Patent application number | Description | Published |
20090284837 | Method and apparatus providing uniform separation of lens wafer and structure bonded thereto - Methods and apparatus providing a master wafer having standoffs to control a bondline thickness between one wafer produced indirectly from the master wafer and another wafer bonded to the produced wafer. Standoffs may be formed as a single standoff, standoff walls, or as a number of discrete standoffs. The standoffs provide a balanced support base and a uniform spacing between the one wafer and another wafer bonded thereto. | 11-19-2009 |
20090323206 | IMAGING MODULE WITH SYMMETRICAL LENS SYSTEM AND METHOD OF MANUFACTURE - An imaging module and method of fabrication. The method comprises forming a first lens wafer with a plurality of outer negative lenses and forming a second lens wafer with a plurality of inner negative lenses The method further comprises bonding the first lens wafer and second lens wafer to create a bonded stack; forming a plurality of inner positive lenses on the second lens wafer and bonding a spacer wafer to the second lens wafer; and forming a plurality of outer positive lenses on the first lens wafer. | 12-31-2009 |
20090325107 | Thermal embossing of resist reflowed lenses to make aspheric lens master wafer - Methods of forming a lens master wafer having aspheric lens shapes. In one embodiment, a substrate is coated with a polymer material. Isolated sections are formed in the polymer material. The isolated sections are reflowed. The reflowed sections are formed into aspheric lens shapes using a lens stamp. | 12-31-2009 |
20100123209 | Apparatus and Method of Manufacture for Movable Lens on Transparent Substrate - A lens stack having a movable lens attached to a MEMS structure and method of fabricating the same. The method comprises attaching at least one MEMS structure to a transparent substrate. The method further comprises forming a movable lens in contact with the at least one MEMS structure. | 05-20-2010 |
20100123260 | STAMP WITH MASK PATTERN FOR DISCRETE LENS REPLICATION - A method and stamp for forming lenses on a wafer. The stamp includes a mask arranged on a substrate and aligned with a plurality of lens-shaped cavities. The lens-shaped cavities are used to imprint a plurality of lenses into a curable material. The lenses are cured through the mask using radiation. The lenses are separated from the stamp and the uncured material is removed. | 05-20-2010 |
20100177408 | METHOD OF FORMING LENS ARRAYS AND TRANSFERRING SUCH ONTO MOVABLE-MEMS STRUCTURES - Micro-electrical-mechanical (MEMS) wafers in which a lens is formed on a micro-electrical-mechanical structure. The micro-electrical-mechanical wafers can comprise a substrate, MEMS structures, and a lens array. A method of forming a micro-electrical-mechanical wafer comprises providing a substrate, forming a micro-electrical-mechanical structure on the substrate, forming a carrier, forming a lens array on the carrier, and transferring the lens array from the carrier onto the micro-electrical-mechanical structure. The lens array is placed above the micro-electrical-mechanical structure. | 07-15-2010 |