Shinma, JP
Daisuke Shinma, Tokyo JP
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20140096613 | PRESSURE TRANSMITTER AND TRANSMISSION METHOD - Hydrogen which has entered into a pressure/differential pressure transmitter from external or internally generated hydrogen and hydrocarbons are converted to air bubbles within pressure guide paths. As a result, the indicated value drifts and an accurate numerical value is not output. A pressure/differential pressure transmitter includes a space formed between a diaphragm and a main body side wall face, pressure guide paths connected to the main body side wall face, a sealed liquid sealed in the space and the pressure guide paths to transmit a pressure received by the diaphragm to a sensor, and a hydrogen absorption material provided at least in the sealed liquid, on the main body side wall face, or in a part of a path between the main body side wall face and the sensor to absorb hydrogen atoms in the sealed liquid. | 04-10-2014 |
20150107364 | Pressure Transmitter - A pressure transmitter including tube-like pressure introducing pipes, a sealed-in liquid, the inside of the pressure introducing pipes being filled with the sealed-in liquid, pressure receiving diaphragms for receiving the pressures of measurement fluids, the pressure receiving diaphragms being set up in a state where one-side apertures in the pressure introducing pipes are blocked by the pressure receiving diaphragms, a pressure sensor that is set up in common to the other-side apertures in the pressure introducing pipes in a state where the pressure sensor is exposed to the sealed-in liquid, and hydrogen-permeation prevention layers that are set up on the pressure receiving diaphragms, wherein the pressure transmitter further includes a hydrogen-storage material that is set up inside the pressure introducing pipes. | 04-23-2015 |
20150107365 | Pressure Transmitter - A pressure transmitter including tube-like pressure introducing pipes, a sealed-in liquid, the inside of the pressure introducing pipes being filled with the sealed-in liquid, pressure receiving diaphragms for receiving the pressures of measurement fluids, the pressure receiving diaphragms being set up in a state where one-side apertures in the pressure introducing pipes are blocked by the pressure receiving diaphragms, and a pressure sensor that is set up in common to the other-side apertures in the pressure introducing pipes in a state where the pressure sensor is exposed to the sealed-in liquid, wherein the sealed-in liquid is silicon oil containing phenyl groups, the pressure transmitter further including a hydrogen-storage material that is set up inside the pressure introducing pipes. | 04-23-2015 |
20150135842 | TRANSMISSION DEVICE - In a pressure and pressure difference transmitter that seals a sealing liquid for transmitting the pressure inside a pressure leading passage, the pressure and pressure difference transmitter forming a space between a diaphragm and a main body side wall surface, including the pressure leading passage connected to the main body side wall surface, and transmitting the pressure received by the diaphragm to a sensor through the sealing liquid sealed in the space and the pressure leading passage, a hydrogen occluding material for occluding hydrogen atoms of the sealing liquid is disposed at least in the sealing liquid, the main body side wall surface, or a part of a portion from the main body side wall surface to the sensor, with the hydrogen occluding material being formed with an uneven shape on the surface or being attached with a granular hydrogen occluding material. | 05-21-2015 |
Daisuke Shinma, Hitachi JP
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20090306844 | Vehicle and In-Vehicle Communication Control Device - It is possible to provide a vehicle and an in-vehicle communication control device capable of performing control with preferable response even under an environment where notch attenuation exists and various noises are superimposed in a cable communication using a battery line. The vehicle includes: a plurality of operation devices installed in the vehicle; sensors arranged in the respective operation devices for detecting operation amounts of the operation devices; a controller inputting the operation amounts detected by the sensors; a communication device connected to the controller and a battery line and outputting a control signal as a carrier of a different frequency band for each type of the operation devices to the battery line; a second communication device connected to the battery line and using a carrier of a frequency band of each of the operation devices as a pass band; and a second controller connected to the second communication device and controlling the control device corresponding to the operation device. | 12-10-2009 |
Fukuhito Shinma, Mitaka-Shi JP
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20100022104 | ELECTRICAL CONNECTING APPARATUS - An electrical connecting apparatus comprises a housing having a first recess extending in a first direction in a plane parallel to a board having a conductive portion to be connected to an electrode of a device under test and opened downward and a plurality of slits spaced in the first direction and extending in a second direction intersecting the first direction in the plane, wherein each slit communicates at one end portion in its longitudinal direction with the first recess and is opened at least upward, a plurality of plate-shaped contacts each electrically connecting the conductive portion to the electrode, having on the tip end side of the contact a tip end thrust to the electrode and a curved external surface, and arranged in the housing in a state of extending inside the slit from within the first recess with the external surface being on the lower side, and a probe holder arranged in the first recess and abutting on a part opposite the external surface of the contact so as to contact the external surface of the contact with the conductive portion. Accordingly, scraps scraped away by the tip end of the contact are prevented from reaching the board via the slit. | 01-28-2010 |
