Patent application number | Description | Published |
20100268367 | METHOD FOR BIN-BASED CONTROL - A method for providing bin-based control when manufacturing integrated circuit devices is disclosed. The method comprises performing a plurality of processes on a plurality of wafer lots; determining a required bin quantity, an actual bin quantity, and a projected bin quantity; comparing the determined required bin quantity with the determined actual bin quantity and determined projected bin quantity; and modifying at least one of the plurality of processes on the plurality of wafer lots if the determined actual bin quantity and determined projected bin quantity fail to satisfy the determined required bin quantity. | 10-21-2010 |
20130117164 | METHODS AND SYSTEMS FOR DYNAMIC INVENTORY CONTROL - A production management system is configured to dynamically control inventory of a semiconductor product to prevent overstock and stockout. The production management system includes a production planning module including components containing data of demand forecast, and customer order. The production management system further includes a dynamic inventory control module including a dynamic inventory control simulation module and an inventory management system, wherein the inventory management system is configured to record real inventory data, and wherein the dynamic inventory control simulation module includes simulators for target inventory, future inventory, future shipment and semiconductor product production. | 05-09-2013 |
20140249884 | SYSTEM FOR DYNAMIC INVENTORY CONTROL - A production management system is configured to dynamically controlling inventory of a semiconductor product to prevent overstock and stockout. The production management system includes a production planning module including components containing data of demand forecast, and customer order. The production management system further includes a dynamic inventory control module including a dynamic inventory control simulation module and an inventory management system, wherein the dynamic inventory control simulation module is configured to adjust a target inventory if a current inventory is beyond a threshold multiplied by the target inventory for M number of review cycles. | 09-04-2014 |
Patent application number | Description | Published |
20080286682 | MATERIAL AND METHOD FOR PHOTOLITHOGRAPHY - A photosensitive material for use in semiconductor manufacture comprises a copolymer that includes a plurality of photoresist chains and a plurality of hydrophobic chains, each hydrophobic chain attached to the end of one of the photoresist chains. The copolymer in response to externally applied energy will self-assemble to a photoresist layer and a hydrophobic layer. | 11-20-2008 |
20090057554 | METHOD FOR PHOTORESIST CHARACTERIZATION AND ANALYSIS - A method for photoresist characterization includes forming a photoresist on a supportive structure; and characterizing the photoresist using a metrology tool selected from the group consisting of a transmission electron microscope (TEM), a scanning electron microscope (SEM), an atomic force microscope (AFM), a small angle X-ray scattering (SAXS) and a laser diffraction particle analyzer. | 03-05-2009 |
20090203224 | Si Device Making Method By Using A Novel Material For Packing and Unpacking Process - A method of lithography patterning includes forming a resist pattern on a substrate, the resist pattern including at least one desired opening and at least one padding opening therein on the substrate; forming a patterned photosensitive material layer on the resist pattern and the substrate, wherein the patterned photosensitive material layer covers the padding opening of the resist pattern; and applying a resolution enhancement lithography by assist of chemical shrink (RELACS) process to the desired opening of the resist pattern. | 08-13-2009 |
20120009524 | MATERIAL AND METHOD FOR PHOTOLITHOGRAPHY - A photosensitive material for use in semiconductor manufacture comprises a copolymer that includes a plurality of photoresist chains and a plurality of hydrophobic chains, each hydrophobic chain attached to the end of one of the photoresist chains. The copolymer in response to externally applied energy will self-assemble to a photoresist layer and a hydrophobic layer. | 01-12-2012 |
Patent application number | Description | Published |
20080303444 | LED LIGHTING MODULE WITH RADIATING AND AUTOMATIC POWER-OFF FUNCTIONS - The present invention provides an LED lighting module with radiating and automatic power-off functions. The module includes a power supply element, an LED element and radiating member as well as a circuit linking them. The circuit linking the power supply element, LED element and radiating member is a serial loop, so that the power supply element, LED element and radiating member are combined into a single loop circuit. The LED elements will be automatically turned off if the radiating member is burnt to prevent the overheating problem of LED elements and to prolong the service life with improved applicability. | 12-11-2008 |
20090074571 | VANE STRUCTURE OF AN AIRFLOW GENERATOR - The present invention provides a vane structure of an airflow generator. The plate of predefined thickness and width has a locating portion and a swinging end. The swinging end of the vane is wider than the locating portion. There is an oblique section placed between the swinging end and locating portion for linking purposes. A better wind guide effect can be obtained from the expanded swinging end, and the oblique section is employed to reduce inlet stagnation, thus greatly improving the smoothness of air flow and the operating performance of the vane with better applicability. | 03-19-2009 |
20090109623 | HEAT-RADIATING MODULE WITH COMPOSITE PHASE-CHANGE HEAT-RADIATING EFFICIENCY - The present invention provides a heat-radiating module with composite phase-change heat-radiating efficiency. The cooling pad of the heat-radiating module is fitted with a heating portion and radiating portion. The first and second chambers are placed at intervals into the cooling pad. The first and second phase-change materials are separately placed in two chambers. The reaction temperatures of two phase-change materials differ from each other. The phase-change material of higher reaction temperature assists in heat-absorbing and preventing overheating. There is a heat peak when the cooling pad reaches the preset high-temperature state. When the temperature of the cooling pad declines below a preset temperature, the phase-change material of lower reaction temperature will release the stored latent heat, enabling the cooling pad to maintain an operating temperature and improve the heat-radiating efficiency in a variety of equipment. | 04-30-2009 |
20090139696 | FLAT HEAT PIPE WITH MULTI-PASSAGE SINTERED CAPILLARY STRUCTURE - The flat heat pipe with multi-passage sintered capillary structure includes a flat pipe, which is a hollow pipe with a flat cross section and two sealed ends. Two flat surfaces and two lateral parts are defined. The flat pipe forms a heating section and a cooling section. A hollow chase is formed within the flat pipe. The sintered capillary structure is prefabricated into the hollow chase and is provided with at least two coupling sides for mating with two flat surfaces of the flat pipe. At least two flow passages are formed at intervals onto a preset location of the sintered capillary structure and arranged along the extension direction of the flat pipe. | 06-04-2009 |
20110315359 | RADIATOR FAN MODULE - A radiator fan module has a fan assembly, cooling fin and heat conductor. The fan assembly has a shell seat and fan blade, an air outlet is set at one side of the shell seat, the cooling fin is set correspondingly to the outlet, and the cooling end of the conductor is mated with the fin. The outlet forms an inward extended wall, an outward extended wall and an extended inner space set between the outlet and fan blade. The outlet has a width-reducing pattern. A notched space is formed externally between the inward extended wall and shell seat. An inward extended heat conductor is formed by the extension of the inner end of the cooling fin and is located within the range of the extended inner space, and provided with a blade corresponding side that is located correspondingly to a peripheral position of the blade. | 12-29-2011 |