Shih-Yu
Shih Yu Chang, Hsinchu City TW
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20150113643 | INFORMATION SECURITY METHOD - A method for information security comprises determining by a first processor whether web content includes malicious software by matching the web content with at least one recorded threat, determining by the first processor whether the quantity of malicious software reaches a threshold, processing by a second processor the malicious software with a cryptographic protocol to generate a processing result, if the quantity of malicious software reaches the threshold, and generating a message indicating a threat in response to the processing result. | 04-23-2015 |
Shih Yu Chang, Hsinchu TW
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20160006642 | NETWORK-WIDE SERVICE CONTROLLER - A network-wide service controller comprises a monitoring device, an intelligent device, and a management device. The monitoring device is configured to monitor a state of at least one network. The intelligent device is configured to determine a path within the at least one network according to the state of the at least one network. The intelligent device is further configured to receive an instruction from a user and convert the instruction into a lower-level instruction. The management device is configured to analyze the lower-level instruction from the intelligent device and control forwarding of packets according to a result of analysis of the lower-level instruction and the path determined by the intelligent device. | 01-07-2016 |
Shih Yu Chen, Taichung City TW
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20130129276 | OPTICAL ENGINE ASSEMBLY AND OPTOELECTRONIC PACKAGE - There is provided an optical engine assembly including a bench, at least one optoelectronic unit, at least one optical waveguide and a mount. At least one support groove and a positioning groove are formed on the bench and connected with each other, and the support groove perpendicularly extends outward from one side of the positioning groove. The optoelectronic unit is disposed at the other side of the positioning groove and aligned with the support groove. One end of the optical waveguide is placed inside the support groove and the other end thereof penetrates through at least one through hole of the mount. | 05-23-2013 |
Shih Yu Lee, Dajia Township TW
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20090156949 | Medical device with real-time physiological signal analysis function - A medical device with real-time physiological signal analysis function is disclosed. An ECG signal is generated by detection of detection circuit to the human heart while conversion circuit receives the ECG signal and converts it into an ECG data. The ECG data is sent to a process control unit for being processed to generate a HRV parameter. The ECG data and the HRV parameter are shown by a display unit for real-time analysis of changes of HRV in time domain and frequency domain. Thus doctors can make diagnosis according to these data. Moreover, The process control unit is coupled to the memory module so as to save the ECG data and the HRV parameter. Thus after long-term data collection of the ECG and HRV, doctors can make diagnosis by means of these data. | 06-18-2009 |
Shih Yu Wang, Hsinchu County TW
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20150015159 | LED DRIVER CAPABLE OF REGULATING POWER DISSIPATION AND LED LIGHTING APPARATUS USING SAME - An LED driver having one end coupled with an LED module and another end coupled to a ground, being capable of generating a duty current and a duty in response to a dropout voltage across the LED driver in a way that, the duty current will increase and the duty will decrease when the dropout voltage exceeds a first threshold, and the duty current will decrease and the duty will increase when the dropout voltage falls below a second threshold. | 01-15-2015 |
Shih-Yu Chang, Taichung TW
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20150318256 | PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE HAVING THE SAME - A packaging substrate is provided, which includes: a laminated body; first, second and third conductive pads formed on a surface of the laminated body so as for conductive bumps to be respectively mounted thereon, wherein the third conductive pad is positioned outside of an area between projections of the conductive bumps on the first and second conductive pads on the surface of the laminated body; first, second and third conductive vias formed in the laminated body and electrically connected to the first, second and third conductive pads, respectively; and first, second and third internal conductive traces formed in the laminated body and electrically connected to the first, second and third conductive vias, respectively, thereby preventing bridging from occurring between the conductive bumps and the conductive traces and overcoming non-wetting of the conductive bumps caused by a solder mask layer. | 11-05-2015 |
Shih-Yu Chang, Yangmei City TW
