Patent application number | Description | Published |
20090085204 | Wafer-level package and method of manufacturing the same - Provided is a wafer-level package including a wafer-level semiconductor chip having a plurality of integrated circuits (ICs) and pads formed on the top surface thereof; a molding material of which the outer portion is supported by the top surface of the semiconductor chip such that a cavity is provided on the semiconductor chip; and a conducive member filled in a plurality of vias which are formed in arbitrary positions of the molding material so as to pass through the molding material, the conductive member being connected to the pads. | 04-02-2009 |
20090087951 | Method of manufacturing wafer level package - A method of manufacturing a wafer level package is disclosed. The method may include stacking an insulation layer over a wafer substrate; processing a via hole in the insulation layer; forming a seed layer over the insulation layer; forming a plating resist, which is in a corresponding relationship with a redistribution pattern, over the seed layer; forming the redistribution pattern, which includes a terminal for external contact, by electroplating; and coupling a conductive ball to the terminal. As multiple redistribution layers can be formed using inexpensive PCB processes, the manufacturing costs can be reduced, and the stability and efficiency of the process can be increased. | 04-02-2009 |
20090253259 | Solder ball attachment jig and method for manufacturing semiconductor device using the same - Disclosed are a solder attachment jig and a method of manufacturing a semiconductor device using the same. The solder ball attachment jig, which arranges a solder ball to be aligned with a conductive post of a semiconductor wafer, can include a body and a receiving hole, which is formed on the body to hold the solder ball. Internal walls of the receiving hole that face each other are symmetrically inclined. Using the solder ball attachment jig in accordance with an embodiment of the present invention, the alignment of the solder ball can be improved while reducing the cost and simplifying the processes. | 10-08-2009 |
20100117218 | Stacked wafer level package and method of manufacturing the same - The present invention relates to a stacked wafer level package and a method of manufacturing the same. The stacked wafer level package in accordance with the present invention can improve a misalignment problem generated in a stacking process by performing a semiconductor chip mounting process, a rearrangement wiring layer forming process, the stacking process and so on after previously bonding internal connection means for interconnection between stacked electronic components to a conductive layer for forming a rearrangement wiring layer, thereby improving reliability and yield and reducing manufacturing cost. | 05-13-2010 |
20100144152 | Method of manufacturing semiconductor package - The present invention relates to a method of manufacturing a semiconductor package capable of simplifying a process and remarkably reducing a production cost by including the steps of: preparing a different bonded panel including at least one metal layer; forming a pad unit electrically connected to the metal layer; mounting a semiconductor chip over the different bonded panel to be electrically connected to the pad unit; sealing the semiconductor chip; forming a rearrangement wiring layer by etching the metal layer; and forming an external connection unit electrically connected to the rearrangement wiring layer. | 06-10-2010 |
20100149770 | Semiconductor stack package - The present invention relates to a semiconductor stack package including: a printed circuit board; a first semiconductor chip mounted on the printed circuit board; a second semiconductor chip mounted on the printed circuit board in parallel with the first semiconductor chip; a first rearrangement wiring layer positioned on the first semiconductor chip; a second rearrangement wiring layer which constitutes one circuit together with the first rearrangement wiring layer and is positioned on the second semiconductor chip; and a third semiconductor chip which is electrically connected to the first and second rearrangement wiring layers and of which both ends are separately positioned on the first and second semiconductor chips. | 06-17-2010 |
20120073861 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A printed circuit board and a manufacturing method of the printed circuit board are disclosed. The printed circuit board includes: a first insulation layer having a first pattern formed thereon; a first trench caved in one surface of the first insulation layer along at least a portion of the first pattern; and a second insulation layer stacked on one surface of the first insulation layer so as to cover the first pattern. The first trench is filled by the second insulation layer. | 03-29-2012 |
20140345916 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board according to a preferred embodiment of the present invention includes a base substrate; a through via formed to penetrate through the base substrate; and circuit patterns formed on one side and the other side of the base substrate and formed to be thinner than an inner wall of the through via. | 11-27-2014 |
20150028686 | COIL TYPE UNIT FOR WIRELESS POWER TRANSMISSION, WIRELESS POWER TRANSMISSION DEVICE, ELECTRONIC DEVICE AND MANUFACTURING METHOD OF COIL TYPE UNIT FOR WIRELESS POWER TRANSMISSION - The present invention relates to a coil type unit for wireless power transmission, a wireless power transmission device, an electronic device, and a manufacturing method of a coil type unit for wireless power transmission. A coil type unit for wireless power transmission according to the present invention includes a coil pattern in the form of a wiring pattern; a magnetic portion having the coil pattern attached to one surface thereof; and an adhesive portion interposed between the magnetic portion and the coil pattern to bond the magnetic portion and the coil pattern, wherein the magnetic portion is formed by laminating one or more conductive sheets with one or more magnetic sheets and integrally firing the laminated sheets, and the magnetic portion has conductive holes in the position, where both ends of the coil pattern are disposed, to electrically connect the both ends of the coil pattern and the conductive sheet. | 01-29-2015 |
20150061400 | COIL TYPE UNIT FOR WIRELESS POWER TRANSMISSION, WIRELESS POWER TRANSMISSION DEVICE, ELECTRONIC DEVICE AND MANUFACTURING METHOD OF COIL TYPE UNIT FOR WIRELESS POWER TRANSMISSION - The present invention relates to a coil type unit for wireless power transmission, a wireless power transmission device, an electronic device, and a manufacturing method of a coil type unit for wireless power transmission. A coil type unit for wireless power transmission of the present invention includes a coil portion having a coil pattern on a substrate; a magnetic portion having the coil portion attached to one surface thereof and a conductive pattern formed thereon; an adhesive portion interposed between the magnetic portion and the coil portion to mutually bond the magnetic portion and the coil portion; and a conductive hole for electrically connecting the coil pattern and the conductive pattern, wherein the adhesive portion is formed on one surface of the magnetic portion having the conductive pattern thereon while being formed in an area other than the area in which the conductive pattern is formed. | 03-05-2015 |
20150076919 | COIL TYPE UNIT FOR WIRELESS POWER TRANSMISSION, WIRELESS POWER TRANSMISSION DEVICE, ELECTRONIC DEVICE AND MANUFACTURING METHOD OF COIL TYPE UNIT FOR WIRELESS POWER TRANSMISSION - The present invention relates to a coil type unit for wireless power transmission, a wireless power transmission device, an electronic device, and a manufacturing method of a coil type unit for wireless power transmission. | 03-19-2015 |
20150083480 | INTERPOSER BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are an interposer board and a method of manufacturing the same. According to a preferred embodiment of the present invention, the interposer substrate may include: a base substrate; a circuit pattern formed on the base substrate; and a through via formed to penetrate through the base substrate and have a height lower than that of the circuit pattern. | 03-26-2015 |