Patent application number | Description | Published |
20120331127 | Methods and Apparatus to Monitor Server Loads - Methods and apparatus to monitor server loads are disclosed. An example load monitor includes a first virtual machine to replicate a first server; a router interface to cause a router to redirect a portion of requests destined for the first server to the first virtual machine, the first virtual machine to serve the redirected requests; a collector to collect first metric data from the first virtual machine related to processing of the redirected requests; and an overload indicator to indicate an overload condition at the first server based on the first metric data collected from the first virtual machine. | 12-27-2012 |
20130007232 | METHODS AND APPARATUS TO IMPROVE SECURITY OF A VIRTUAL PRIVATE MOBILE NETWORK - Methods and apparatus are disclosed to improve security of a virtual private mobile network. An example method includes identifying a request to initialize the virtual private mobile network, identifying a number of subgroups to associate with the virtual private mobile network, generating a virtualized slice count value based on the number of subgroups, and initializing network elements with a number of virtualized slices based on the virtualized slice count value. | 01-03-2013 |
20160043998 | METHODS AND APPARATUS TO IMPROVE SECURITY OF A VIRTUAL PRIVATE MOBILE NETWORK - Methods and apparatus are disclosed to prevent consecutive attacks on a virtual private mobile network. An example method includes for each of a plurality of network elements, generating virtualized slices based on a virtualized slice count value for subgroups associated with the virtual private mobile network, and assigning non-consecutive ones of the virtualized slices to the subgroups associated with the virtual private mobile network based on demand for the virtualized slices by the respective ones of the subgroups. The example method also includes, in response to a request from a mobile device to access the virtual private mobile network for a first time, assigning the mobile device to one of the virtual slices of the plurality of network elements based on (i) the subgroup associated with the mobile device, and (ii) availability of the virtual slices. | 02-11-2016 |
Patent application number | Description | Published |
20140291735 | DOUBLE PATTERNING VIA TRIANGULAR SHAPED SIDEWALL SPACERS - An intermediate semiconductor structure in fabrication includes a silicon semiconductor substrate, a hard mask of silicon nitride (SiN) over the substrate and a sacrificial layer of polysilicon or amorphous silicon over the hard mask. The sacrificial layer is patterned into sidewall spacers for mandrels of a filler material substantially different in composition from the sidewall spacers, such as a flowable oxide. The mandrels are removed such that the sidewall spacers have vertically tapered inner and outer sidewalls providing a rough triangular shape. The rough triangular sidewall spacers are used as a hard mask to pattern the SiN hard mask below. | 10-02-2014 |
20140353795 | INTEGRATED CIRCUITS INCLUDING FINFET DEVICES WITH SHALLOW TRENCH ISOLATION THAT INCLUDES A THERMAL OXIDE LAYER AND METHODS FOR MAKING THE SAME - Integrated circuits and methods for fabricating integrated circuits are provided. In one example, a method for fabricating an integrated circuit includes etching an enhanced high-aspect-ratio process (eHARP) oxide fill that is disposed in an STI trench between two adjacent fins to form a recessed eHARP oxide fill. The two adjacent fins extend from a bulk semiconductor substrate. A silicon layer is formed overlying the recessed eHARP oxide fill. The silicon layer is converted to a thermal oxide layer to further fill the STI trench with oxide material. | 12-04-2014 |
20150028447 | METHODS OF FORMING AN E-FUSE FOR AN INTEGRATED CIRCUIT PRODUCT AND THE RESULTING E-FUSE STRUCTURE - An e-fuse device disclosed herein includes an anode and a cathode that are conductively coupled to the doped region formed in a substrate, wherein the anode includes a first metal silicide region positioned on the doped region and a first conductive metal-containing contact that is positioned above and coupled to the first metal silicide region, and the cathode includes a second metal silicide region positioned on the doped region and a second conductive metal-containing contact that is positioned above and conductively coupled to the second metal silicide region. A method disclosed herein includes forming a doped region in a substrate for an e-fuse device and performing at least one common process operation to form a first conductive structure on the doped region of the e-fuse device and a second conductive structure on a source/drain region of a transistor. | 01-29-2015 |