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20150181030 | RINGTONE ASSIGNMENT SYSTEM AND THE METHOD THEREOF - A ringtone assignment system and method are provided. The method includes steps of recording a multimedia ringtone via a first communication device, transmitting a communication linking request to a communication exchange host, transmitting the communication linking request to a second communication device via the communication exchange host to enable the second communication device to feed back ringtone format information supported by the second communication device according to the communication linking request, transmitting the ringtone format information to the first communication device via the communication exchange host to enable the first communication device to code the multimedia ringtone according to the ringtone format information, transmitting the multimedia ringtone from the first communication device to the second communication device, and then decoding and playing the multimedia ringtone by the second communication device. The second communication device is able to recode and assign the multimedia ringtone to the first communication device. | 06-25-2015 |
Shih-Yu Chen, Taipei TW
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20140027877 | SEMICONDUCTOR STRUCTURE FOR ANTENNA SWITCHING CIRCUIT AND MANUFACTURING METHOD THEREOF - A manufacturing method for antenna switching circuit includes the following steps of: providing a GaAs wafer, which includes a capping layer; disposing an isolation layer to the GaAs wafer for forming a device area; and disposing a gate metal on the capping layer within the device area, wherein an interface between the gate metal and the capping layer forms a Schottky contact, and the Schottky contact is parallel connected with an impedance. The present invention also discloses a semiconductor structure for antenna switching circuit. | 01-30-2014 |
20140077621 | SWITCHING CIRCUIT FOR ANTENNA - A switching circuit for an antenna includes a first switching unit, a second switching unit, a third switching unit, a fourth switching unit, a first clamping unit and a second clamping unit. The first clamping unit is coupled to the first switching unit and the fourth switching unit. The first clamping unit includes a first clamping device and a first resistor, which are connected in parallel. The second clamping unit is coupled to the second switching unit and the third switching unit. The second clamping unit includes a second clamping device and a second resistor, which are connected in parallel. | 03-20-2014 |
Shih-Yu Chiu, Dashi TW
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20090206362 | Light emitting diode by use of metal diffusion bonding technology and method of producing such light emitting diode - The main objective of present invention is to provide a manufacturing method of light emitting diode that utilizes metal diffusion bonding technology. AlInGaP light emitting diode epitaxial structure on a temporary substrate is bonded to a permanent substrate having a thermal expansion coefficient similar to that of the epitaxial structure, and then the temporary substrate is removed to produce an LED having a vertical structure and better performance. The other objective of the present invention is to provide a high performance LED that uses metal diffusion technology and wet chemical etching technology to roughen the LED surface in order to improve light extraction efficiency. | 08-20-2009 |
Shih-Yu Chiu, Taoyuan County TW
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20150308660 | LIGHT ENGINE DEVICE - A light Engine device includes a base, a light source module, a light reflecting element, an optical module and a sleeve. The light source module has a light-emitting diode unit and a substrate. The light reflecting element has a first opening, a cup body and a second opening. The optical module has an interface portion and a lens portion. The sleeve has a first port, a sleeve body and a second port. The light emitting diode unit generates a light beam, and the emitted light pattern and light intensity are regulated by the first optical effect and second optical effect. | 10-29-2015 |
20150349216 | LIGHT EMITTING DIODE PACKAGE STRUCTURE - A light emitting diode package structure includes an encapsulation case, a phosphor layer, a substrate, and a light emitting diode chip. The encapsulation case has an accommodating space. The phosphor layer is coated on a side of the encapsulation case. The substrate is disposed in the accommodating space. The light emitting diode chip is disposed on a first surface of the substrate. A surface of the light emitting diode chip is devoid of being directly covered by a colloid, and the light emitting diode chip and the package housing are separated from each other by a distance. | 12-03-2015 |
Shih-Yu Hsieh, Taipei TW
