Shih-Ming Chen
Shih-Ming Chen, Yingge Township TW
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20100314983 | LIGHT EMITTING DIODE LAMP WITH ENHANCED HEAT-CONDUCTING PERFORMANCE - A light-emitting diode lamp with enhanced heat-conducting performance includes a light-emitting module, a heat sink and an elastic piece. The light-emitting module includes an insulating base, a light-emitting diode and a heat-conducting plate. The light-emitting diode is fixed to the insulating base. The heat-conducting plate partially surrounds the exterior of the insulating base to thermally contact the light-emitting diode. The heat sink is provided with a through-hole. The light-emitting module is inserted into the through-hole. The elastic piece is arranged between the heat-conducting plate and the insulating base to push the heat-conducting plate to thermally contact the heat sink. With the elastic piece propping the heat-conducting plate open, the outer surfaces of the heat-conducting plate can be tightly adhered to the inner walls of the through-hole, thereby enhancing the heat-conducting efficiency. | 12-16-2010 |
20110051430 | ASSEMBLY STRUCTURE FOR LED FIXTURE - An assembly structure for LED fixture includes a cooling body, a thermally conductive body and an LED module. The cooling body includes a cylinder, a center of which has a central hole; the thermally conductive body is arranged an opening and a plurality of sectional grooves, each of which is elastically deformed to make the thermally conductive body forcedly arranged into the central hole and thermally contacted with the cylinder; the LED module is connected by passing through the opening of the thermally conductive body and includes a seat body, an LED fixed to the seat body and a thermally conductive piece fitted onto the seat body and thermally contacted with the thermally conductive body; thereby, they are easily placed into the central hole of the cooling body with a capability to achieve effects of close combination and excellent contact between each constituent components. | 03-03-2011 |
Shih-Ming Chen, Hsinchu TW
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20090167993 | METHOD FOR FORMING OPTICAL COMPENSATING FILMS, OPTICAL COMPENSATING FILMS FORMED THEREBY, STRUCTURE OF OPTICAL COMPENSATING FILMS, AND POLARIZING PLATES - The invention provides a method for forming optical compensating films, including: (a) providing a suspension containing clay; (b) adding a mono-functional acrylic oligomer of formula (I) in the suspension, wherein n | 07-02-2009 |
20100022218 | ADMINISTRATION AND SERVICE SYSTEM FOR WIRELESS TERMINAL DISPLAY DEVICES - An administration and service system for wireless terminal display devices comprises a digital supplier supplying digital images, digital video or digital music; an administration server including a user identity administration system, an authentication and authorization system and a digital content administration system, wherein the administration server exchanges digital data with the digital supplier and transmits the digital data; and a terminal display device, which is a digital electronic product communicating with the administration server via a wireless network and performing data transmission and identity administration. The wireless network is based on a Wi-Fi technology, and the terminal display device may be a digital photo frame. The primary objective of the present invention is to enable a user to administrate contents and transmit the contents to a wireless terminal display. | 01-28-2010 |
Shih-Ming Chen, Jhunan TW
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20090115058 | Back End Integrated WLCSP Structure without Aluminum Pads - An integrated circuit structure includes a passivation layer; a via opening in the passivation layer; a copper-containing via in the via opening; a polymer layer over the passivation layer, wherein the polymer layer comprises an aperture, and wherein the copper-containing via is exposed through the aperture; a post-passivation interconnect (PPI) line over the polymer layer, wherein the PPI line extends into the aperture and physically contacts the copper-via opening; and an under-bump metallurgy (UBM) over and electrically connected to the PPI line. | 05-07-2009 |
Shih-Ming Chen, Kaohsiung TW
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20080266400 | Testing system and testing method - A testing system including an image sensor, a transformer, and a display device is disclosed. The image sensor generates an image signal according to a light source. The transformer transforms the image signal into a processing signal. The display device displays a frame according to the processing signal. | 10-30-2008 |
