Patent application number | Description | Published |
20130017476 | MEASURING APPARATUS, DRAWING APPARATUS, AND ARTICLE MANUFACTURING METHODAANM OGAWA; ShigekiAACI Utsunomiya-shiAACO JPAAGP OGAWA; Shigeki Utsunomiya-shi JP - The beam measuring apparatus of the present invention includes a detection device including a shield member that has an edge, and a detector configured to detect the beam of which at least a part is not shielded by the shield member; a relative movement mechanism configured to cause a relative movement between the shield member and the beam; and a controller configured to control the detection device and the relative movement mechanism so as to cause one of the edge and the beam to traverse the other with respect to each of a plurality of points on the edge, to sum a plurality of signals, respectively obtained by the detection device with respect to the plurality of points and with respect to relative positions of the relative movement corresponding to one another, so as to obtain a signal sequence, and to obtain the characteristic based on the signal sequence. | 01-17-2013 |
20130148091 | LITHOGRAPHY APPARATUS AND METHOD, AND METHOD OF MANUFACTURING ARTICLE - A lithography apparatus which positions a substrate based on measurement of a position of an alignment mark on the substrate to form a pattern on the substrate. The apparatus includes an acquisition unit configured to acquire a first required alignment precision in a first direction, and a second required alignment precision in a second direction different from the first direction, and a controller configured to determine, based on the first required alignment precision, a first condition for a first measurement process of measuring a position of an alignment mark in the first direction, to determine, based on the second required alignment precision, a second condition for a second measurement process of measuring a position of an alignment mark in the second direction. | 06-13-2013 |
20130148122 | METHOD OF MANUFACTURING DEVICE, AND SUBSTRATE - A method includes a first step of forming a circuit pattern and an alignment mark on a substrate and a second step of measuring a position of the alignment mark and positioning the substrate. The alignment mark includes a first linear pattern arranged on one side of a first straight line, a second linear pattern arranged on the other side of the first straight line, a third linear pattern arranged on one side of a second straight line, and a fourth linear pattern arranged on the other side of the second straight line. The first step includes determining total number of the third and fourth linear patterns to be formed and total number of the first and second linear patterns to be formed based on required precisions in directions along the first and second straight lines. | 06-13-2013 |
20130188165 | LITHOGRAPHY APPARATUS, AND METHOD OF MANUFACTURING ARTICLE - A lithography apparatus includes: a rotation mechanism configured to rotate a substrate; a first measurement device configured to measure a position of an alignment mark formed on the substrate in a first direction with a first precision; a second measurement device configured to measure a position of an alignment mark formed on the substrate in a second direction with a second precision higher than the first precision; and a controller configured to control the rotation mechanism so that a direction, in which the substrate requires an overlay precision higher than another direction, is aligned with the second direction. | 07-25-2013 |
20150325404 | LITHOGRAPHY APPARATUS AND METHOD, AND METHOD OF MANUFACTURING AN ARTICLE - A lithography apparatus for performing patterning on a substrate with a charged particle beam is provided. An optical system of the apparatus has a function of adjusting the focus position of the charged particle beam and the irradiation position of the charged particle beam on the substrate, and irradiates the substrate with the charged particle beam. A controller of the apparatus controls the optical system such that the patterning is performed with adjustment, of the focus position and the irradiation position based on the surface shape of the substrate for adjustment of the focus position, accompanied with the patterning. | 11-12-2015 |
20150362842 | LITHOGRAPHY APPARATUS, AND METHOD OF MANUFACTURING ARTICLE - The present invention provides a lithography apparatus which sequentially irradiates, with a beam, a first region and a second region, that have a stitching region in common, on a substrate to form a pattern on the substrate, the apparatus including a processor configured to respectively give weights to first information of a position of the second region before irradiation of the first region with a beam and second information of a position of the second region after the irradiation to obtain information of a position of the second region. | 12-17-2015 |
20150364291 | LITHOGRAPHY APPARATUS, AND METHOD OF MANUFACTURING ARTICLE - The present invention provides a lithography apparatus which forms a pattern by sequentially irradiating a first region and a second region on a substrate with a beam, the apparatus including a beam detector configured to detect the beam, and a processor configured to obtain position information of the second region by giving a weight to first position information of the second region based on an output from the beam detector before irradiation of the first region with the beam, and giving a weight to second position information of the second region based on an output from the beam detector after the irradiation. | 12-17-2015 |
20150380214 | LITHOGRAPHY APPARATUS, AND METHOD OF MANUFACTURING ARTICLE - Provided is a lithography apparatus that performs patterning on a substrate with a plurality of beams, the apparatus comprising: an optical system configured to irradiate the substrate with the plurality of beams; and a controller configured to control the optical system, wherein the controller is configured to control the optical system so as to form a first pattern for an article in a first region of the substrate and form a second pattern for an inspection of the plurality of beams in a second region, different from the first region, of the substrate. | 12-31-2015 |