11-24-2011 |
20120018194 | MULTILAYER WIRING BOARD AND MANUFACTURING METHOD THEREOF - Disclosed is a manufacturing method of a multilayer wiring board. The multilayer wiring board includes an outer resin insulation layer made of an insulating resin material, containing a filler of inorganic filler and having an outer surface defining a chip mounting area to which an electronic chip is mounted with an underfill material filled in between the outer resin insulation layer and the electronic chip and holes through which conductor parts are exposed. The manufacturing method includes a hole forming step of forming the holes in the outer resin insulation layer by laser processing, a desmear treatment step of, after the hole forming step, removing smears from inside the holes of the outer resin insulation layer, and a filler reducing step of, after the desmear treatment step, reducing the amount of the filler exposed at the outer surface of the outer resin insulation layer. | 01-26-2012 |
20120024582 | MULTILAYER WIRING SUBSTRATE - A multilayer wiring substrate includes a laminate structure in which resin insulation layers and conductor layers are alternately laminated. The resin insulation layers include first-type resin insulation layers, and second-type resin insulation layers, each of which contains an inorganic material in a larger amount and is smaller in thermal expansion coefficient as compared with first-type resin insulation layers. On a cross section of the laminate structure taken along a thickness direction thereof, the ratio of a total thickness of the second-type resin insulation layers located in an area A | 02-02-2012 |
20120097319 | METHOD OF MANUFACTURING MULTILAYER WIRING SUBSTRATE - A method of manufacturing a multilayer wiring substrate of the present invention includes a preparation step of preparing a sheet-like insulation core having a thickness of 100 μm or less; a drilling step of forming through-holes which are open at a front surface and a back surface of the insulation core by subjecting the insulation core to laser drilling; a conductor forming step of forming, through electroless copper plating and subsequent copper electroplating, through-hole conductors which completely fill the corresponding through-holes of the insulation core and a respective conductor layer on each of the front surface and the back surface of the insulation core; and a lamination step of laminating a plurality of resin insulation layers and a plurality of conductor layers alternately in multilayer arrangement on each respective conductor layer on the front surface and the back surface of the insulation core. | 04-26-2012 |
20120102732 | METHOD OF MANUFACTURING MULTILAYER WIRING SUBSTRATE - A method of manufacturing a multilayer wiring substrate is provided. A foil of a metal-foil-clad resin insulation material is brought into contact with a foil of a metal-foil-clad support substrate. A peripheral edge portion of the resin insulation material exposed as a result of removal of a peripheral edge portion of the foil is adhered to the foil of the support substrate. A plurality of conductor layers and a plurality of resin insulation layers are laminated so as to obtain a laminate structure having a wiring laminate portion, which is to become the multilayer wiring substrate. The laminate structure is cut along a boundary between the wiring laminate portion and a surrounding portion, and the surrounding portion is removed. The wiring laminate portion is separated from the support substrate along the boundary between the two foils. | 05-03-2012 |
20120111624 | MULTILAYER WIRING SUBSTRATE - A multilayer wiring substrate has a main face and a back face, and a configuration in which a plurality of resin insulation layers and a plurality of conductor layers are laminated. A plurality of conductor layers provided on the side toward the back face in relation to a resin insulation layer serving as a center layer are formed such that the average of their area ratios becomes greater than the average of area ratios of a plurality of conductor layers provided on the side toward the main face in relation to the center layer. A plurality of resin insulation layers provided on the side toward the back face are formed such that the average of their thicknesses becomes greater than the average of thicknesses of a plurality of resin insulation layers provided on the side toward the main face. | 05-10-2012 |
20120145666 | METHOD OF MANUFACTURING MULTILAYER WIRING SUBSTRATE - In order to provide a method of manufacturing a multilayer wiring substrate, a base member having a copper foil separably laminated thereon is prepared, and a solder resist layer is formed on the copper foil. Openings are formed in the solder resist layer, and a metal conductor portion is formed in each of the openings. By means of sputtering, a dissimilar metal layer is formed over the surface of the metal conductor portion and the entire surface of the solder resist layer. Copper electroplating is performed so as to form connection terminals and a conductor layer on the dissimilar metal layer. After a build-up step, the base material is removed, whereby the copper foil is exposed, and the exposed copper foil and the metal conductor portion are removed through etching, whereby the surfaces of the external connection terminals are exposed from the openings. | 06-14-2012 |
20120153463 | MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - To provide a multilayer wiring substrate in which the connection reliability of via conductors is enhanced, via holes are formed in a resin interlayer insulation layer which isolates a lower conductor layer from an upper conductor layer, and via conductors are formed in the via holes for connecting the lower conductor layer and the upper conductor layer. The surface of the resin interlayer insulation layer is a rough surface, and the via holes open at the rough surface of the resin interlayer insulation layer. Stepped portions are formed in opening verge regions around the via holes such that the stepped portions are recessed from peripheral regions around the opening verge regions. The stepped portions are higher in surface roughness than the peripheral regions. | 06-21-2012 |