20090032681 | Detector and detecting method - A detector for detecting an image sensor is provided. The image sensor is electrically connected to a wafer via a contacting pad. The detector includes a parallel light source, a pin and a diffuser. The parallel light source radiates a parallel light. The pin is electrically connected to the contacting pad. The diffuser is disposed between the parallel light source and the pin. The parallel light from the parallel light source passes through the diffuser and then reaches the image sensor on the wafer. | 02-05-2009 |
20090079461 | Test socket and test board for wafer level semiconductor testing - A test board for wafer level semiconductor testing is disclosed. The test board comprises a plurality of wires and microelectronic devices; and a plurality of test sockets on an upper surface of the test board. Each test socket comprises: a base member configured for attachment to the test board with a first set of screws, wherein the base member has a central opening exposing a portion of the underlying test board; an anisotropic conductive film disposed within the central opening of the base member; a chip to be tested, disposed on the anisotropic conductive film within the central opening of the base member; and a cover member overlying the chip, attached to the base member with a second set of screws. | 03-26-2009 |
Shih-Ming Chen, Tainan City TW
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20110292690 | Multi-winding high step-up DC-DC converter - A multi-winding high step-up DC-DC converter includes a three-winding transformer to transform a low DC voltage to a high DC voltage; a power switch to control the energy flux of the primary winding of the three-winding transformer based on turning on/off the power switch; a first diode to control the current of the first secondary winding of the three-winding transformer; a second diode to control the current of the second secondary winding of the three-winding transformer; and a third diode to control the current of the primary winding. When the DC-DC converter is in the first operation state, the switch and the second diode are in on state, and the first and the third diodes are in off state. When the DC-DC converter is in the second operation state, the switch and the second diode are in off state, and the first and the third diodes are in on state. | 12-01-2011 |
20120113688 | Interleaved flyback converter device with leakage energy recycling - An interleaved flyback converter device with leakage energy recycling includes: two flyback converters and an input power. Each flyback converter includes a capacitor, a switch, two diodes, and a transformer. The input power is connected to the capacitors of the two flyback converters respectively. By using the capacitors as input voltage, the two flyback converters are provided with lower voltage rating. The diodes are used to recycle leakage energy directly, and to clamp voltage on power components. Therefore, in addition to enhancing efficiency via recycling leakage energy, the two flyback converters have lower switching losses due to lower switching voltage. | 05-10-2012 |
20150146451 | OPTICAL THIN FILM AND EDGE-TYPE BACKLIGHT MODULE CONTAINING THE SAME - An optical thin film includes: a transparent substrate including a first surface and a second surface which is opposite to the first surface; a first light-condensing layer formed on the first surface of the transparent substrate, the first light-condensing layer having a haze value ranging from 5% to 30% and a surface roughness ranging from 0.1 RMS to 1 RMS; and a second light-condensing layer formed on the second surface of the transparent substrate. The second light-condensing layer has a haze value ranging from 70% to 100% and a surface roughness ranging from 1 RMS to 10 RMS. | 05-28-2015 |
Shih-Ming Chen, Changhua County TW
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20120061129 | CIRCUIT BOARD STRUCTURE WITH LOW CAPACITANCE - A circuit board structure, comprising: a first metal layer, including at least one cavity; and a plurality of first pads, for connecting at least one differential signal transmission line; wherein at least part of a vertical projection of the first pad, which is projected on the first metal layer, is overlapped with the cavity. | 03-15-2012 |
Shih-Ming Chen, New Taipei City TW
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20120216991 | METHOD FOR ASSEMBLING HEAT PIPE AND THERMO-CONDUCTIVE BODY AND STRUCTURE THEREOF - A heat pipe and thermo-conductive body assembling structure and a method for manufacturing the same are disclosed. The thermo-conductive body is provided a trough with two pressing arms at the opening thereof. The heat pipe is accommodated in the trough and pressed by the pressing arms. An exposed portion of the heat pipe and outer surfaces of the pressing arms are coplanar. | 08-30-2012 |
