Patent application number | Description | Published |
20110129595 | Deposition source, deposition apparatus having the same, and method of forming thin film - A deposition source includes a first deposition source section, the first deposition source section being configured to store a deposition material, a second deposition source section, the second deposition source section being separate from the first deposition source section and being configured to store the deposition material, the first and second deposition source sections being configured to alternately supply the deposition material while heating or cooling the deposition material, a feed section configured to receive evaporated deposition material from the first and second deposition source sections, and a nozzle section configured to receive the deposition material from the feed section. | 06-02-2011 |
20110139357 | MASK, METHOD OF MANUFACTURING MASK AND APPARATUS FOR MANUFACTURING MASK - A method of efficiently manufacturing a large-sized mask is disclosed. In one embodiment, the method includes: 1) providing a first mask member comprising i) a first pattern unit having a plurality of slits, ii) a first buffer unit spaced apart from the first pattern unit, and iii) a first bonding unit interconnecting the first pattern unit and the first buffer unit and 2) providing a second mask member comprising i) a second pattern unit having a plurality of slits, ii) a second buffer unit spaced apart from the second pattern unit, and iii) a second bonding unit interconnecting the second pattern unit and the second buffer unit. The method may further include contacting the first bonding unit and the second bonding unit; and connecting the first mask member to the second mask member while tensile forces are applied to the first mask member and the second mask member. | 06-16-2011 |
20110139365 | MASK FOR EVAPORATION, AND METHOD AND APPARATUS FOR MANUFACTURING THE SAME - Provided is a mask for an evaporation apparatus, which includes a first division mask and a second division mask. The first and second division masks are directly bonded to each other by welding, thereby forming welding portion between the first and the second division masks. A method and apparatus for manufacturing a mask for evaporation are also provided. The division masks according to the embodiment do not use subframes, and are directly bonded to one another by welding, so that a shadow effect does not occur. The apparatus for manufacturing a mask for evaporation includes a work stage, a clamp fixing a first division mask and a second division mask to the work stage, and a laser welding part welding the first division mask to the second division mask. The apparatus may further include a first roller leading the laser welding part and a second roller following the laser welding part. | 06-16-2011 |
20110146575 | EVAPORATION SOURCE AND DEPOSITION APPARATUS HAVING THE SAME - An evaporation source is disclosed. In one embodiment, the evaporation source includes: i) a crucible being open on one side thereof and configured to store a deposition material and ii) a nozzle section located on the open side of the crucible and comprising a plurality of nozzles, wherein each of the nozzles has a sidewall configured to spray the deposition material therethrough, wherein the side wall has an inclined portion. The evaporation source also includes i) a heater configured to heat the crucible and ii) a housing configured to accommodate the crucible, the nozzle section, and the heater, wherein the nozzle section has a maximum spray angle less than about 60°. | 06-23-2011 |
20110168553 | SPUTTERING SYSTEM - A sputtering system is disclosed. The sputtering system includes: a first sputter unit including: a first deposition material plate, a second deposition material plate, where the first and second deposition material plates face each other, and a first magnetic field generator disposed behind each of the first deposition material plate and the second deposition material plate, configured to generate a magnetic field, a second sputter unit including: a third deposition material plate, disposed next to the first deposition material plate, a fourth deposition material plate, disposed next to the second deposition plate, where the third and fourth deposition material plates face each other, and a second magnetic field generator disposed behind each of the third deposition material plate and the fourth deposition material plate, configured to generate a magnetic field, a first gas supply pipe disposed between the first and third deposition material plates, configured to discharge gas to the second and fourth deposition material plates, a second gas supply pipe disposed between the second fourth deposition material plates, configured to discharge gas to the first and third deposition material plates, a first substrate support unit, configured to support a first deposition substrate, oriented toward outer edges of the first and second deposition material plates, and a second substrate support unit, configured to support a second deposition substrate, oriented toward outer edges of the third and fourth deposition material plates. | 07-14-2011 |
20120064663 | DEVICE AND METHOD FOR DEPOSITING ORGANIC MATERIAL - A device for depositing an organic material includes a substrate; a mask having an opening portion and a shield portion; a fixing member for fixing the substrate and the mask to each other; a deposition source comprising a plurality of nozzles arranged in a first direction and configured to spray the organic material; and a plurality of shield plates near the plurality of nozzles on the deposition source. An angle θ between the substrate and a line extended from a distal end of one of the nozzles to a center of a distal end of a corresponding one of the shield plates is greater than or equal to a taper angle Φ of the shield portion of the mask. | 03-15-2012 |
20120064728 | SUBSTRATE DEPOSITING SYSTEM AND DEPOSITING METHOD USING THE SAME - A substrate depositing system and a method of using a substrate depositing system. A substrate depositing system includes a load-lock chamber for loading and unloading a substrate, at least one transfer chamber connected to the load-lock chamber and including a substrate transfer device configured to vertically transfer the substrate, and a pair of depositing chambers connected to opposite sides of the at least one transfer chamber and including a depositing source and a pair of substrate fixing devices, the substrate transfer device including a pair of substrate installing members. | 03-15-2012 |
20140291146 | SPUTTERING APPARATUS - A sputtering apparatus capable of effectively reducing damage of a target in a sputtering process includes a first magnet assembly extending in a first direction and having a first side surface and a second side surface extending in the first direction, which correspond to each other, and has a first bottom surface extending in the first direction, which connects the first and second side surfaces; a first shield on the first side surface of the first magnet assembly; and a first supporter for supporting a first end and a second end of a first cylindrical tubular target, the first cylindrical tubular target having a first longitudinal axis parallel to the first direction, the first cylindrical tubular target accommodating the first magnet assembly and the first shield. | 10-02-2014 |
20140349433 | DEVICE AND METHOD FOR DEPOSITING ORGANIC MATERIAL - A device for depositing an organic material includes a substrate; a mask having an opening portion and a shield portion; a fixing member for fixing the substrate and the mask to each other; a deposition source comprising a plurality of nozzles arranged in a first direction and configured to spray the organic material; and a plurality of shield plates near the plurality of nozzles on the deposition source. An angle θ between the substrate and a line extended from a distal end of one of the nozzles to a center of a distal end of a corresponding one of the shield plates is greater than or equal to a taper angle Φ of the shield portion of the mask. | 11-27-2014 |
20150027876 | SPUTTERING SYSTEM AND METHOD OF FABRICATING DISPLAY DEVICE USING THE SAME - A sputtering system includes a chamber, a plurality of targets, and a substrate holder. The targets are disposed in the chamber. Each target includes a magnet unit disposed therein. The substrate holder is configured to support a substrate in the chamber. The magnet units are configured to generate a magnetic field between the targets. Each of the magnet units includes magnets disposed in two rows. | 01-29-2015 |
20150041310 | SPUTTERING APPARATUS AND METHOD - A sputtering apparatus includes: a first cylindrical target unit, a second cylindrical target unit facing the first cylindrical target unit; a third cylindrical target unit facing the first cylindrical target unit and the second cylindrical target unit; a fourth cylindrical target unit facing the first cylindrical target unit, the second cylindrical target unit, and the third cylindrical target unit; and a power unit configured to provide power such that two of the first cylindrical target unit, the second cylindrical target unit, the third cylindrical target unit, and the fourth cylindrical target unit function as different electrodes. | 02-12-2015 |