Sheng-Ming
Sheng-Ming Chang, Taipei County TW
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20090166849 | SEMICONDUCTOR CHIP - A semiconductor chip includes a die mounted on a packaging substrate. The die includes a semiconductor substrate; inter-metal dielectric layers on the semiconductor substrate; levels of metal interconnection, wherein at least two potential equivalent metal traces are formed in a level of the metal interconnection; a passivation layer disposed over the two metal traces, wherein two openings are formed in the passivation layer to expose portions of the two metal traces; a conductive member externally mounted on the passivation layer between the two openings; and a redistribution layer formed over the conductive member. | 07-02-2009 |
20090187874 | CIRCUIT AND CIRCUIT DESIGN METHOD - A circuit and a circuit design method are provided. The circuit operates between a first power source voltage and a ground voltage. The circuit comprises at least one low speed circuit path and at least one high speed circuit path. The low speed circuit path adjusts voltage level at the first power source voltage or the ground voltage. The low speed circuit path provides a first return path and isolates unwanted noise signals for a signal on the high speed circuit path. | 07-23-2009 |
20100171211 | SEMICONDUCTOR DEVICE - A semiconductor device is provided by the present invention. The semiconductor device includes a semiconductor die, and the semiconductor die includes a die core having at least two bond pads with voltage level equivalent to each other and electrically connected to each other via at least a bond wire, and an input/output (I/O) periphery. The semiconductor device of the present invention is capable of solving the IR drop of the semiconductor die with low cost. | 07-08-2010 |
20110241206 | SEMICONDUCTOR DEVICE - A semiconductor device is provided by the present invention. The semiconductor device includes a first semiconductor die comprising at least a first bond pad; and a second semiconductor die comprising at least a second bond pad with voltage level equivalent to the first bond pad of the first semiconductor die; wherein the first bond pad of the first semiconductor die is electrically connected to the second bond pad of the second semiconductor die via at least a bond wire. The semiconductor device of the present invention is capable of solving the IR drop of the semiconductor die with low cost. | 10-06-2011 |
Sheng-Ming Chang, Hsinchu TW
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20100042842 | LIGHT WEIGHT AUTHENTICATION AND SECRET RETRIEVAL - A method for authenticating a message in a network is provided. The method includes a step of generating, in a sink device, a private key and a public key. The private key includes a plurality of sub-private keys. The method further includes a step of generating, in the sink device, a signature for the message. The signature includes a sub-private key and an authentication path associated with the sub-private key in a hash tree. The hash tree is constructed during the generation of the sub-public keys. | 02-18-2010 |
Sheng-Ming Chang, Taipei City TW
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20080264673 | Differential signal layout printed circuit board - A positive differential signal trace and a negative differential signal trace are formed on different layers of a printed circuit board. A first ground trace is formed on the layer on which the positive differential signal trace is formed, and a second ground trace is formed on the layer on which the negative differential signal trace is formed. An insulation layer is positioned between the two layers and has a predetermined thickness. A differential mode impedance and a common mode impedance of differential signals are dependent on the predetermined thickness of the insulation layer, width and thickness of each differential signal trace, and a space between each differential signal trace and the corresponding ground trace formed on the same layer. | 10-30-2008 |
Sheng-Ming Chang, New Taipei City TW
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20110248394 | LEADFRAME PACKAGE FOR HIGH-SPEED DATA RATE APPLICATIONS - A semiconductor package includes a die pad; a semiconductor die mounted on the die pad; a plurality of leads disposed along peripheral edges of the die pad; a ground bar between the leads and the die pad; and a plurality of bridges connecting the ground bar with the die pad, wherein a gap between two adjacent bridges has a length that is equal to or less than 3 mm. | 10-13-2011 |
20130220690 | PRINTED CIRCUIT BOARD FOR MOBILE PLATFORMS - The invention provides a printed circuit board for mobile platforms. An exemplary embodiment of the printed circuit board for mobile platforms includes a core substrate having a first side. A ground plane covers the first side. A first insulating layer covers the ground plane. A plurality of first signal traces and a plurality of first ground traces are alternatively arranged on the first insulating layer. A second insulating layer connects to the first insulating layer. A plurality of second signal traces separated from each other is disposed on the second insulating layer, wherein the second signal traces are disposed directly on spaces between the first signal traces and the first ground traces adjacent thereto. | 08-29-2013 |
20140264812 | SEMICONDUCTOR PACKAGE ASSEMBLY - The invention provides a semiconductor package assembly. The semiconductor package assembly includes a first semiconductor package. The first semiconductor package includes a first body having a first device-attach surface and a first bump-attach surface opposite to the first device-attach surface. A second semiconductor package is bonded to the first device-attach surface of the first semiconductor package. The second package includes a second body having a second device-attach surface and a second bump-attach surface opposite to the second device-attach surface. A dynamic random access memory (DRAM) device is mounted on the second device-attach surface. A decoupling capacitor is mounted on the second device-attach surface. Conductive structures are disposed on the second bump-attach surface of the second package, connecting to the first bump-attach surface of the first body of the first semiconductor package. | 09-18-2014 |
