Patent application number | Description | Published |
20080218623 | ACCURATELY-ALIGNED CAMERA MODULE AND METHOD FOR MAKING SAME - A camera module includes an image sensor, a lens module and a holder. The holder defines a cavity, the cavity including a first receiving portion, with the lens module received therein, and a second receiving portion. The side surface of the image sensor tightly contacts the inner surface of the holder surrounding the second receiving portion. In the camera module, an optical center of the image sensor can keep accurately aligning with an optical center of the lens module. Accordingly, the camera module can keep good quality for imaging. A method for making the camera module is also provided. | 09-11-2008 |
20080297645 | CAMERA MODULE WITH COMPACT PACKAGING OF IMAGE SENSOR CHIP AND METHOD OF MANUFACTURING THE SAME - An exemplary camera module includes a lens holder, a lens module, an image sensor chip, at least three apart bonding pads, and a light transmittance element. The lens module is received in the lens holder. The lens module includes a barrel and at least one lens received in the barrel. The image sensor chip includes a photosensitive area configured for receiving light transmitted through the lens module. The image sensor chip is attached to an end of the lens holder facing away from the lens module. The bonding pads are arranged on the image sensor chip around the photosensitive area. The light transmittance element is fixed on the image sensor chip via the at least three bonding pads. The present invention also relates to a method for manufacturing the camera module. | 12-04-2008 |
20090122176 | IMAGING MODULE PACKAGE - An exemplary imaging module package includes a lens module and an imaging sensor module. The lens module includes a housing having a hollow top portion and a hollow bottom portion coaxially aligned with the hollow top portion. The imaging sensor module is received in the hollow bottom portion. The imaging sensor module includes an imaging sensor connected to the substrate and secured to the bottom portion, a substrate spaced from the bottom portion and defining at least one recess therein, and a plurality of passive components received in the at least one recess and wholly disposed below the imaging sensor. | 05-14-2009 |
20090135297 | CAMERA MODULE - An exemplary camera module includes a substrate, a printed circuit board, an imaging sensor chip, and a lens module. The substrate defines a top surface and a recessed portion in the top surface. The printed circuit board defines a bottom surface soldered to the top surface of the substrate. The imaging sensor chip is received in the recessed portion of the substrate. The lens module is positioned above the imaging sensor chip, with an optical center thereof aligned with that of the imaging sensor chip. | 05-28-2009 |
20090153706 | IMAGING MODULE PACKAGE - An imaging module package includes a substrate, an imaging sensor chip, a functional unit, a housing, and a lens module positioned in the housing. The substrate defines an upper chamber extending through a top surface thereof, and a lower chamber extending through a bottom surface thereof. The imaging sensor chip is positioned in the upper chamber and is electrically connected to the substrate. The functional unit is positioned in the lower chamber and is electrically connected to the substrate. The housing is mounted on the top surface of the substrate and is disposed above the imaging sensor chip. | 06-18-2009 |
20090166833 | SEMICONDUCTOR UNIT WHICH INCLUDES MULTIPLE CHIP PACKAGES INTEGRATED TOGETHER - A semiconductor unit includes an interface plate, a supporting plate integrally formed with the interface plate, two chip packages positioned at opposite sides of the supporting plate, and leading traces running in the interface plate and the supporting plate, connected with the chip packages respectively. | 07-02-2009 |
20090166837 | COMBINATION OF CHIP PACKAGE UNITS - A combination includes a first chip package unit and a second chip package unit on which the first chip package unit is placed. Each of the first and second chip package units includes a substrate having a first surface, a second surface, a chip package electrically connected to the first surface, and a plurality of bonding pads formed on the first and second surfaces. The bonding pads on the first surface of the first chip package unit are respectively electrically connected with the bonding pads on the surface of the second chip package unit. The chip packages electrically connected to the first surfaces are enclosed by the substrates, and the bonding pads on the second surfaces are configured as interface terminals of the combination. | 07-02-2009 |
20120044411 | CAMERA MODULE AND METHOD FOR ASSEMBLING THE SAME - A camera module includes a first circuit board, a holder, a lens module, an image sensor chip, a filter, and a second circuit board. The holder includes a sleeve and a base connected to an end of the sleeve. The lens module is received in the sleeve. The holder is mounted on the first circuit board. The base defines a first receiving portion. The image sensor chip is electrically fixed to the first circuit board and received in the first receiving portion. The filter is received in the first receiving portion corresponding to the image sensor chip. The second circuit board is electrically connected to the first circuit board. The second circuit board is received in the first receiving portion and fixed to the base. | 02-23-2012 |
20120044412 | CAMERA MODULE AND ASSEMBLY METHOD THE SAME - A camera module includes a first circuit board, a holder, a lens module, an image sensor chip, a filter, and a second circuit board. The holder includes a sleeve and a base connected to an end of the sleeve. The lens module is received in the sleeve. The holder is mounted on the first circuit board. The base defines a receiving portion. The image sensor chip is electrically fixed to the first circuit board and received in the receiving portion. The filter is received in the first receiving portion corresponding to the image sensor chip. The second circuit board is electrically connected to the first circuit board. The second circuit board is received in the first receiving portion and fixed to the first circuit board. Incident light passes through the lens module and the filter in that order, and finally projects on the image sensor chip. | 02-23-2012 |