20120318035 | PRESSING-SHAPING METHOD FOR MANUFACTURING CIRCULAR COOLING BASE FOR BEING EMBEDDED WITH FINS AND MOLD USED IN THE METHOD - A pressing-shaping method for manufacturing a circular cooling base for being embedded with fins and a mold used in the method are disclosed. The method includes providing a blank ingot that has a first surface, a second surface, and a lateral circular surface encircling the rims of the first and second surfaces. The method further includes using a mold to press the blank ingot to cause the first surface of the blank ingot to indent inward to form a groove, and to cause a plurality of clipping grooves to be formed on the lateral circular surface of the blank ingot through extrusion. As a result, the blank ingot is shaped into the circular cooling base for being embedded with fins. | 12-20-2012 |
20120325430 | FIN TYPE HEAT SINK FIXING ASSEMBLY - A fin type heat sink includes a heat conducting base, fins, pressing plates and positioning members. The fins are parallely installed with an interval apart from each other on the heat conducting base, and a fixing plate is perpendicularly extended from the bottom of each fin. The fixing plate includes through holes, and the pressing plate is installed corresponding to the fin. Each pressing plate is installed on the fixing plate and has combining holes corresponding to the through holes, and the positioning member is fixed onto the heat conducting base, and the positioning member is passed through the through hole and the combining hole and fixed onto the pressing plate, such that the pressing plate presses the fixing plate flatly onto the heat conducting base. Therefore, heat at the heat conducting base can be conducted to the fins quickly to enhance the thermal conduction effect. | 12-27-2012 |
Shih-Ming Chen, Hsin-Chu TW
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20130003011 | Lens Film and Manufacturing Method Thereof - A lens film and a manufacturing method thereof are disclosed. The lens film manufacturing method includes the steps of: forming an alignment film on a glass substrate; rubbing the alignment film along a rubbing direction; dispersing a liquid crystal polymer (LCP) material between the alignment film of the glass substrate and a lens mold; rolling the lens mold along a rolling direction to make the LCP material to form a lens film. A plurality of liquid crystal molecules of the lens film is affected by the alignment film to align along the rubbing direction. The lens film and a base panel having a polarization direction are operated in a LCD apparatus. The angle between the rubbing direction and the polarization direction is less than 15°. | 01-03-2013 |
20150309371 | LIQUID CRYSTAL DISPLAY PANEL AND MANUFACTURING METHOD USING THE SAME - A method for manufacturing a liquid crystal display panel includes respectively forming two polymer layers on a first substrate and a second substrate. The two polymer layers are rubbed. A plurality of liquid crystal molecules and a plurality of monomers are provided between the first substrate and the second substrate, and the polymer layers are disposed facing the liquid crystal molecules and the monomers. The monomers are polymerized to form two polymer rubbing layers with the polymer layers. | 10-29-2015 |
Shih-Ming Chen, Taichung City TW
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20160032233 | AERATION APPARATUS, AERATION METHOD AND CLEANING METHOD - An aeration apparatus, comprising: a gas-liquid mixing-circulating module, a gas supplying module, a controlling module and a cleaning unit, wherein the gas-liquid mixing-circulating module comprises: a first switch valve, connecting to a liquid outlet of a culture tank; a booster pump, connecting to the first switch valve; a micro-bubble producing device, having one end connecting to the booster pump and the other end connecting to a liquid inlet of the culture tank; a first proportional valve; a venturi tube, having a head, a tail and a branch, the other opening of the first proportional valve connecting to the head; and a second proportional valve, having an opening connecting to the tail, and the other opening connecting to the second tube, wherein, a fifth tube transfer gas to the venturi tube through the branch; wherein, the controlling module regulates the gas-liquid mixing-circulating module, the gas supplying module and the cleaning unit. | 02-04-2016 |