20150340319 | E-FUSE STRUCTURE FOR AN INTEGRATED CIRCUIT PRODUCT - An e-fuse device disclosed herein includes an anode and a cathode that are conductively coupled to the doped region formed in a substrate, wherein the anode includes a first metal silicide region positioned on the doped region and a first conductive metal-containing contact that is positioned above and coupled to the first metal silicide region, and the cathode includes a second metal silicide region positioned on the doped region and a second conductive metal-containing contact that is positioned above and conductively coupled to the second metal silicide region. A method disclosed herein includes forming a doped region in a substrate for an e-fuse device and performing at least one common process operation to form a first conductive structure on the doped region of the e-fuse device and a second conductive structure on a source/drain region of a transistor. | 11-26-2015 |
Patent application number | Description | Published |
20150076653 | OVERLAY PERFORMANCE FOR A FIN FIELD EFFECT TRANSISTOR DEVICE - Approaches for improving overlay performance for an integrated circuit (IC) device are provided. Specifically, the IC device (e.g., a fin field effect transistor (FinFET)) is provided with an oxide layer and a pad layer formed over a substrate, wherein the oxide layer comprises an alignment and overlay mark, an oxide deposited in a set of openings formed through the pad layer and into the substrate, a mandrel layer deposited over the oxide material and the pad layer, and a set of fins patterned in the IC device without etching the alignment and overlay mark. With this approach, the alignment and overlay mark is provided with the fin cut (FC) layer and, therefore, avoids finification. | 03-19-2015 |
20150093877 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE BY STOPPING PLANARIZATION OF INSULATING MATERIAL ON FINS - A method for fabricating a semiconductor device is provided, including forming a mask on a surface of a semiconductor substrate, creating isolation trenches within the substrate, and removing the mask from the substrate before depositing an insulating material within the trenches. The insulating material is then planarized to form a surface that is substantially coplanar with the surface of the semiconductor substrate. | 04-02-2015 |
20150093878 | FINFET FABRICATION METHOD - Embodiments of the present invention provide an improved method for fabrication of fin field effect transistors (finFETs). Sacrificial regions are formed on a semiconductor substrate. Spacers are formed adjacent to two sides of the sacrificial regions. Fins are formed based on the spacers. One set of spacers is treated as dummy spacers, and is removed prior to fin formation, leaving the other set of spacers to be used for forming fins on the final semiconductor structure. All the fins on the final semiconductor structure are formed from spacers on one side of the sacrificial material. This reduces variation in width of the fins. | 04-02-2015 |
20150123211 | NARROW DIFFUSION BREAK FOR A FIN FIELD EFFECT (FinFET) TRANSISTOR DEVICE - Approaches for providing a narrow diffusion break in a fin field effect transistor (FinFET) device are disclosed. Specifically, the FinFET device is provided with a set of fins formed from a substrate, and an opening formed through the set of fins, the opening oriented substantially perpendicular to an orientation of the set of fins. This provides a FinFET device capable of achieving cross-the-fins insulation with an opening size that is adjustable from approximately 20-30 nm. | 05-07-2015 |
20150270159 | FABRICATION OF SEMICONDUCTOR STRUCTURES USING OXIDIZED POLYCRYSTALLINE SILICON AS CONFORMAL STOP LAYERS - Semiconductor structure fabrication methods are provided which include: forming one or more trenches and a plurality of plateaus within a substrate structure; providing a conformal stop layer over the substrate structure, including over the plurality of plateaus, the conformal stop layer being or including oxidized polycrystalline silicon; depositing a material over the substrate structure to fill the one or more trenches and cover the plurality of plateaus thereof; and planarizing the material using a slurry to form coplanar surfaces of the material and the conformal stop layer, wherein the slurry reacts with the oxidized polycrystalline silicon of the conformal stop layer to facilitate providing the coplanar surfaces with minimal dishing of the material. Various embodiments are provided, including different methods of providing the conformal stop layer, such as by oxidizing at least an upper portion of polycrystalline silicon, or by performing an in-situ steam growth process. | 09-24-2015 |