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20160050785 | ELECTRONIC DEVICE WITH SUPPORT - An electronic device with a support includes a main body and a support arm. The support arm includes a fixed component and a support component. The support component comprises a pivot end and a leaning end. The support component pivots relative to the fixed component, such that the support arm has a first usage state and a second usage state. When in the first usage state, an acute angle is formed between the support component and the fixed component, and the leaning end of the support component and a bottom edge of the main body both support the main body. When in the second usage state, an obtuse angle is formed between the support component and the fixed component, and the leaning end of the support component is assembled with a seat which is for supporting the main body. | 02-18-2016 |
Shih-Yu Hsieh, Taipei City TW
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20160044817 | FIXATION STRUCTURE FOR STORAGE MODULE - The disclosure provides a fixation structure, for accommodating and fixing a storage module, including an accommodating housing. The accommodating housing includes a fixed housing and a movable housing. The fixed housing includes a bottom frame and a side frame. The side frame stands on three adjacent sides of the bottom frame to form an opening therebetween. The movable housing is detachably installed on the bottom frame to close the opening and forms an accommodation room with the fixed housing. The storage module is located in the accommodation room. The fixed housing and the movable housing are made of metal. | 02-11-2016 |
Shih-Yu Huang, Taipei County TW
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20100212735 | SOLAR CELL AND METHOD FOR FABRICATING THE SAME - This invention discloses a high-efficiency solar cell structure which enables high throughput manufacturing process thereof. The solar cell is accomplished by forming a plurality of first emitter regions in a front surface of a substrate, a plurality of second emitter regions in the front surface, and a plurality of fingers. Each of the fingers is formed over a least a portion of the second emitter region and a portion of the first emitter region. The first emitter regions and the second emitter regions have a depth not less than 0.2 μm. | 08-26-2010 |
Shih-Yu Kuo, New Taipei City TW
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20140364597 | METHOD FOR ISOLATING NUCLEIC ACIDS FROM FORMALIN-FIXED PARAFFIN EMBEDDED TISSUE SAMPLES - Methods are disclosed for isolating nucleic acids from formalin-fixed paraffin embedded (FFPE) tissue samples. Each of tissue samples contains paraffin and a target biological tissue or material, and the method includes the steps of: adding a first reagent and a second reagent to the FFPE tissue sample, the first reagent dissolving the paraffin material and the second reagent lysing the biological tissue; mixing the first reagent, the second reagent, and the FFPE tissue sample to form a first mixture; (2) heating the first mixture at 50-80° C. for 30-90 minutes; and then heating the first mixture at 80-95° C. for 30-90 minutes to fractionize the first mixture to form an aqueous phase and an oil phase; (3) collecting an aqueous solution from the aqueous phase; and (4) isolating nucleic acids from the aqueous solution. The method improves the efficiency and convenience of isolating nucleic acids from FFPE tissue samples. | 12-11-2014 |
Shih-Yu Lee, Taichung City TW
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20150157295 | ULTRASOUND SYSTEM AND POINTER CONTROLLER - The present invention provides an ultrasound system comprises a display and a pointer controller. The pointer controller has a probe head, a control unit and a probe body. The display displays a pointer and an ultrasound image according the ultrasound signals received by the probe head. When pushing a button of the probe body or handling the probe body in a specific manner, the control unit switches the probe head to control the pointer on the display from the scanning the ultrasound image. | 06-11-2015 |
Shih-Yu Lin, Taipei TW
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20090135554 | KEYBOARD - A keyboard includes a first housing having a plurality of first magnetic elements, a keystroke module having a key portion disposed on the first housing, a second housing combining with the first housing and has an opening, and an actuating assembly. The keystroke module is disposed corresponding to the opening. The actuating assembly is disposed movably on the second housing and has a plurality of second magnetic elements. The keystroke module is not protruded from the opening and is at a packing position. When the actuating assembly is moved along an actuating direction, at least one first magnetic element and at least one second magnetic element attract to each other to shorten the distance, which brings the second housing to move relatively to the first housing so that the key portion of the keystroke module passes though the opening and is at a using position. | 05-28-2009 |
Shih-Yu Liu, Taichung City TW
