Patent application number | Description | Published |
20090091648 | Multi-resolution Image Sensor Array with High Image Quality Pixel Readout Circuitry - A configurable, compact multi-resolution linear image sensor array is disclosed. The multi-resolution image sensor array employs a spatial array of photoelectric sites with each site having an image output terminal and a cluster of switched photo-detector elements. To effect a high quality snapshot operation mode for a high pixel count array, a transfer control switch is added bridging each photo-detector element and its correspondingly connected negative input terminal of an operational amplifier to form an active pixel sensor circuit. To minimize a reset kTC noise associated with numerous traditional active pixel sensor circuits, an in-pixel KTC noise-correlated correlated multiple sampling (CMS) circuitry is also proposed to replace an otherwise traditional correlated double sampling (CDS) circuitry. | 04-09-2009 |
20100007775 | Areal Active Pixel Image Sensor with Programmable Row-specific Gain for Hyper-Spectral Imaging - An areal active pixel image sensor (AAPS) with programmable row-specific gain is disclosed for converting hyper-spectral light image into video output signal (VOS). The AAPS includes:
| 01-14-2010 |
20100213355 | Full-width Line Image-sensing Head - A full-width line image-sensing head (FLIH) is proposed for, expressed in X-Y-Z coordinates, converting a pixel line image (PLI) of length L | 08-26-2010 |
20110019044 | Time Delay Integration Based MOS Photoelectric Pixel Sensing Circuit - A time delay integration (TDI) based MOS photoelectric pixel sensing circuit (TDIPSC) is proposed. The TDIPSC includes multi-element photoelectric pixel sensor (MEPS) having sub-pixel sensor elements SPSE | 01-27-2011 |
20110149132 | Wafer-scale Cluster Image Sensor Chip and Method with Replicated Gapless Pixel Line and Signal Readout Circuit Segments - A multi-pixel row wafer-scale cluster image sensor chip (WCISC) is proposed. Expressed in X-Y-Z coordinates with its pixel rows along X-axis, the WCISC converts areal image frame (IMFM) into areal image frame signal (AIFS). The WCISC includes multiple imaging pixel rows PXRW | 06-23-2011 |
20130208110 | System and method for monitoring multiple targets using a single camera - Techniques to monitor multiple targets with a single camera are disclosed. In one embodiment, an image sensor is provided with two or more readout circuits, each operating independently and is designed to read out charges from a designated area of the image sensor. When two or more designated sensing areas in the image sensor are being focused onto different objects and read out respectively, such an image sensor is capable of monitoring multiple targets. When placed in traffic surveillance, a camera equipped with such an image sensor is able to monitor multiple forward and backward lanes in near or far field. Further with the control of the designated areas, different resolutions of the images may be produced. | 08-15-2013 |
20130208154 | High-sensitivity CMOS image sensors - Designs of image sensors with subpixels are disclosed. According to one aspect of an image sensor in one embodiment, subpixels within a pixel are designed without significantly increasing the cell or pixel area of the pixel. The readouts from the subpixels are accumulated to increase the sensitivity of the pixel without increasing the area of the image sensor. According to another aspect of the image sensors in the present invention, some subpixels within a pixel are respectively coated with filters, each designed for a frequency range. Thus the frequency response of a CMOS image sensor can be enhanced significantly according to application. | 08-15-2013 |
20140022425 | Multi-band sensors - Designs of multi-band sensor array to generate multi-spectral images are disclosed. According to one aspect of the present invention, a multi-band sensor array includes one linear sensor configured to sense a scene in panchromatic spectrum to produce a panchromatic (PAN) sensing signal, and four color-band linear sensors to sense the same scene in different color bands to produce respective sensing signals. These sensors are packaged in a single module that is disposed on a single optical plane when used to scan a scene. A multi-spectral image is produced by combining these sensing signals. Further a unique packaging of the sensor array and a combination of soft and hard PCB are disclosed to withstand extremes in a harsh environment. | 01-23-2014 |