Kenji Shinma, Hyogo JP
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20090283034 | WAFER HOLDER, MANUFACTURING METHOD THEREOF AND SEMICONDUCTOR MANUFACTURING APPARATUS - A wafer holder is provided that can be used in wafer processes at room temperature or lower and that is particularly suited for use in a CVD apparatus. | 11-19-2009 |
Kenji Shinma, Itami-Shi JP
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20080211526 | Wafer holder, heater unit used for wafer prober and having wafer holder, and wafer prober - By wafer holder including a chuck top for mounting a wafer and a supporter supporting the chuck top and having flatness of at most 0.1 mm, a heater unit for a wafer prober and the wafer prober using the wafer holder, a wafer holder and a wafer prober apparatus hardly deformable even under high load and capable of effectively preventing contact failure, and capable of preventing temperature increase in a driving system when a semiconductor wafer having semiconductor chips with minute circuitry that requires high accuracy is heated can be provided. In the wafer holder of the present invention, the flatness of the supporter is preferably at most 0.05 mm, and more preferably at most 0.01 mm. | 09-04-2008 |
Satoshi Shinma, Tokyo JP
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20120097287 | DUCT ARRANGEMENT, DUCT EQUIPMENT, DUCT REINFORCEMENT CONSTRUCTION METHOD, SUPPORT REINFORCEMENT STRUCTURE, AND REINFORCEMENT STRUCTURE FOR SUPPORT FIXING UNIT - Provided is duct equipment including a duct body, a heat insulating material, a external cover, a fiber-reinforced sheet, and fiber-reinforced moldings. The duct body includes a duct wall, a duct passage defined by the duct wall, and duct corners formed in the duct wall when viewed in a cross-section in a direction intersecting a direction in which the duct passage extends. The heat insulating material is installed on an outer circumference of the duct body. The external cover includes a external cover wall installed on an outer circumference of the heat insulating material, and external cover corners formed alone the duct corners. The fiber-reinforced sheet is disposed on the outer circumference of the duct body via an adhesive layer. The fiber-reinforced moldings are disposed adjacent to the fiber-reinforced sheet along the external cover corners via adhesive layers, and have a substantially L-shape when viewed in the cross-section. | 04-26-2012 |
Shuichi Shinma, Okazaki-Shi JP
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20090166529 | METHOD FOR PREPARING SPECIMEN FOR MASS SPECTROMETRY - The present invention provides a specimen preparation method for mass spectrometry based on Matrix Assisted Laser Desorption Ionization (MALDI), wherein the method enables to form microcrystals (cocrystals) between matrices and biological molecules (protein and the like) on a biological tissue to generate ions thereof highly efficiently and to perform highly sensitive measurement. Microcrystals are formed on the specimen containing biological molecules, i.e. objects of the measurement, by spraying matrix solution beforehand. Furthermore, dispensation of matrix solution on the microcrystals allows crystals to grow by making preformed micro-matrix crystals as crystal nuclei. Therefore, much finer and more homogeneous crystals (cocrystals) are prepared to enable to perform highly sensitive mass spectrometry based on MALDI. The present invention is a specimen preparation method for mass spectrometry based on matrix assisted laser desorption ionization, wherein the method comprises steps forming microcrystals of matrices on the specimen by spraying matrix solution on the specimen and allowing the microcrystals to grow further by dispensing matrix solutions to the specimen. | 07-02-2009 |
Takehisa Shinma, Makinohara-Shi JP
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20140335724 | SCREW BLOCK INSTALLATION STRUCTURE FOR A JUNCTION BOX - A screw block installation structure for a junction box in which a screw block is installed to a screw block attaching portion having a screw block housing space in a component attachment block in a junction box, the component attachment block is housed together with the screw block inside a frame, and a connecting member is screw-connected to a screw member of the screw block, the screw member having a vertical axis of the screw block, wherein a lateral side opening is disposed in the screw block attaching portion, and the screw block is laterally installed to the screw block housing space through the side opening is provided. | 11-13-2014 |
Tomoaki Shinma, Toyota-Shi JP
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20150144487 | EXHAUST GAS SENSOR - An exhaust gas sensor ( | 05-28-2015 |
Yasuhiro Shinma, Kawasaki JP
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20080274591 | CARRIER FOR STACKED TYPE SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING STACKED TYPE SEMICONDUCTOR DEVICES - A carrier for a stacked-type semiconductor device includes an accommodating section for accommodating stacked semiconductor devices, guide portions guiding the stacked semiconductor devices, and grooves through which a fluid may flow to the accommodating section and to sides of the stacked semiconductor devices. These grooves facilitate the flow of gas or liquid on the sides of the accommodating sections, and it is thus expected that the flow of hot wind during the reflow process and cleaning liquid during the cleaning process can be facilitated. This improves the production yield and the cleaning effects. Holes for connecting the accommodating section to the outside may be provided at corners of the accommodating section. Gas may be guided from the lower side of the accommodating section, so that heat can be efficiently applied to the semiconductor devices and bonding failures therebetween can be reduced. Further, grooves connecting adjacent holes may be provided for accommodating sections adjacent to each other. | 11-06-2008 |