20150333062 | FINFET FABRICATION METHOD - Embodiments of the present invention provide an improved method for fabrication of fin field effect transistors (finFETs). Sacrificial regions are formed on a semiconductor substrate. Spacers are formed adjacent to two sides of the sacrificial regions. Fins are formed based on the spacers. One set of spacers is treated as dummy spacers, and is removed prior to fin formation, leaving the other set of spacers to be used for forming fins on the final semiconductor structure. All the fins on the final semiconductor structure are formed from spacers on one side of the sacrificial material. This reduces variation in width of the fins. | 11-19-2015 |
20150380316 | UNIFORM EXPOSED RAISED STRUCTURES FOR NON-PLANAR SEMICONDUCTOR DEVICES - The use of two different materials for shallow trench isolation and deep structural trenches with a dielectric material therein (e.g., flowable oxide and a HARP oxide, respectively) causes non-uniform heights of exposed portions of raised semiconductor structures for non-planar semiconductor devices, due to the different etch rates of the materials. Non-uniform openings adjacent the exposed portions of the raised structures from recessing the isolation and dielectric materials are filled with additional dielectric material to create a uniform top layer of one material (the dielectric material), which can then be uniformly recessed to expose uniform portions of the raised structures. | 12-31-2015 |
20160049468 | PRODUCT COMPRISED OF FINFET DEVICES WITH SINGLE DIFFUSION BREAK ISOLATION STRUCTURES - An integrated circuit product is disclosed that includes a plurality of trenches in a semiconducting substrate that define first, second and third fins, wherein the fins are side-by-side, and wherein the second fin is positioned between the first and third fins, a layer of insulating material in the plurality of trenches such that a desired height of the first, second and third fins is positioned above an upper surface of the layer of insulating material, a recess defined in the second fin that at least partially defines a cavity in the layer of insulating material, an SDB isolation structure in the cavity on the recessed portion of the second fin, wherein the SDB isolation structure has an upper surface that is above the upper surface of the layer of insulating material, and a gate structure for a transistor positioned above the SDB isolation structure. | 02-18-2016 |
20160111320 | T-SHAPED FIN ISOLATION REGION AND METHODS OF FABRICATION - Semiconductor devices and fabrication methods are provided having an isolation feature within a fin structure which, for instance, facilitates isolating circuit elements supported by the fin structure. The fabrication method includes, for instance, providing an isolation material disposed, in part, within the fin structure, the isolation material being formed to include a T-shaped isolation region and a first portion extending into the fin structure, and a second portion disposed over the first portion and extending above the fin structure. | 04-21-2016 |
Patent application number | Description | Published |
20090053241 | PDGFRbeta-specific inhibitors - The invention is directed to novel PDGFRβ-specific antagonists. The antagonists include antibodies, which can be bispecific. The antibodies are used to reduce or inhibit tumor growth and or to treat an angiogenic disease. The invention also includes combinations of PDGFRβ-specific antagonists with VEGFR antagonists for such treatments. The antagonists can further be administered in combination with other anti-angiogenic or anti-neoplastic drugs. | 02-26-2009 |
20100221267 | PDGFR BETA-SPECIFIC INHIBITORS - The invention is directed to novel PDGFRβ-specific antagonists. The antagonists include antibodies, which can be bispecific. The antibodies are used to reduce or inhibit tumor growth and or to treat an angiogenic disease. The invention also includes combinations of PDGFRβ-specific antagonists with VEGFR antagonists for such treatments. The antagonists can further be administered in combination with other anti-angiogenic or anti-neoplastic drugs. | 09-02-2010 |
