Patent application number | Description | Published |
20120159161 | AUTHENTICATION APPARATUS AND METHOD FOR NON-REAL-TIME IPTV SYSTEM - An authentication apparatus for a non-real-time IPTV system decrypts a first encrypted value included in a contents request message received from a device using a preset session key, and then verifies the validity of the contents request message. If the verification results of the contents request message are valid, the authentication apparatus encrypts a variation between timestamps of the authentication apparatus and the device using the session key, and then generates a second encrypted value. After verification information by which the device is capable of verifying the authentication apparatus has been generated using the second encrypted value, the authentication apparatus sends verification information, together with contents corresponding to the contents request message, to the device. | 06-21-2012 |
20130232337 | USER TERMINAL AND METHOD FOR PLAYING DIGITAL RIGHTS MANAGEMENT CONTENT - Disclosed herein are a user terminal and method for playing DRM content. The user terminal includes a common security platform. The common security platform includes a DRM application management unit and a security management unit. The DRM application management unit stores and executes a DRM application that requests authentication from a license server and receives a license, including a decryption key for decrypting encrypted DRM content. The DRM application is an application in a downloadable form. The security management unit decrypts the encrypted DRM content, provided by a content providing server, using the decryption key included in the license issued via the DRM application. | 09-05-2013 |
20140091296 | ADHESIVE FILM AND METHOD OF ENCAPSULATING ORGANIC ELECTRONIC DEVICE - Provided are an adhesive film, an encapsulated product of an organic electronic device using the same, and a method of encapsulating an organic electronic device. Particularly, the adhesive film encapsulating the organic electronic device to cover an entire surface of the organic electronic device includes an adhesive layer including a curable resin and a moisture adsorbent. The adhesive layer has a viscosity in a temperature range of 30 to 130° C. of 10 | 04-03-2014 |
20140110699 | ADHESIVE FILM - An adhesive film used to encapsulate an organic electronic diode (OED) is provided. The adhesive film may be useful in effectively preventing penetration of moisture into an encapsulated structure of the organic electronic diode when the organic electronic diode is encapsulated, and effectively performing the encapsulation process under moderate conditions without causing damage to the organic electronic diode during the encapsulation process. | 04-24-2014 |
20140134434 | TOUCH PANEL - Provided is a touch panel. The touch panel includes a base and a pressure-sensitive adhesive layer attached to the base and having a peel strength with respect to a polycarbonate sheet of 1,900 g/25 mm or more. The pressure-sensitive adhesive layer includes an acryl polymer compound containing an acryl polymer and a thiol polymer derived by binding a thiol compound into a chain, or a side chain or terminal end of a chain of the acryl polymer. Accordingly, penetration of oxygen, moisture or other impurities at an interface between the base film and the pressure-sensitive adhesive layer, or at an interface between a conductor thin film and a pressure-sensitive adhesive layer may be effectively inhibited, and degradation in optical properties such as visibility due to bubbles generated at a pressure-sensitive adhesive interface may be prevented. In addition, when the pressure-sensitive adhesive layer is directly attached to the conductor thin film and even exposed to severe conditions such as high temperature or high temperature and high humidity, the change in the resistance of the conductor thin film may be effectively inhibited, and thus the touch panel may be stably driven for a long time. | 05-15-2014 |
20140217621 | ENCAPSULATION FILM - The present application relates to an encapsulating film, an electronic device and a method of manufacturing the same. In the present application, an encapsulating film having excellent moisture blocking property, handleability, workability and durability and a structure including a diode encapsulated with the encapsulating film may be provided. | 08-07-2014 |
20140222359 | APPARATUS AND METHOD FOR MANAGING BATTERY APPLICATION ENVIRONMENT AND USAGE HISTORY - Disclosed is an apparatus and method for managing a battery that may manage a surrounding environment and a usage history of the battery. The battery management apparatus senses a temperature of an environment to which the battery is exposed, and stores a period of time during which the battery is exposed to a high temperature when the sensed temperature corresponds to a preset first or second area. In this instance, the battery management apparatus may determine whether the battery is simply exposed to the high temperature or the battery is charged or discharged while exposed to the high temperature, and store a usage time together. According to the present disclosure, information about a time domain affecting the life or performance of the battery may be calculated in consideration of the temperature environment to which the battery is exposed. | 08-07-2014 |
