| Patent application number | Description | Published |
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| 20080265781 | LIGHT SOURCE MODULE - A light source module including a circuit substrate, light emitting chip packages, and driving devices is provided. The circuit substrate has a top surface and a bottom surface opposite to the top surface. The bottom surface has at least one component installed area and at least one metal exposed area. The light emitting chip packages are disposed on the top surface. The driving devices are disposed in the component installed area. The driving devices are electrically connected to the light emitting chip packages through the circuit substrate. | 10-30-2008 |
| 20080284692 | METHOD FOR CONTROLLING BACKLIGHT APPARATUS AND LUMINANCE CONTROL CIRCUIT THEREOF - A luminance control circuit including a detection unit, a control unit and a current adjustor is provided. The detection unit detects a working current of each light emitting module and produces detection signals to be transmitted to the control unit. The control unit produces control signals according to the detection signals to be transmitted to the current adjustor. The current adjustor adjusts each of the working currents of each of the light emitting modules according to the control signals. | 11-20-2008 |
| 20090078852 | CHROMINANCE COMPENSATION METHOD AND PANEL LIGHTENING METHOD IN A DISPLAY APPARATUS - An area-control based LED backlight system for a panel is divided into a plurality of independently controllable light emitting regions. A single color sensor or light sensor detects light emitting status of the regions. Reference values corresponding to the regions are set based on a white balance parameter. The reference values are compared to the light emitting status of the regions for performing color components ratio calibration, so as to compensate luminance and chrominance of light emitted from the regions and lightening the panel. Further, a single light sensor is used for detecting light emitted from LED sets of a whole-panel based LED backlight system for a panel. A reference value is compared to a detection result of the light sensor for generating a color component calibration parameter, so as to compensate luminance and chrominance of light emitted from the LED sets and lightening the panel. | 03-26-2009 |
| 20090102782 | BACKLIGHT APPARATUS - A backlight apparatus is provided. The apparatus includes a light emitting unit, a voltage converter, a voltage detection unit, a correction unit, and a feedback control unit. The light emitting unit has a first connection end and a second connection end. The voltage converter transforms an input voltage into a rated voltage according to a periodic signal. The voltage detection unit detects a voltage level on the first connection end and the second connection end, and generates a measuring voltage. The correction unit performs a gain correction of the measuring voltage and adjusts the corrected measuring voltage by a specific ratio to generate a correction voltage. The feedback control unit outputs a feedback signal according to the correction voltage, and the voltage converter dynamically modifies the periodic signal according the feedback signal. | 04-23-2009 |
| 20090295298 | LIGHT SOURCE DRIVING CIRCUIT - A light source driving circuit includes a power supply circuit, a first dimming circuit, and a control circuit. The power supply circuit has a control terminal and an output terminal that is connected to a terminal of a first light-emitting element. The first dimming circuit has a first terminal connected to the other terminal of the first light-emitting element, a second terminal connected to a common potential, and a pulse width signal input terminal. The control circuit is connected between the pulse width input terminal of the first dimming circuit and the control terminal of the power supply circuit. The first dimming circuit determines an ON/OFF state according to a logic state of the pulse width signal. The power supply circuit determines whether or not to output the voltage. The control circuit delays the power supply circuit, turns off the power supply circuit, and delays the first dimming circuit. | 12-03-2009 |
| Patent application number | Description | Published |
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| 20080198481 | Aspheric lens structures and fabrication methods thereof - Aspheric lens structures with dual aspheric surfaces and fabrication methods thereof are disclosed. An aspheric lens structure includes a first lens component with an aspheric top surface disposed on a second lens component, wherein the interface between the first lens component and the second lens component is spherical. The second lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the second lens component. The second lens component may also include a planar back surface with a third lens component disposed on the planar back surface of the second component. The third lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the third lens component. | 08-21-2008 |
| 20100006965 | ELECTRONIC DEVICE PACKAGE WITH ELECTROMAGNETIC COMPATIBILITY (EMC) COATING THEREON - Electronic device packages with electromagnetic compatibility (EMC) coating thereon are presented. An electronic device package includes a chip scale package having a CMOS image sensor (CIS) array chip and a set of lenses configured with an aperture. An encapsulation is molded overlying the chip scale package. A shield is atop the encapsulation. A frame fixes the set of lenses to the encapsulation. An electromagnetic compatibility (EMC) coating is formed on the encapsulation to prevent electromagnetic interference. | 01-14-2010 |
| 20100012957 | LIGHT-EMITTING DIODE DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor device is disclosed. The semiconductor device comprises a light-emitting diode chip disposed in a cavity of a semiconductor substrate. At least two isolated outer wiring layers are disposed on the bottom surface of the semiconductor substrate and are electrically connected to the light-emitting diode chip, serving as input terminals. A lens module is adhered to the top surface of the semiconductor substrate to cap the cavity, in which the lens module comprises a molded lens and a molded fluorescent layer thereunder and the molded fluorescent layer faces the light-emitting diode chip. A method for fabricating the semiconductor devices is also disclosed. | 01-21-2010 |
| 20100085465 | IMAGE SENSOR DEVICE WITH OPAQUE COATING - The invention provides an image sensor device. The image sensor device includes a chip package and an opaque coating. The chip package includes an image sensor array chip, wherein a set of optical elements connect to the image sensor array chip, and an outer frame shielding the optical elements. The opaque coating overlies the outer frame. | 04-08-2010 |
| 20100085473 | ENCAPSULANT MODULE WITH OPAQUE COATING - The invention provides an encapsulant module for an image sensor device. The module includes an outer frame, a set of optical elements, and an opaque coating. The outer frame includes an enclosing wall and a first opening surrounded by the enclosing wall. The set of optical elements connects to and is disposed in the enclosing wall. The opaque coating overlies the enclosing wall. | 04-08-2010 |
| 20100226633 | COMPACT CAMERA MODULE - The invention provides a compact camera module. The compact camera module includes an image sensing device, a set of optical elements, and a zooming device. The set of optical elements connects to the image sensing device, and comprises a lens set. The zooming device connects to the set of optical elements for adjusting a distance between the lens set and the image sensing device. The zooming device directly electrically joins with the image sensing device. | 09-09-2010 |