20120121609 | FIBROBLAST GROWTH FACTOR RECEPTOR-1 INHIBITORS AND METHODS OF TREATMENT THEREOF - The present invention is directed to an antibody or fragments thereof that are specific for a fibroblast growth factor receptor (EGFR)-1(IIIb), EGFR-1(IIIc), and/or EGFR-4. Also, provided herein, are vectors and host cells comprising the nucleic acids encoding those antibodies. The present invention further provides methods of antagonizing EGFR-1 or EGFR-4 as a treatment for obesity, diabetes, or a condition related thereto, and methods of reducing food intake. | 05-17-2012 |
Patent application number | Description | Published |
20100074132 | Systems for Providing Feedback to Sending Entities - Systems for providing feedback to sending entities are provided. In some embodiments, systems for providing feedback to at least one sending entity that sends requests are provided, the systems comprising: a receiving entity comprising at least one processor that: determines a number of active sources associated with each of the at least one sending entity; determines a number of sessions that each of the at least one sending entity is able to accept based on the number of active sources determined; and provides an indication of the number of sessions to each corresponding one of the at least one sending entity. | 03-25-2010 |
20120008495 | Methods And Systems For Controlling SIP Overload - Techniques for controlling Session Initiation Protocol (SIP) overload between a sending entity and a receiving entity includes receiving a message at a send buffer at the sending entity and forwarding the message to a receive buffer at the receiving entity if the send buffer is empty of other messages or rejecting the message if the send buffer is not empty of other messages. | 01-12-2012 |
20130145425 | VERIFICATION SERVICE - Concepts and technologies are disclosed herein for verifying sender information. According to various embodiments of the concepts and technologies disclosed herein, a verification service can determine, receive a request, or receive a call to verify sender information associated with data. The server computer generates and delivers a verification message to a sender device in response to determining that sender information verification is to be provided. The server computer receives a response indicating if the data was sent by the sender device. If the response indicates that the sender device did not send the data, the server computer can block delivery of the data, generate alarms or alerts, take other actions, and/or take no action. If the response indicates that the sender device sent the data, the server computer can deliver the data, provide a verification response to the recipient device, take no action, and/or take other actions. | 06-06-2013 |
20130145465 | MULTILAYERED DECEPTION FOR INTRUSION DETECTION AND PREVENTION - Concepts and technologies are disclosed herein for multilayered deception for intrusion detection. According to various embodiments of the concepts and technologies disclosed herein, a multilayer deception system includes honey servers, honey files and folders, honey databases, and/or honey computers. A multilayer deception system controller generates honey activity between the honey entities and exposes a honey profile with contact information associated with a honey user. Contact directed at the honey user and/or activity at any of the honey entities can trigger alarms and/or indicate an attack, and can be analyzed to prevent future attacks. | 06-06-2013 |
20140006374 | METHOD AND APPARATUS FOR DERIVING AND USING TRUSTFUL APPLICATION METADATA | 01-02-2014 |
20140006375 | METHOD AND APPARATUS FOR ROBUST MOBILE APPLICATION FINGERPRINTING | 01-02-2014 |
20140006418 | METHOD AND APPARATUS FOR RANKING APPS IN THE WIDE-OPEN INTERNET | 01-02-2014 |
20140006440 | METHOD AND APPARATUS FOR SEARCHING FOR SOFTWARE APPLICATIONS | 01-02-2014 |
20140223023 | SYSTEMS FOR PROVIDING FEEDBACK TO SENDING ENTITIES - Systems for providing feedback to sending entities are provided. In some embodiments, systems for providing feedback to a sending entity that sends a request for session are provided, the systems comprising: a receiving entity that receives the request for session from the sending entity, wherein the request for session is used to establish a communication session that takes place after processing the request for session, and wherein the receiving entity comprises at least one hardware processor that: assigns a freed processing slot to the sending entity in response to determining that the request for session has been processed by the receiving entity and that a number of requests for sessions to be processed is less than a first limit. | 08-07-2014 |
