Patent application number | Description | Published |
20090314742 | METHOD FOR PROCESSING SUBSTRATE AND METHOD FOR PRODUCING LIQUID EJECTION HEAD AND SUBSTRATE FOR LIQUID EJECTION HEAD - A method for processing a substrate includes preparing a substrate having a first layer on a first surface side thereof, the first layer having a material capable of suppressing transmission of laser light, processing the substrate with laser light from a second surface that is opposite the first surface of the substrate toward the first surface of the substrate, and allowing the laser light to reach the first layer to form a hole in the substrate, and performing etching of the substrate from the second surface through the hole. | 12-24-2009 |
20110279550 | LIQUID JET HEAD AND METHOD FOR MANUFACTURING LIQUID JET HEAD - A liquid discharge head includes a recording element substrate including an energy generating element, a wiring substrate including wiring, a support substrate for supporting the recording element substrate and the wiring substrate so that a side end portion of the recording element substrate and a side end portion of the wiring substrate are adjacent to each other, and a sealing member, wherein the side end portion of the wiring substrate has a step portion, a distance between a second portion of the step portion on the side opposite to the support substrate and the side end portion of the recording element substrate is larger than a distance between a first portion of the step portion on the side of the support substrate and the side end portion of the recording element substrate, and a part of the wiring is formed in the first portion. | 11-17-2011 |
20130063523 | LIQUID RECORDING HEAD AND METHOD OF MANUFACTURING THE SAME - Provided is a liquid recording head in which a protective layer having resistance to liquid and an adhesiveness improving film are disposed on a second surface opposite to a first surface of a silicon substrate. The first surface and the second surface have a plane direction. The protective layer is disposed in a peripheral region of an opening of a liquid supply port. A liquid ejection chip is bonded to a head substrate with an adhesive so that the liquid supply port communicates to a liquid introduction port on a side of the second surface of the silicon substrate. | 03-14-2013 |
20130139944 | METHOD OF MANUFACTURING LIQUID EJECTION HEAD - A liquid adhesive is applied onto a surface of a base plate having flow channels formed as recesses or through-grooves, by transferring the liquid adhesive from a rotating cylinder coated with it to the surface of the base plate. The base plate is then bonded to a cover plate having ejection energy generating elements via the applied adhesive to be made into a liquid ejection head. For evenly applying the liquid adhesive onto the surface having the recesses or through-grooves as flow channels, the surface is additionally provided with dummy recesses for compensating for variance of contact length orthogonal to the transfer direction due to uneven or asymmetrical arrangement of the recesses or through-grooves. | 06-06-2013 |
20130155151 | METHOD OF MANUFACTURING LIQUID EJECTION HEAD - A support substrate and a liquid ejecting element substrate are bonded to each other with an adhesive agent to manufacture a liquid ejection head. The support substrate is provided with a liquid supply port and a recess or through hole in its main surface. The adhesive agent is applied onto the main surface of the support substrate by means of a roller holding the adhesive agent on its peripheral surface by moving the support substrate and the roller relative to each other such that the recess or through hole and the liquid supply port sequentially face the roller in this order. | 06-20-2013 |
20140216630 | METHOD OF MANUFACTURING LIQUID DISCHARGE HEAD - A method of manufacturing a liquid discharge head in which a device substrate having an energy generating element and a supply port and a supporting member having a supply passage are bonded with each other an adhesive agent includes:
| 08-07-2014 |
20140218445 | METHOD OF MANUFACTURING LIQUID EJECTION HEAD, AND LIQUID EJECTION HEAD - There is provided a method of manufacturing a liquid ejection head that includes a supporting member having a major surface provided with a plurality of supply paths, and a recording element substrate having a bonding surface bonded to the major surface and provided with a plurality of supply ports arranged side by side in an arranging direction in which the supply paths are arranged side by side, the supply ports having smaller widths than the respective supply paths in the arranging direction. The method includes applying a bonding agent on the major surface around each of the supply paths, spreading the bonding agent to inner side surfaces of the supply ports by pressing boundary portions between the bonding surface and the supply ports into the bonding agent applied, and bonding the bonding surface to the major surface at a bonding position where the supply ports face the respective supply paths. | 08-07-2014 |
20150217569 | LIQUID EJECTING HEAD MANUFACTURING METHOD AND LIQUID EJECTING HEAD - Precise positioning of a film used to seal an electrical connection on a liquid ejecting head is made possible. Specifically, positioning is conducted in a state in which part of the film is held to a finger by suction. Next, the finger is moved downward while in the positioned state, and part of the film is pressed against a wiring board. With part of the film fixed to the wiring board in this way, a sealing resin flows while being covered by the film. Consequently, shifting of the position of the film as the sealing resin flows may be prevented. As a result, it becomes possible to conduct covering with the film in a precisely positioned state. | 08-06-2015 |