Patent application number | Description | Published |
20130161836 | SEMICONDUCTOR PACKAGE HAVING INTERPOSER COMPRISING A PLURALITY OF SEGMENTS - Provided is a semiconductor package comprising a substrate, a semiconductor chip formed on the substrate, and an interposer including a plurality of segments which are separated from each other and arranged on the substrate to surround the semiconductor chip. And a stacked package for multiple chips including the semiconductor package with a plurality of segments of an interposer is provided. | 06-27-2013 |
20130187288 | PACKAGE-ON-PACKAGE ASSEMBLY - A package-on-package assembly includes first and second packages and an adhesion member positioned between the first and second packages and adhering the first and second packages to one another. The first package may include a first substrate having a first surface and a second surface facing each other and including a land pad formed on the first surface, a first semiconductor chip formed on the first surface, and a first encapsulant member encapsulating the first surface and the first semiconductor chip and including a through-via spaced apart from the first semiconductor chip and exposing the land pad and a trench formed between the first semiconductor chip and the through-via, and wherein at least a portion of the trench is filled with adhesion member material. | 07-25-2013 |
20130292822 | BUMP STRUCTURE, SEMICONDUCTOR PACKAGE HAVING THE BUMP STRUCTURE, AND METHOD OF FORMING THE BUMP STRUCTURE - A bump structure includes a first bump and a second bump. The first bump is disposed on a connection pad of a substrate. The first bump includes a lower portion having a first width, a middle portion having a second width smaller than the first width, and an upper portion having a third width greater than the second width. The second bump is disposed on the upper portion of the first bump. | 11-07-2013 |
20140374902 | STACK TYPE SEMICONDUCTOR PACKAGE - A stack type semiconductor package includes: a lower semiconductor package including a lower package substrate, and a lower semiconductor chip which is mounted on the lower package substrate and includes a first surface facing a top surface of the lower package substrate and a second surface opposite to the first surface; an upper semiconductor package including an upper package substrate and an upper semiconductor chip which is mounted on the upper package substrate; an inter-package connection unit which connects the lower package substrate and the upper package substrate; a heat dissipation member which is formed on the second surface of the lower semiconductor chip; and an interconnection unit which is formed on a bottom surface of the upper package substrate, and is adhered to the heat dissipation member to connect the lower semiconductor chip and the upper package substrate. | 12-25-2014 |
Patent application number | Description | Published |
20130342890 | ELECTROWETTING DISPLAY DEVICE - An electrowetting display device includes a black matrix that includes a plurality of openings corresponding to pixels, respectively, a first extension portion extending in a driving direction of an electrowetting layer, the driving direction being a direction in which motion of the electrowetting layer is induced when a voltage difference is applied between a common electrode and a pixel electrode, and a partition wall that partitions the pixels. The first extension portion includes first and second areas respectively extending in opposite directions to each other and a third area having a width substantially the same as a width of the partition wall. The first area has a width less than about half of a first length corresponding to a length extending between both sides of each pixel in the driving direction, and the second area has a width less than the width of the first area. | 12-26-2013 |
20140240645 | PHOTOSENSITIVE RESIN COMPOSITION, DISPLAY DEVICE USING THE SAME AND METHOD OF MANUFACTURING THE DISPLAY DEVICE - A photosensitive resin composition comprises about 10 wt % to about 50 wt % of a solute comprising about 100 parts by weight of an acryl-based copolymer and about 5 to about 100 parts by weight of a 1,2-quinonediazide compound; and a solvent comprising a glycol-based material having a boiling point of greater than about 190° C., wherein the acryl-based copolymer is a copolymer of an unsaturated carbonic acid or an anhydride thereof, an epoxy group-containing unsaturated compound, and an olefin-based unsaturated compound. | 08-28-2014 |
20150060857 | DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME - A display panel includes a gate electrode and a gate line on a substrate, a gate insulating layer and an active layer sequentially on the gate electrode and the gate line, a planarization layer which is on the substrate and compensates for a step difference between the substrate, and the gate electrode and the gate line, respectively, source and drain electrodes on the active layer overlapping the gate electrode and spaced apart from each other, a data line on the active layer and crossing the gate line, a protective layer which covers the planarization layer, the source and drain electrodes, and the data line, a contact hole defined in the planarization layer and partially exposing the drain electrode, and a pixel electrode on the protective layer and electrically connected to the drain electrode through the contact hole. | 03-05-2015 |