20140259112 | Verificaiton Service - Concepts and technologies are disclosed herein for verifying sender information. According to various embodiments of the concepts and technologies disclosed herein, a verification service can determine, receive a request, or receive a call to verify sender information associated with data. The server computer generates and delivers a verification message to a sender device in response to determining that sender information verification is to be provided. The server computer receives a response indicating if the data was sent by the sender device. If the response indicates that the sender device did not send the data, the server computer can block delivery of the data, generate alarms or alerts, take other actions, and/or take no action. If the response indicates that the sender device sent the data, the server computer can deliver the data, provide a verification response to the recipient device, take no action, and/or take other actions. | 09-11-2014 |
20140259172 | Multilayered Deception for Intrusion Detection and Prevention - Concepts and technologies are disclosed herein for multilayered deception for intrusion detection. According to various embodiments of the concepts and technologies disclosed herein, a multilayer deception system includes honey servers, honey files and folders, honey databases, and/or honey computers. A multilayer deception system controller generates honey activity between the honey entities and exposes a honey profile with contact information associated with a honey user. Contact directed at the honey user and/or activity at any of the honey entities can trigger alarms and/or indicate an attack, and can be analyzed to prevent future attacks. | 09-11-2014 |
Patent application number | Description | Published |
20080251442 | Fluid Treatment Assemblies and Elements and Methods for Making Them - Fluid treatment assemblies and elements may include a plurality of axially extending pleats and may be used to treat fluids, including gases, liquids, or mixtures of gases, and/or solids, in a crossflow mode of operation. For example, some fluid treatment assemblies and elements may be used to remove one or more substances from the fluid and may then function as separators, including filters and concentrators. Other fluid treatment assemblies and elements may be used to transfer substances between two fluid streams and may then function as mass transfer devices. | 10-16-2008 |
20100018924 | FLUID TREATMENT ARRANGEMENTS AND METHODS - Fluid treatment arrangements and methods involve a plurality of fluid treatment modules and a core assembly that extends through the plurality of fluid treatment modules. Each fluid treatment module has a feed region, a permeate region, and a fluid treatment medium separating the feed region from the permeate region. The feed region extends along a feed surface of the fluid treatment medium, and the permeate region extends along a permeate surface of the fluid treatment region. Feed fluid is directed along the feed region of each module, and a portion of the feed fluid passes as permeate through the fluid treatment medium, into the permeate region, and then into the core assembly. One or more control mechanisms are fluidly coupled to the permeate region of one or more fluid treatment modules to control a flow parameter in the permeate region of the module. | 01-28-2010 |
Patent application number | Description | Published |
20120025638 | APPARATUS FOR COOLING AN ELECTRIC MACHINE - Provided is an apparatus, for example, for use with a rotating electric machine, that includes a housing. The housing can include a housing main portion and a housing end portion. The housing main portion can be configured to be disposed proximal to a body portion of a stator section of an electric machine. The housing main portion can define a main fluid channel that is configured to conduct fluid therethrough. The housing end portion can receive fluid from said main fluid channel and direct fluid into contact with a winding end portion of a conductive winding of the stator section. | 02-02-2012 |
