Patent application number | Description | Published |
20080231930 | OSCILLATOR DEVICE, METHOD OF DRIVING THE SAME, OPTICAL DEFLECTOR AND IMAGE DISPLAY DEVICE USING THE SAME - An oscillator device includes a first oscillator, a second oscillator configured to support the first oscillator for torsional rotation about a first rotational axis, through a first torsion spring, a supporting member configured to support the second oscillator for torsional rotation about a second rotational axis, through a second torsion spring, the second rotational axis having a predetermined angle with respect to the first rotational axis of the first oscillator, a coil disposed in relation to the second oscillator, an electric current applying member configured to apply an electric current to the coil, and a magnetic field generating member configured to apply a magnetic field to the coil, wherein the coil is localized in at least one of zones of the second oscillator being quartered by extension lines of the first and second rotational axes. | 09-25-2008 |
20090067019 | SWING MEMBER DEVICE, AND OPTICAL DEFLECTOR AND IMAGE-FORMING APPARATUS EMPLOYING THE SWING MEMBER DEVICE - A swing member device comprises a swingable part supported by a supporting part to be swingable around a torsional axis on a supporting base in at least one intrinsic oscillation mode: the swing member device having a temperature-raising unit for raising the temperature of ambient atmosphere in the region of swing motion of the swingable part, the temperature-raising unit raising the temperature of the ambient atmosphere to enable decrease of an influence of an unsteady dragging force caused by the ambient atmosphere. | 03-12-2009 |
20100302612 | OSCILLATING STRUCTURE AND OSCILLATOR DEVICE USING THE SAME - An oscillating structure includes a supporting member, a first oscillating member, second oscillating member, a first resilient supporting member configured to connect the supporting member and the first oscillating member and to support the first oscillating member for oscillatory motion around the supporting member as a central axis, and a second resilient supporting member configured to connect the first oscillating member and the second oscillating member and to support the second oscillating member movably relative to the first oscillating member, wherein the direction in which the first resilient supporting member extends from the supporting member to the first oscillating member and the direction in which the second resilient supporting member extends from the first oscillating member to the second oscillating member are opposite to each other. | 12-02-2010 |
20110168908 | MICROSTRUCTURE MANUFACTURING METHOD - A microstructure manufacturing method includes forming a first insulating film on an Si substrate, exposing an Si surface by removing a part of the first insulating film, forming a recessed portion by etching the Si substrate from the exposed Si surface, forming a second insulating film on a sidewall and a bottom of the recessed portion, forming an Si exposed surface by removing at least a part of the second insulating film formed on the bottom of the recessed portion, and filling the recessed portion with a metal from the Si exposed surface by electrolytic plating. | 07-14-2011 |
20110228440 | MICROSTRUCTURAL BODY AND PRODUCTION METHOD THEREFOR - A microstructural body includes a substrate such as an electrode substrate, a support portion, one post that fixes the support portion to the substrate, a frame-shaped movable portion provided around outer periphery of the support portion, and an elastic support portion that elastically connects the movable portion and the support portion. The elastic support portion supports the frame-shaped movable portion such that the movable portion is movable relative to the support portion. The elastic support portion includes torsion springs and an elastically deformable connecting portion. | 09-22-2011 |
20150072521 | MICROSTRUCTURE MANUFACTURING METHOD - A microstructure manufacturing method includes forming a first insulating film on an Si substrate, exposing an Si surface by removing a part of the first insulating film, forming a recessed portion by etching the Si substrate from the exposed Si surface, forming a second insulating film on a sidewall and a bottom of the recessed portion, forming an Si exposed surface by removing at least a part of the second insulating film formed on the bottom of the recessed portion, and filling the recessed portion with a metal from the Si exposed surface by electrolytic plating. | 03-12-2015 |