20120312590 | METHOD OF MANUFACTURING MULTILAYER WIRING SUBSTRATE, AND MULTILAYER WIRING SUBSTRATE - Disclosed is a method of manufacturing a multilayer wiring substrate having a principal plane of the substrate and a rear plane thereof, having a structure such that a plurality of resin insulating layers and a plurality of conductor layers are laminated, and a plurality of chip component connecting terminals to which chip components are connectable are disposed on the principal plane of the substrate. This method has a feature including a plating layer forming process in which product plating layers which provide the plurality of chip component connecting terminals and a dummy plating layer on the surrounding of the product plating layers are formed on the surface of an exposed outermost resin insulating layer at the principal plane of the substrate. This method permits a thickness dispersion of the chip component connecting terminals to be suppressed and permits a connection reliability thereof to the chip components to be increased. | 12-13-2012 |
20130111746 | METHOD OF MANUFACTURING MULTILAYER WIRING SUBSTRATE - A method of manufacturing a multilayer wiring substrate includes: a first laminate structure formation step of forming a first laminate structure on a support substrate, the first laminate structure including at least one conductor layer and at least one resin insulation layer; a core substrate formation step of laminating a core substrate on the first laminate structure such that a lower main surface of the core substrate comes in contact with the first laminate structure, the core substrate having a metal layer provided on an upper main surface thereof; and a second laminate structure formation step of forming a second laminate structure on the core substrate such that the second laminate structure covers the metal layer, the second laminate structure including at least one conductor layer and at least one resin insulation layer. | 05-09-2013 |
20130160290 | METHOD OF MANUFACTURING MULTI-LAYER WIRING BOARD - Embodiments of the presently-disclosed subject matter include a first laminated structure in which at least one conductor layer and at least one resin insulating layer are alternately formed is formed on a supporting substrate, and a core substrate is formed so as to come into contact with the conductor layer which is the uppermost layer of the first laminated structure. Then, laser light is emitted to the core substrate to form a through hole and a metal layer is formed in the through hole. Then, a second laminated structure including at least one conductor layer and at least one resin insulating layer is formed on the core substrate. At that time, the thickness of the conductor layer which is the uppermost layer of the first laminated structure is greater than that of the other conductor layers. | 06-27-2013 |
20130161079 | MULTI-LAYER WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - Embodiments of the presently-disclosed subject matter include a multilayer wiring substrate including a first laminated structure that includes at least one conductive layer and at least one resin insulating layer; a core substrate that includes a reinforced fiber and that is laminated on the first laminated structure; and a second laminated structure that includes at least one conductive layer and at least one resin insulating layer and that is formed on the core substrate; and a plurality of via conductors which penetrate the first laminated structure, the core substrate, and the second laminated structure in the thickness direction, wherein the plurality of via conductors all expand in diameter in one direction, and the reinforced fiber is located above a center of the core substrate in the thickness direction. | 06-27-2013 |
20130232784 | METHOD OF MANUFACTURING WIRING SUBSTRATE - A method of manufacturing a wiring substrate includes: a process of forming a first laminate structure in which one or more conductor layers and one or more resin insulating layers are laminated on a supporting substrate; a process of laminating a metal core substrate, which has a metal layer disposed on the top main surface thereof, on the first laminate structure so that a bottom main surface of the metal core substrate comes in contact with the first laminate structure, and a process of forming a second laminate structure in which one or more conductor layers and one or more resin insulating layers are laminated on the metal core substrate. | 09-12-2013 |
20140216796 | MULTILAYER WIRING SUBSTRATE - To provide a multilayer wiring board that ensures sufficient close contact strength between a conformal type conductor and a resin insulating layer. A multilayer wiring board includes a multilayered construction where a plurality of resin insulating layers and a plurality of conductor layers are alternately layered. In each of a plurality of via holes formed in the resin insulating layers, a conformal via conductor is formed to electrically connect between the conductor layers. Filling up parts of the resin insulating layers layered at upper layer side inside of the conformal via conductor forms an anchor portion. The lower end side of the anchor portion bulges larger than the upper end side in the radially outward direction of the via hole. | 08-07-2014 |
20140290997 | MULTILAYER WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - To provide a multilayer wiring board that ensures sufficient adhesion between a resin insulating layer and a conductor layer and is excellent in connection reliability. | 10-02-2014 |