20120327603 | COOLING DEVICE FOR A POWER MODULE, AND A RELATED METHOD THEREOF - A cooling device for a power module having an electronic module disposed on a base plate via a substrate is disclosed. The cooling device includes a heat sink plate having at least one cooling segment. The cooling segment includes an inlet plenum for entry of a cooling medium, a plurality of inlet manifold channels, a plurality of outlet manifold channels, and an outlet plenum. The plurality of inlet manifold channels are coupled orthogonally to the inlet plenum for receiving the cooling medium from the inlet plenum. The plurality of outlet manifold channels are disposed parallel to the inlet manifold channels. The outlet plenum is coupled orthogonally to the plurality of outlet manifold channels for exhaust of the cooling medium. A plurality of millichannels are disposed in the base plate orthogonally to the inlet and the outlet manifold channels. The plurality of milli channels direct the cooling medium from the plurality of inlet manifold channels to the plurality of outlet manifold channels. | 12-27-2012 |
20130002064 | ELECTRICAL MACHINE - An apparatus, such as an electrical machine, is provided. The apparatus can include a rotor defining a rotor bore and a conduit disposed in and extending axially along the rotor bore. The conduit can have an annular conduit body defining a plurality of orifices disposed axially along the conduit and extending through the conduit body. The rotor can have an inner wall that at least partially defines the rotor bore. The orifices can extend through the conduit body along respective orifice directions, and the rotor and conduit can be configured to provide a line of sight along the orifice direction from the respective orifices to the inner wall. | 01-03-2013 |
20140001893 | ELECTRIC MACHINE AND SYSTEMS COMPRISING THE SAME | 01-02-2014 |
Patent application number | Description | Published |
20090034614 | FEEDBACK ASSISTED TRANSMISSION OF MULTIPLE DESCRIPTION, FORWARD ERROR CORRECTION CODED, STREAMS IN A PEER-TO-PEER VIDEO SYSTEM - MD-FEC is considered an efficient way to generate a large number of descriptions. However, typically, MD-FEC introduces significant redundancy across streams. MD-FEC encoded streams (descriptions) are adapted based on feedback. Specifically, the bits sent in each description by a supplying peer are adapted based on the number of available descriptions in its receiving peer. The adaptive delivery eliminates unnecessary bits in the original MD-FEC streams (descriptions), and significantly reduces the consumed uplink bandwidth at supplying peers. The saved bandwidth can be used to accommodate more video sessions or for other applications. | 02-05-2009 |
20090037968 | USING LAYERED MULTI-STREAM VIDEO CODING TO PROVIDE INCENTIVES IN P2P LIVE STREAMING - A distributed incentive mechanism is provided for peer-to-peer (P2P) streaming networks, such as mesh-pull P2P live streaming networks. Video (or audio) may be encoded into multiple sub-streams such as layered coding and multiple description coding. The system is heterogeneous with peers having different uplink bandwidths. Peers that upload more data (to a peer) receive more substreams (from that peer) and consequently better video quality. Unlike previous approaches in which each peer receives the same video quality no matter how much bandwidth it contributes to the system, differentiated video quality, commensurate with a peer's contribution to other peers, is provided, thereby discouraging free-riders. | 02-05-2009 |
20110170558 | SCHEDULING, INCLUDING DISTRIBUTED SCHEDULING, FOR A BUFFERED CROSSBAR SWITCH - Scheduling methods and apparatus are provided for buffered crossbar switches with a crosspoint buffer size as small as one and no speedup. An exemplary distributed scheduling process achieves 100% throughput for any admissible Bernoulli arrival traffic. Simulation results also showed that this distributed scheduling process can provide very good delay performance for different traffic patterns. The simulation results also showed that packet delay is very weakly dependent on the switch size, which implies that the exemplary distributed scheduling process can scale with the number of switch ports. | 07-14-2011 |
20120128007 | DISTRIBUTED SCHEDULING FOR VARIABLE-SIZE PACKET SWITCHING SYSTEM - Scheduling methods and apparatus are provided for an input-queued switch. The exemplary distributed scheduling process achieves 100% throughput for any admissible Bernoulli arrival traffic. The exemplary distributed scheduling process includes scheduling variable size packets. The exemplary distributed scheduling process may be easily implemented with a low-rate control or by sacrificing the throughput by a small amount. Simulation results also showed that this distributed scheduling process can provide very good delay performance for different traffic patterns. The exemplary distributed scheduling process may therefore be a good candidate large-scale high-speed switching systems. | 05-24-2012 |