Yasuhiro Shinma, Kanagawa JP
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20090093085 | Carrier Structure for stacked-type semiconductor device, method of producing the same, and method of fabricating stacked-type semiconductor device - A carrier structure for fabricating a stacked-type semiconductor device includes: a lower carrier that has laminated thin plates and has first openings for mounting first semiconductor packages thereon; and an upper carrier having second openings for mounting second semiconductor packages on the first semiconductor packages. The lower carrier composed of the laminated thin plates realizes an even plate thickness and reduces warps because stress is distributed to the thin plates. This results in an improved production yield. A pattern of the openings in the thin plates of the lower carrier may be formed by etching or electric discharging. The openings thus formed have reduced warps and burrs. | 04-09-2009 |
20090311831 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device is disclosed. As a part of the method, one surface of a substrate is molded with resin where the substrate and the resin are heated in a first heating process and maintained in a flat condition. The substrate and the resin are returned to room temperature while being maintained in the flat condition after the first heating process. The resin is cut after the substrate and the resin are returned to room temperature from a surface of the resin that is opposite the surface of the resin where the substrate contacts the resin. The substrate is left intact when the resin is cut. Thereafter, the substrate is separated. | 12-17-2009 |
20090315166 | STACKED SEMICONDUCTOR DEVICES AND A METHOD FOR FABRICATING THE SAME - The present invention provides a semiconductor device that includes semiconductor packages arranged in a stacked configuration. A plurality of leads are drawn from the stacked semiconductor packages and folded around the outer shape of each semiconductor package such that the leads extend over the upper surfaces of the semiconductor package. Holders affix the stacked semiconductor packages so that first and second leads contact each other, the first leads being drawn from a first one of the stacked semiconductor packages at a lower stacking stage, and the second leads being drawn from a second one of the stacked semiconductor packages at an adjacent, upper stacking stage. | 12-24-2009 |
20090325346 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - The present invention provides a semiconductor device that includes: stacked semiconductor chips, each semiconductor chip including a semiconductor substrate and a first insulating layer that is provided on side faces of the semiconductor substrate and has concavities formed on side faces thereof; first metal layers that are provided in center portions of inner side faces of the concavities; and second metal layers that are provided in the concavities and are connected to the first metal layers formed on each semiconductor chip. The present invention also provides a method of manufacturing the semiconductor device. | 12-31-2009 |
20120025364 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - The present invention provides a semiconductor device that includes: stacked semiconductor chips, each semiconductor chip including a semiconductor substrate and a first insulating layer that is provided on side faces of the semiconductor substrate and has concavities formed on side faces thereof; first metal layers that are provided in center portions of inner side faces of the concavities; and second metal layers that are provided in the concavities and are connected to the first metal layers formed on each semiconductor chip. The present invention also provides a method of manufacturing the semiconductor device. | 02-02-2012 |
Yasutoshi Shinma, Anjo-Shi JP
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20090000434 | Handles for hand-held tools - A handle for a tool includes a handle body, an operation device and a pair of clamp halves. The operation device has an operation member operable by an operator. At least one of the clamp halves can move relative to the handle body along an axis. As the operation member is operated, the one of the handle halves moves along the axis, so that the distance between the handle halves can be changed for clamping or releasing a portion of the tool. | 01-01-2009 |
20110308828 | POWER TOOL - A working tool in which a tip tool with a longitudinal shaft is linearly moved, wherein a motor and other tool constituting members are effectively cooled. In order to cool the inside of a motor-driven hammer comprising a main body, a motor, and a motion converter, the hammer is provided with a first cooling air passage through which a cooling air is supplied to the motor, and a second cooling air passage through which a cooling air is supplied to a hammer portion. To generate a cooling air to be supplied to the first and second cooling air passages, a cooling fan is provided at a lower portion of an output shaft of the motor and a hammer portion cooling fan is provided between the output shaft of the motor and the motion converter. | 12-22-2011 |
Yasutoshi Shinma, Anjo JP
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20100096154 | HAMMER DRILL - Mode switching is reliably performed with a durable and small-sized configuration. A clutch pin ( | 04-22-2010 |