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20150326633 | PARALLEL SCHEDULING METHOD AND SYSTEM FOR NETWORK DATA TRANSMISSION - According to one exemplary embodiment, a parallel scheduling method for network data transmission is provided. This method generates a corresponding modulus condition set for each weight in a weight set, with each modulus condition of the modulus condition set having a modulus operation, and a divisor and a remainder for the modulus operation, uses a network node to transmit the modulus condition set corresponding to said each weight to a transmitting node corresponding to the weigh. Based on the modulus condition set, the transmitting node transmits a plurality of data chunks, and at least one receiving node receives the plurality of data chunks, wherein each data chunk corresponding to a sequence number, and the sequence number matches a corresponding modulus condition in the modulus condition set. | 11-12-2015 |
Shih-Yu Lu, Nantou County TW
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20140164325 | DATA SYNCHRONIZATION SYSTEM AND METHOD FOR SYNCHRONIZING DATA - A data synchronization system includes a database, a management device, and a synchronization device. The database includes user folders, and the management device includes an authentication module and a data storage module. The authentication module authenticates the identification of the user who uses a client terminal device to log in the authentication module and output an authentication signal based on the result of the identification. The data storage module receives the authentication signal and output an index signal based on the authentication signal. The client terminal device is configured to connect to a corresponding user folder based on the index signal, and the corresponding user folder is used as a major user folder. The synchronization device logs in one of the accounts of a commercial database and synchronizes the data of the account to the major user folder. Furthermore, a method for synchronizing data is also disclosed herein. | 06-12-2014 |
Shih-Yu Pan, Yongkang City TW
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20110103603 | Noise Reduction System and Noise Reduction Method - A noise reduction system and a noise reduction method are provided. The noise reduction system comprises a uni-directional microphone, an omni-directional microphone and a signal processing module. The signal processing module comprises an adaptive noise control (ANC) unit, a main noise reduction unit and an optimizing unit. The uni-directional microphone senses a first audio source to output a first audio signal, and the omni-directional microphone senses a second audio source to output a second audio signal. The ANC unit executes an adaptive noise control to output an estimated signal according to the first audio signal and the second audio signal. The main noise reduction unit executes a main noise reduction process to output a de-noise speech signal according to the estimated signal and the second audio signal. The optimizing unit executes an optimizing process to output an optimized speech signal according to the de-noise speech signal. | 05-05-2011 |
Shih-Yu Tseng, Hsinchu TW
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20160107341 | FIBER BASED SENSOR AND THE FABRICATING METHOD THEREOF - The present invention provides a fiber base sensor and the fabricating method thereof. More specifically, one of the main goals of the present invention is to solve the problem existing in the prior art of the failure of forming a plurality of nano-particles on the surface of the fiber base sensor evenly by utilizing self-assembly process with the nano-imprint process. Furthermore, the another goal of the present invention is to provide detail parameters required in the said nano-imprinting process for avoiding the efficiency drop caused by over-embedding the nano-particles into the fiber based sensor. | 04-21-2016 |
Shih-Yu Wu, Pan Chiao City TW
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20090014745 | Method of manufacturing high power light-emitting device package and structure thereof - A method of manufacturing high power light-emitting device packages and structure thereof, wherein the method thereof includes the steps of: (a) forming a plurality of lead frames, each of the lead frames includes a heat-dissipating element and a plurality of leads; (b) electroplating an outer surface of the lead frames each; (c) coating conductive gel on a surface of the heat-dissipatings each; (d) arranging at least one light-emitting chip on the conductive gel; (e) forming an encapsulant on each of the lead frames; (f) connecting at least one top electrode of the light-emitting chip with one of the leads; (g) coating silicon gel for covering the at one light-emitting chip, and forming integrally a focusing light convex surface on a top surface of the silicon gel; and (h) cutting off the tie-bars to separate the lead frames from one another, whereby forming a plurality of high power light-emitting device packages. | 01-15-2009 |
Shih-Yu Wu, Taipei County TW