20120128354 | DISTRIBUTED SCHEDULING FOR AN OPTICAL SWITCH - Scheduling methods and apparatus for use with optical switches with hybrid architectures are provided. An exemplary distributed scheduling process achieves 100% throughput for any admissible Bernoulli arrival traffic. The exemplary distributed scheduling process may be easily adapted to work for any finite round trip time, without sacrificing any throughput. Simulation results also showed that this distributed scheduling process can provide very good delay performance for different traffic patterns and for different round trip times associated with current switches. | 05-24-2012 |
Patent application number | Description | Published |
20140151760 | DOPED FLOWABLE PRE-METAL DIELECTRIC - A method of filling gaps between gates with doped flowable pre-metal dielectric (PMD) and the resulting device are disclosed. Embodiments include forming at least two dummy gates on a substrate, each dummy gate being surrounded by spacers; filling a gap between adjacent spacers of the at least two dummy gates with a flowable PMD; implanting a dopant in the flowable PMD; and annealing the flowable PMD. Doping the flowable PMD prevents erosion of the PMD, thereby providing a voidless gap-fill. | 06-05-2014 |
20150024585 | SYSTEMS AND METHODS FOR FABRICATING GATE STRUCTURES FOR SEMICONDUCTOR DEVICES - A method includes forming a gate structure by growing an interfacial layer on a substrate, depositing a High K layer on the interfacial layer, depositing a TiN Cap on the High K layer and forming a thin barrier layer on the TiN Cap. The gate structure is annealed. | 01-22-2015 |
20150255277 | CONFORMAL NITRIDATION OF ONE OR MORE FIN-TYPE TRANSISTOR LAYERS - Fin-type transistor fabrication methods and structures are provided having one or more nitrided conformal layers, to improve reliability of the semiconductor device. The method includes, for example, providing at least one material layer disposed, in part, conformally over a fin extending above a substrate, the material layer(s) including a gate dielectric layer; and performing a conformal nitridation process over an exposed surface of the material layer(s), the conformal nitridation process forming an exposed, conformal nitrided surface. | 09-10-2015 |
20160049488 | SEMICONDUCTOR GATE WITH WIDE TOP OR BOTTOM - A semiconductor structure with wide-bottom and/or wide-top gates includes a semiconductor substrate, a source region(s), a drain region(s) associated with the source region(s), and a gate(s) associated with the source region(s) and the drain region(s) having a top portion and a bottom portion. One of the top portion and the bottom portion of the gate(s) is wider than the other of the top portion and bottom portion. The wide-bottom gate is created using a dummy wide-bottom gate etched from a layer of dummy gate material, creating spacers for the dummy gate, removing the dummy gate material and filling the opening created with conductive material. For the wide-top gate, first and second spacers are included, and instead of removing all the dummy gate material, only a portion is removed, exposing the first spacers. The exposed portion of the first spacers may either be completely or partially removed (e.g., tapered), in order to increase the area of the top portion of the gate to be filled. | 02-18-2016 |
Patent application number | Description | Published |
20090291286 | Laminate manufacturing system, method, and article of manufacture - A laminate manufacturing system, method, and article of manufacture, the article of manufacture having a core of fresh or green wood and/or recycled wood products, processed down to a particle size of less than 5 mm, and preferably less than 3 mm, and bonded together with glue, opposing surface inner veneer bonded to opposing surfaces of the core with glue, opposing surface outer veneer bonded to opposing surface inner veneer with glue, opposing edge veneer bonded to opposing edges of the core with glue. Each of the veneers is preferably 0.5 mm thick, although suitable veneer thicknesses may range from 0.3 to 0.5 mm. The article of manufacture thus produced is a laminated wood product having a particle to glue ratios that provides a durable, lightweight, strong attractive product that gives the appearance of wood. | 11-26-2009 |
