Patent application number | Description | Published |
20110156795 | BIDIRECTIONAL SWITCH - A bidirectional switch includes a semiconductor switch Q | 06-30-2011 |
20110157931 | RESONANT POWER CONVERTER - The present invention provides a resonant power converter including: a first switch circuit in which multiple normally-off switches Q | 06-30-2011 |
20110157938 | ALTERNATING CURRENT-DIRECT CURRENT CONVERTER DEVICE - In the present invention, switching circuits connected in middle points of power supply lines of a three-phase alternating-current power supply are switched to cause currents to intermittently flow on primary windings of a transformer, a voltage generated on a secondary winding is rectified and smoothed, and then is outputted to a load. The switching circuits each include: a series circuit including a first primary winding, a bidirectional switch and a second primary winding, which are connected in series in this order; a drive circuit power supply generating circuit generating a direct-current positive voltage and a direct-current negative voltage by use of an alternating-current power supply voltage applied between two ends of the series circuit; and a drive circuit performing on-off drive of the bidirectional switch. A reference potential point of the bidirectional switch is connected to a reference potential point of the drive circuit power supply generating circuit. | 06-30-2011 |
20110157948 | CURRENT SOURCE INVERTER - A current source inverter includes an inverter having arm units and AC terminals, the numbers of the arm units and AC terminals being adapted to an AC load connected to the AC terminals. An upper arm is connected between a positive DC terminal and the corresponding AC terminal and has an upper arm switch Q | 06-30-2011 |
20120306545 | GATE DRIVER - A gate driver turns on/off a switching element Q | 12-06-2012 |
20140091324 | SWITCHING CIRCUIT AND SEMICONDUCTOR MODULE - A switching circuit includes: a first switching element (Q | 04-03-2014 |
20140159225 | SEMICONDUCTOR MODULE - A semiconductor module has a pair of semiconductor devices, a heat sink, a first electrode, an output electrode and a second electrode. The semiconductor devices are connected in series with each other and have first terminals that are electrically connected to a first power system and a second terminal that is electrically connected to a second power system. The first electrode is electrically connected both to one of the first terminal and to an electrode of one of the semiconductor devices. The output electrode is electrically connected both to the second terminal and to an electrode of the other of the semiconductor device. The second electrode is electrically connected to the other of the first terminals. The second electrode is connected to the heat sink via a first insulating member. The output electrode is connected to the second electrode via a second insulating member. | 06-12-2014 |
20140191250 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device is carried out by readying each of a semiconductor element, a substrate having Cu as a principal element at least on a surface, and a ZnAl solder chip having a smaller shape than that of the semiconductor element; disposing the semiconductor element and the substrate so that respective bonding surfaces face each other, and sandwiching the ZnAl eutectic solder chip between the substrate and the semiconductor element; increasing the temperature of the ZnAl solder chip sandwiched between the substrate and the semiconductor element while applying a load to the ZnAl solder chip such that the ZnAl solder chip melts to form a ZnAl solder layer; and reducing the temperature of the ZnAl solder layer while applying a load to the ZnAl solder layer. | 07-10-2014 |
20150041525 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, HEAT INSULATING LOAD JIG, AND METHOD FOR SETTING UP HEAT INSULATING LOAD JIG - In a heat insulating load jig | 02-12-2015 |