Patent application number | Description | Published |
20090021924 | GUIDE MEMBER, CONNECTION BOARD HAVING GUIDE MEMBER, AND MANUFACTURING METHOD OF GUIDE MEMBER - Object A connection board is provided in which multiple external contacts of an electronic component and multiple spiral contacts on a board are arranged to highly accurately face each other, and the external contacts are actively guided to the spiral contacts, so as to reliably provide individual connections therebetween. | 01-22-2009 |
20090064482 | CONTACT, METHOD FOR MANUFACTURING CONTACT, CONNECTION DEVICE INCLUDING CONTACT, AND METHOD FOR MANUFACTURING CONNECTION - To provide a contact, formed in an amorphous state, having better spring properties as compared to conventional one; a method for manufacturing the contact; a connection device including the contact; and a method for manufacturing the connection device. | 03-12-2009 |
20090250154 | METHOD FOR BONDING METALLIC TERMINALS BY USING ELASTIC CONTACT - A connection electrode that is formed of solder on an electronic component side and a tip portion of an elastic contact contact each other at a contact portion. Regarding the elastic contact, a resistive layer is formed in the tip portion, and the tip portion is placed in a clearance of an induction coil. When a predetermined high-frequency current is passed through the induction coil, electromagnetic induction causes the resistive layer to generate heat. Solder that forms the connection electrode is melt, and flows onto the tip portion of the elastic contact. Thus, the tip portion of the elastic contact and the connection electrode can be strongly bonded together at the contact portion that is a single point therebetween. | 10-08-2009 |
Patent application number | Description | Published |
20150072139 | Release Film, Compression Molding Method, And Compression Molding Apparatus - The present invention relates to a release film used by being interposed between a molding material and a mold when the molding material is compression molded using the mold in order to form a sealing material or reflective frame material for an optical semiconductor element, or a lens, wherein the release film comprises a silicone-based cured product layer ( | 03-12-2015 |
20150115311 | Film-Like Thermosetting Silicone Sealing Material - The present invention relates to a film-like thermosetting silicone sealing material for sealing a semiconductor element by means of compression molding, the sealing material having an initial torque value of less than 15 dN·m as measured by an MDR (Moving Die Rheometer) at a molding temperature of from room temperature to 200° C., to a method for producing an LED by means of compression molding using the same, and to an LED produced by this method. The sealing material has excellent moldability, causes no problems such as overflow from a die, and has no defects such as voids. | 04-30-2015 |
20150235872 | Curable Silicone Composition, Method For Producing Semiconductor Device, And Semiconductor Device - The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane composed of: (A-1) a linear organopolysiloxane having at least two silicon-bonded alkenyl groups in a molecule, and (A-2) a resin-like organopolysiloxane including 1.5 to 5.0% by weight alkenyl groups; (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (C) a linear dialkyl polysiloxane having a viscosity at 25° C. of 2 to 10 mm | 08-20-2015 |
20150295147 | Method Of Manufacturing An Integrated Piece Comprising A Convex Cured Product And A Substrate - The present invention relates to a method of manufacturing an integrated piece comprising a convex cured product and a substrate, the method comprising a step of: depositing dropwise or dispensing a curable silicone composition onto the pre-heated substrate, the composition reaching a torque value of 1 dN·m within 60 seconds from immediately after beginning measurement as measured using a curelastometer according to JIS K 6300-2, at the temperature to which the substrate is heated, and having a viscosity at said temperature of at least 0.05 Pa·s. The method allows for the efficient manufacture of a hemispherical, hemicylindrical, dome-shaped, or similar convex cured product upon a substrate using a curable silicone composition. | 10-15-2015 |
Patent application number | Description | Published |
20150207047 | GRADIENT POLYMER STRUCTURES AND METHODS - An optical article includes a silicone-containing composition. The silicone composition includes a first region having a first refractive index and a second region having a second refractive index. The first refractive index is different than the second refractive index. | 07-23-2015 |
20150315427 | HOT-MELT TYPE CURABLE SILICONE COMPOSITION FOR COMPRESSION MOLDING OR LAMINATING - The present invention relates to a hot-meltable curable silicone composition for compression molding or laminating and a laminate provided with at least one layer comprising the composition, as well as a semiconductor device using these and a method of manufacturing the same. In accordance with the present invention, it is possible to efficiently manufacture a semiconductor device provided with a hemi-spheroidal lens- or dome-shaped seal. In the present invention, it is easy to control the shape of the seal, and the seal does not contain any bubbles. In the present invention, it is also easy to control the thickness of the coating layer of the semiconductor device apart from the seal. | 11-05-2015 |
20160032148 | A METHOD FOR MAKING AN OPTICAL ASSEMBLY COMPRISING DEPOSITING A SOLID SILICONE-CONTAINING HOT MELT COMPOSITION IN POWDER FORM AND FORMING AN ENCAPSULANT THEREOF - Methods of making optical assemblies and electronic devices comprising, depositing a solid silicone-containing hot melt composition in powder form onto an optical surface of an optical device; and forming, from the silicone-containing hot melt composition, an encapsulant that substantially covers the optical surface of the optical device. In some embodiments, the silicone containing hot melt composition is a reactive or unreactive silicone-containing hot melt. In some embodiments, the composition is a resin-linear silicone-containing hot melt composition and the composition comprises a phase separated resin-rich phase and a phase separated linear-rich phase. | 02-04-2016 |