20100269443 | Tongue-in-groove floor and wall panels using multiple bonded sheet construction - Interlocking tongue and groove floor and wall panels use multiple bonded sheet construction, preferably three sheets, of material, such as plywood, bonded together Other rigid durable sheet materials may be used. The shape is preferably either square or rectangular. By offsetting the middle sheet layer so that two adjacent sides extend beyond the top and bottom layers which are in registration, a tongue is developed on two adjacent sides while the opposite sides will have grooves. Thus such panels can be used to cover a large floor or wall area using normal tongue-in-groove techniques by fitting the protruding tongues into the grooves of adjacent panels In an alternate embodiment, the middle sheet is smaller in size than the top and bottom sheets which are in registration. The middle sheet is centered within the top and bottom sheets thus forming grooves on all four edges. | 10-28-2010 |
20100301657 | Knockdown chair having reinforced side supports - An improved knockdown chair having opposing substantially C shaped support arms, substantially L shaped tubular seating arrangement, sock type seating portion cover, front reinforcing member, and bottom reinforcing member, wherein each of the opposing substantially C shaped support arms are of laminate construction and have an upper arcuate arm support, front arcuate portion, and substantially straight bottom, the substantially L shaped tubular seating arrangement having a tubular seat back and tubular sitting portion telescopically interconnected one to the other, and wherein each of the opposing substantially C shaped support arms is opposingly removably fastened to the substantially L shaped tubular seating arrangement, the improvement comprising combination with each of the opposing substantially C shaped support arms of a substantially S shaped reinforcing member of laminate construction removably fastened to the upper arcuate arm support and the substantially straight bottom for reinforcing each of the opposing substantially C shaped support arms. | 12-02-2010 |
20110220522 | Compact children's table and stool set - A table and stool seating arrangement includes a tabletop having an underside and an edge. A pedestal supports the tabletop. The pedestal includes an X-shaped base with a plurality of upwardly extending slotted pedestal sheets. Each sheet has a slot accommodating a respective slot in another sheet by sliding the slots together. One or more seat assemblies, such as stools, are horizontally movable between a use position on the ground and at least a portion of each seat is movable beyond the edge of the tabletop. In a storage position, the entire seat assembly is positioned with a predetermined area below the underside of the tabletop. Each seat assembly includes a seat support frame having two flat vertical walls joined by one arcuate wall, enclosing a hollow storage chamber therebetween; wherein the vertical walls are constructed to rest adjacent to the table pedestal in a storage position of non-use. | 09-15-2011 |
20110221240 | Compact children's table and stool set - A table and seating arrangement includes a tabletop having an underside and an edge. A pedestal supports the tabletop. The pedestal includes an X-shaped base with a plurality of upwardly extending slotted pedestal sheets. Each sheet has a slot accommodating a respective slot in another sheet by sliding the slots together. One or more seat assemblies, such as stools, are horizontally movable between a use position on the ground and at least a portion of each seat is movable beyond the edge of the tabletop. In a storage position, the entire seat assembly is positioned with a predetermined area below the underside of the tabletop. Each seat assembly includes a seat support frame having two flat vertical walls joined by one arcuate wall, enclosing a hollow storage chamber therebetween; wherein the vertical walls are constructed to rest adjacent to the table pedestal in a storage position of non-use. | 09-15-2011 |
20120079707 | Tongue-in-groove floor and wall - A method of making a set of interlocking floor or wall panels includes providing a single solid layer with a veneer layer on top. The fabrication method involves the use of edge routing using a tongue cutter on one edge and a groove cutter on the opposite edge to form the edge shapes equivalent to those of the previous embodiment. If two routing heads are spaced apart the appropriate distance for a particular sized panel, a single pass can form a tongue on one edge and a groove on the opposite edge simultaneously. One cutter is spun clockwise while the second is spun counterclockwise to equalize the forces on the panel. Thus two passes are needed to form the edges of a panel. The veneer layer, which may be bamboo, birch, or other woods such as cherry wood, is adhesively bonded to the top surface. | 04-05-2012 |