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20090261368 | LED CHIP PACKAGE STRUCTURE USING A SUBSTRATE AS A LAMPSHADE AND METHOD FOR MAKING THE SAME - An LED chip package structure using a substrate as a lampshade includes a substrate unit and a light-emitting unit. The substrate unit has a substrate body with a lampshade shape. The light-emitting unit has a plurality of light-emitting elements electrically disposed on an inner surface of the substrate body. Therefore, one part of light beams projected by the light emitting elements is reflected out of the lampshade by the inner surface of the substrate body. | 10-22-2009 |
20110020967 | LED CHIP PACKAGE STRUCTURE WITH HIGH-EFFICIENCY LIGHT EMISSION BY ROUGH SURFACES AND METHOD OF MAKING THE SAME - An LED chip package structure with high-efficiency light emission by rough surfaces includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covering the LED chips. Each package colloid has a cambered colloid surface and a light-emitting colloid surface respectively formed on its top surface and a lateral surface thereof. | 01-27-2011 |
20110189803 | LED CHIP PACKAGE STRUCTURE IN ORDER TO PREVENT THE LIGHT-EMITTING EFFICIENCY OF FLUORESCENT POWDER FROM DECREASING DUE TO HIGH TEMPERATURE AND METHOD FOR MAKING THE SAME - An LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature includes a substrate unit, a light-emitting unit, a transparent colloid body unit, a fluorescent colloid body unit and a frame unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit. The transparent colloid body unit has a plurality of transparent colloid bodies respectively covering the LED chips. The fluorescent colloid body unit has a plurality of fluorescent colloid bodies respectively covering the transparent colloid bodies. The frame unit is covering the peripheries of each transparent colloid body and each fluorescent colloid body in order to expose the top surfaces of the fluorescent colloid body. | 08-04-2011 |
20120003765 | LED CHIP PACKAGE STRUCTURE USING SEDIMENTATION AND METHOD FOR MAKING THE SAME - An LED chip package structure using sedimentation includes a package body, at least two conductive substrates, at least one light-emitting element, and a package unit. The package body has a receiving space. The two conductive substrates are received in the receiving space. The light-emitting element is received in the receiving space and electrically connected to the two conductive substrates. The package unit has a package colloid layer and a powder mixed into the package colloid layer, and the package unit is filled into the receiving space. The powder is uniformly deposited in the receiving space by maintaining the package unit at room temperature firstly and the powder is solidified in the receiving space by heating to a predetermined temperature. | 01-05-2012 |
Shih-Yu Yeh, Tao-Yuan Hsien TW
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20130320363 | SAPPHIRE SUBSTRATE CONFIGURED TO FORM LIGHT EMITTING DIODE CHIP PROVIDING LIGHT IN MULTI-DIRECTIONS, LIGHT EMITTING DIODE CHIP, AND ILLUMINATION DEVICE - A sapphire substrate configured to form a light emitting diode (LED) chip providing light in multi-directions, a LED chip and an illumination device are provided in the present invention. The sapphire substrate includes a growth surface and a second main surface opposite to each other. A thickness of the sapphire substrate is thicker than or equal to 200 micrometers. The LED chip includes the sapphire substrate and at least one LED structure. The LED structure is disposed on the growth surface and forms a first main surface where light emitted from with a part of the growth surface without the LED structures. At least a part of light beams emitted from the LED structure pass through the sapphire substrate and emerge from the second main surface. The illumination device includes at least one LED chip and a supporting base. The LED chip is disposed on the supporting base. | 12-05-2013 |
20130322081 | LIGHT EMITTING ELEMENT AND ILLUMINATION DEVICE THEREOF - A light emitting element includes a transparent substrate and a plurality of light emitting diode (LED) chips. The transparent substrate has a support surface and a second main surface disposed opposite to each other. At least some of the LED chips are disposed on the support surface and form a first main surface where light emitted from with a part of the support surface without the LED chips. Each of the LED chips includes a first electrode and a second electrode. Light emitted from at least one of the LED chips passes through the transparent substrate and emerges from the second main surface. An illumination device includes the light emitting element and a supporting base. The light emitting element is disposed on the supporting base, and an angle is formed between the light emitting element and the supporting base. | 12-05-2013 |
Shih-Yu Yeh, Taoyuan County TW
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20160043063 | LIGHT EMITTING DEVICE - The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180°, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance. | 02-11-2016 |