Shimadu
Daisuke Shimadu, Kodaira JP
Patent application number | Description | Published |
---|---|---|
20080279033 | Semiconductor integrated circuit device - A semiconductor integrated circuit device provided with a memory circuit having a word line selection circuit with reduced leakage current is provided. The memory circuit includes: second word lines with which memory cells are connected; multiple bit lines that are extended in a direction orthogonal thereto and electrically connected with memory cells corresponding to selected second word lines of a plurality of the second word lines; and word drivers, constructed of CMOS inverter circuits, that select or deselect the second word lines. The sources of p-channel MOSFETs that constitute a plurality of word drivers including second word lines corresponding to selected bit lines are supplied with a voltage at a level at which second word lines are selected. The sources of the p-channel MOSFETs of the other word drivers are supplied with a voltage corresponding to a level at which second word lines are deselected. | 11-13-2008 |
Hitoshi Shimadu, Obu-Shi JP
Patent application number | Description | Published |
---|---|---|
20120119868 | WIRING SUBSTRATE AND MANUFACTURING METHOD FOR WIRING SUBSTRATE - Disclosed is a wiring substrate that is provided with a wiring pattern formed from a metal plate, and an insulation layer as a base material to which the wiring pattern is to be fixed. The wiring pattern has a mounting pad for having electronic parts ( | 05-17-2012 |
Hitoshi Shimadu, Chita-Gun Higashiura-Cho JP
Patent application number | Description | Published |
---|---|---|
20120160553 | CIRCUIT BOARD PRODUCTION METHOD AND CIRCUIT BOARD | 06-28-2012 |
Hitoshi Shimadu US
Patent application number | Description | Published |
---|---|---|
20120195005 | ELECTRONIC UNIT - An electronic unit includes a double-sided substrate having an insulation substrate, a patterned first metal plate bonded on one side of the insulation substrate, and a patterned second metal plate bonded on the other side of the insulation substrate, and also includes a heat radiation member for releasing heat from the double-sided substrate. The heat radiation member is disposed adjacent to one of the first metal plate and the second metal plate generating a larger amount of heat than the other of the first metal plate and the second metal plate. | 08-02-2012 |
Hitoshi Shimadu, Kariya-Shi JP
Patent application number | Description | Published |
---|---|---|
20140027170 | WIRING SUBSTRATE - A wiring substrate ( | 01-30-2014 |
20140139310 | WIRING BOARD - This wiring board is provided with an insulating core substrate, a first conductor pattern, a second conductor pattern, and a conductive material. The first conductor pattern and the second conductor pattern are adhered to the insulating core substrate. The second conductor pattern has a first surface and a second surface. The second conductor pattern has a concavity and a through-hole. The opening of the concavity that opens to the first surface and the opening of the through hole that opens to the first surface are interconnected to each other. The first conductor pattern is positioned at the opening of the concavity. The first conductor pattern and the second conductor pattern are electrically connected by means of the conductive material, which fills from the opening of the through hole that opens to the second surface. | 05-22-2014 |
20140151106 | WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD - An electrically conductive path is configured from a first copper plate, a second copper plate, and solder. The first copper plate has a first bent section extended from a first joining section joined to an electrically insulative board and bent toward the rear surface of the electrically insulative board. The second copper plate has a second bent section which is extended from a second joining section joined to the electrically insulative board, is bent toward the front surface of the electrically insulative board, and is disposed so as to cover, together with the first bent section, the inner wall surface of a base-material through-hole. Through-holes are provided in the portions of the second copper plate which face the inside of the base-material through-hole. Solder is filled between the first bent section and the second bent section. | 06-05-2014 |
20140251659 | CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRCUIT BOARD - A circuit board, onto which an electronic component is to be mounted, is provided with insulating core substrates and patterned metal plates. The metal plates are bonded to at least one side of the insulating core substrates. The insulating core substrates and the metal plates form a laminated body, in which a gas-vent hole is provided. The gas-vent hole is formed so that when the electronic component is mounted, the gas present between the insulating core substrates and the metal plates expands and is released to a side open to the atmosphere via the gas-vent hole. | 09-11-2014 |
Koji Shimadu, Inazawa-Shi JP
Patent application number | Description | Published |
---|---|---|
20130038901 | FACSIMILE APPARATUS - There is provided a facsimile apparatus which includes a scanning section, an operating section which inputs a facsimile number, a first communication section which is connected to a communication line, a first communication control section which controls the first communication section, a first storage section in which information of the remote apparatus has been stored, a first judgment section which judges whether or not information of the remote apparatus corresponding to a first facsimile number is stored in the first storage section, a re-input section which inputs a second facsimile number when the information of the remote apparatus is stored in the first storage section. When the first judging section judges that the information of the remote apparatus is stored in the first storage section, or when the first facsimile number and the second facsimile number are same, the facsimile apparatus transmits facsimile data to the remote apparatus. | 02-14-2013 |