20140318707 | METHOD FOR MANUFACTURING ELECTORNIC DEVICE - Provided is a method of manufacturing an electronic device. An electronic device having excellent moisture blocking property and durability may be provided by the method. | 10-30-2014 |
20140319999 | ENCAPSULATION FILM - Provided are an encapsulating film, an electronic device and a method of manufacturing the same. An encapsulating film having excellent moisture blocking property, handleability, workability and durability and a structure including a diode encapsulated with the encapsulating film may be provided. | 10-30-2014 |
20140332782 | ADHESIVE FILM - An adhesive film, a method for preparing an adhesive film, and an organic electronic device are provided. According to the adhesive film in exemplary embodiments of the present invention, fluidity of an adhesive can be controlled in the case of applying the adhesive between objects to be subsequently adhered to each other and then thermal-compressing by including an adhesive layer with cured side faces contacting with the outside. The adhesive film is used, for example for assembling a panel and the like, and thereby a defect rate at the time of assembling a panel and the like can be reduced and excellent work characteristics can be provided. In addition, before being applied to a panel or the like, a moisture absorbent included inside an adhesive layer of an adhesive film can be protected from external moisture or the like, thereby being easily stored, and also when it is applied to a product, reliability of life span, and the like can be secured. | 11-13-2014 |
20140377554 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION - Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and an organic electronic device. The exemplary pressure-sensitive adhesive composition may provide an encapsulating layer of the pressure-sensitive adhesive film and the organic electronic device, which exhibits excellent moisture blocking property, transparency, durability and reliability at a high temperature and high humidity, step difference compensating property and adhesive strength. | 12-25-2014 |
20150034940 | ADHESIVE FILM AND PRODUCT FOR ENCAPSULATING ORGANIC ELECTRONIC DEVICE USING SAME - Provided are an adhesive film and an organic electronic device (OED) encapsulation product using the same. As moisture resistance is maintained by preventing traveling of moisture in a matrix resin, moisture or oxygen input to the organic electronic device from an external environment may be effectively prevented, and temporal stability, life span and durability may be enhanced even when a panel of the organic electronic device is formed as a thin film, thereby ensuring long-term reliability. | 02-05-2015 |
20150048356 | ADHESIVE FILM AND SEALING PRODUCT FOR ORGANIC ELECTRONIC DEVICE USING SAME - Provided are an adhesive film, and an organic electronic device (OED) encapsulation product using the same. Dimensional stability, lifespan, and durability may be enhanced even when a panel of an organic electronic device is large-sized and formed as a thin film by controlling dimensional tolerance and edge angular tolerance of the adhesive film, thereby ensuring long-term reliability, and process yields may be enhanced when the adhesive film is applied to an automation process. | 02-19-2015 |
20150060836 | ADHESIVE FILM AND SEALING METHOD FOR ORGANIC ELECTRONIC DEVICE USING SAME - Provided are an adhesive film, an organic electronic device (OED) encapsulation product using the same, and a method of encapsulating the organic electronic device, and more particularly, an adhesive film for encapsulating an organic electronic element including a first adhesive layer having a loss coefficient (tan δ) at 60 to 100° C. of 1 to 5, and a second adhesive layer formed on the first adhesive layer, and a method of encapsulating an organic electronic device using the same. | 03-05-2015 |
20150079726 | METHOD OF MANUFACTURING ORGANIC ELECTRONIC DEVICE - Provided is a method of manufacturing an organic electronic device using a pressure-sensitive adhesive film. The method of manufacturing an organic electronic device including an encapsulation layer having excellent moisture barrier property and adhesiveness may be provided. In addition, according to the manufacturing method, for example, though the encapsulation layer is formed on an entire surface of an organic electronic element, a flexibility phenomenon of the organic electronic device may be minimized, and the organic electronic device may be manufactured without damage to the organic electronic element for a short process time. | 03-19-2015 |