20150074346 | MEMORY CONTROLLER, MEMORY MODULE AND MEMORY SYSTEM - A memory module, comprising: a first pin, arranged to receive a first signal; a second pin, arranged to receive second signal; a first conducting path, having a first end coupled to the first pin; at least one memory chip, coupled to the first conducting path for receiving the first signal; a predetermined resistor, having a first terminal coupled to a second end of the first conducting path; and a second conducting path, having a first end coupled to second pin for conducting the second to a second terminal of the predetermined resistor; wherein the first signal and the second are synchronous and configured to be a differential signal, for enabling a selected memory chip from the at least one memory chip to be accessed. | 03-12-2015 |
Sheng-Ming Chang, Sanchong City TW
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20130113516 | TERMINATION CIRCUIT AND DC BALANCE METHOD THEREOF - A termination circuit for a plurality of memories controlled by a controller is provided. The termination circuit includes a plurality of drivers, a plurality of resistors and a plurality of capacitors. Each of the drivers is coupled to the memories via a transmission line. Each of the resistors is coupled to the corresponding driver via the corresponding transmission line. Each of the capacitors is coupled between the corresponding resistor and a reference voltage. The controller is coupled to the memories via the drivers, and the controller provides a specific code to one of the drivers when a quantity of logic “0” and a quantity of logic “1” transmitted to the memories via the transmission line corresponding to the one of the drivers are unbalanced, so as to adjust a termination voltage of the capacitor corresponding to the one of the drivers. | 05-09-2013 |
Sheng-Ming Chang, Taichung City TW
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20140331447 | NOZZLE OF DUST BLOWER - A nozzle of dust blower is mainly a hollow tube with one open end connected to the dust blower and the other end a closed end. The wall near the closed end has several outlets on the same side toward a radial direction of the tube, so that the high-pressure air blown by the dust blower into the tube blows out of the outlets in the radial direction. Corresponding to each of the outlets, the tube has an auxiliary nozzle base. Each nozzle base has a passage connected to the corresponding outlet. The passage of each of the nozzle bases extends along the radial direction of the tube. The end of each of the nozzle bases near the tube has at least one inlet, so as to suck more air into the nozzle base as the air is blown out. | 11-13-2014 |
Sheng-Ming Huang, Hsin-Chu TW
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20150177557 | Thin Display Panel and Manufacturing Method Thereof - A display panel is provided. The display panel includes a first substrate, a second substrate, a sealing frame set, and a third adhesion portion. The first substrate has an inner surface which includes a superposed area and an exposed area on a side of the superposed area. The second substrate is disposed and superposed on the superposed area; the substrates have a space therebetween. The sealing frame set is located between the substrates and disposed along and insides an edge of the superposed area to enclose the space. The sealing frame set includes first and second sealing frames, wherein the first sealing frame connects the substrates and surrounds the superposed area, the second sealing frame surrounds an outer side of the first sealing frame. A third adhesion portion is located between the first and the second substrates, and between the second sealing frame and the exposed area. | 06-25-2015 |
Sheng-Ming Lin, Hsinchu City TW
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20130314307 | DRIVING SYSTEM AND METHOD FOR DOT-MATRIX LIGHT-EMITTING DIODE DISPLAY DEVICE - A driving system and a method for a dot-matrix light-emitting diode display device. The driving system comprises a controller, a scan line driver, and a signal line driver. The controller provides a scan line control signal and a signal line control signal. The scan line driver generates a scan line driving signal in response to the scan line control signal. The scan line driving signal is divided into an ON period and a OFF period. The signal line driver generates a signal line driving signal in response to the signal line control signal. The signal line driver generates a discharging control signal or a charging control signal during the OFF period so that the signal line driver and the plurality of signal lines form the discharging or charging paths. Therefore, the parasitic capacitors on the scan lines are discharged or the parasitic capacitors on the signal lines are charged. | 11-28-2013 |
Sheng-Ming Yang, New Taipei City TW
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20150123584 | METHOD AND CONTROL SYSTEM FOR SUPPRESSION OF VIBRATION - A method for suppression of vibration includes: adjusting a center frequency of a band-pass filter, and subjecting a to-be-detected signal to processing by the band-pass filter to result in a bandpass-filtered signal; performing signal processing upon the bandpass-filtered signal to obtain a converted result; determining whether a scanning process is completed, and repeating the previous two steps when a result is negative to obtain plural converted results; determining a maximum value among the converted results, and determining the corresponding center frequency to serve as an interference frequency; and setting the interference frequency as an operating frequency of a notch filter. | 05-07-2015 |