Patent application number | Description | Published |
20090286380 | Method for Manufacturing Semiconductor Device - A method for manufacturing a semiconductor device includes forming an oxide film uniformly in a trench in the device isolation by, for example, a radical oxidation process. The method also includes increasing the thickness of the oxide film positioned at recess sidewalls by forming a gate oxide film. Manufacturing the device according to this method will prevent junction leakage and maintain a gate oxidation intensity characteristic that will improve the refresh characteristic of the device. | 11-19-2009 |
20090298271 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device prevents failure of self-aligned contacts to improve the yield of the semiconductor device. A height of a device isolating film is larger than a height of an active region. A recess region of the device isolating film is planarized by a wet etching process to remove a hard mask layer when a recess gate is etched. A contact plug is then formed in the recess region between adjacent recess gates. | 12-03-2009 |
20110079871 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A semiconductor device includes a semiconductor substrate having a trench defining an active region. A wall oxide is formed on side walls of the active region extending in the longitudinal direction, and an element isolation layer is formed in the trenches. A method of manufacturing a semiconductor device includes forming line-shape first trenches on a semiconductor substrate so as to define an active region; forming a wall oxide on surfaces of the first trenches; forming a second trench which separates the active region into a plurality of active regions; and filling the trenches with an element isolation layer. | 04-07-2011 |
20140175659 | SEMICONDUCTOR DEVICE INCLUDING AIR GAPS AND METHOD OF FABRICATING THE SAME - This technology provides a semiconductor device and a method of fabricating the same, which may reduce parasitic capacitance between adjacent conductive structures. The method of fabricating a semiconductor device may include forming a plurality of bit line structures over a substrate, forming contact holes between the bit line structures, forming sacrificial spacers over sidewalls of the contact holes, forming first plugs recessed into the respective contact holes, forming air gaps by removing the sacrificial spacers, forming capping structures capping the air gaps while exposing top surfaces of the first plugs, and forming second plugs over the first plugs. | 06-26-2014 |
Patent application number | Description | Published |
20080200006 | Method for Forming Shallow Trench Isolation of Semiconductor Device - A method for forming a shallow trench isolation (STI) of a semiconductor device comprises forming a nitride film pattern over a semiconductor substrate having a defined lower structure, etching a predetermined thickness of the semiconductor substrate using the nitride film pattern as a mask to form a trench having a vertical sidewall in a portion of the substrate predetermined to be a device isolation region, performing a plasma treatment process on the sidewall of the trench to form a plasma oxide film, forming an oxide film over the resulting structure to fill the trench, and performing a planarization process over the resulting structure. | 08-21-2008 |
20090085159 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device and a method for manufacturing the same are provided. The semiconductor device includes cylinder type bottom electrodes connected to a contact plug formed over a semiconductor substrate, and a supporting pattern formed between the cylinder type bottom electrodes, wherein a portion of sidewalls of the bottom electrodes is higher than the supporting pattern and the other portion of the sidewalls of the bottom electrode is lower than the supporting pattern. | 04-02-2009 |
20090121309 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A method for fabricating a semiconductor device includes forming a device isolation structure on a semiconductor substrate to define an active region. A hard mask pattern defining a recess region is formed over the semiconductor substrate. The semiconductor substrate is selectively etched using the hard mask pattern to form a recess channel structure. The etching process for the semiconductor substrate is performed by two plasma etching methods under different etching conditions. The hard mask pattern is removed to expose the active region including the recess channel structure. A gate electrode is formed to fill the recess channel structure. | 05-14-2009 |
20090289880 | DISPLAY DEVICE AND BOTTOM CHASSIS THEREOF - A display device, which has a bottom chassis provided with an opening formed at one side thereof and receiving light sources therein, and at least one optical member connected to the opening to enhance optical characteristics of light emitted from the light sources, includes an optical member fixing unit including integral supporters formed integrally with the bottom chassis; and separable supporters connected to the bottom chassis to prevent movement of the at least one optical member connected to the integral supporters. The display device allows the separable supporters to have a smaller size than that of a conventional middle bezel, thus reducing production costs and to easily assemble the at least one optical member to the bottom chassis. | 11-26-2009 |
20090290090 | BACK LIGHT ASSEMBLY AND DISPLAY DEVICE HAVING THE SAME - A backlight assembly and a display device having the same, the backlight assembly including a light guide panel that guides light, a light source to generate light, being mounted to at least one end of the light guide panel, and a bottom chassis made of a reflective resin capable of reflecting light and mounted to cover a rear side of the light guide panel. | 11-26-2009 |
20100128465 | BACKLIGHT UNIT AND DISPLAY APPARATUS INCLUDING THE SAME - A backlight unit and a display apparatus including the backlight unit are provided. The backlight unit includes: a light source unit which includes at least one light source which emits light, and a gap maintaining unit; a light guiding plate which guides the light emitted from the light source; and an elastic member which elastically biases the light source unit toward the light guiding plate so that the gap maintaining unit maintains a gap between the light source and the light guiding plate. | 05-27-2010 |
20100213617 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device and a method for manufacturing the same are provided. The semiconductor device includes cylinder type bottom electrodes connected to a contact plug formed over a semiconductor substrate, and a supporting pattern formed between the cylinder type bottom electrodes, wherein a portion of sidewalls of the bottom electrodes is higher than the supporting pattern and the other portion of the sidewalls of the bottom electrode is lower than the supporting pattern. | 08-26-2010 |
20110134359 | DISPLAY APPARATUS - Disclosed is a display apparatus which is light and slim in its external appearance. The display apparatus includes a display panel which displays an image signal; a backlight unit which provides light to the display panel; a front member which includes a body whose central portion is open such that an image displayed on the display panel can be frontwardly exposed, and a support unit which supports the display panel and the backlight unit in the inner side of the body; and a rear member which is coupled to the front member and supports the back side of the backlight unit. | 06-09-2011 |
20120140514 | BACK LIGHT ASSEMBLY AND DISPLAY DEVICE HAVING THE SAME - A backlight assembly and a display device having the same, the backlight assembly including a light guide panel that guides fight, a light source to generate light, being mounted to at least one end of the light guide panel, and a bottom chassis made of a reflective resin capable of reflecting light and mounted to cover a rear side of the light guide panel. | 06-07-2012 |
20120182482 | BACKLIGHT UNIT AND DISPLAY APPARATUS INCLUDING THE SAME - A backlight unit and a display apparatus including the backlight unit are provided. The backlight unit includes: a light source unit which includes at least one light source which emits light, and a gap maintaining unit; a light guiding plate which guides the light emitted from the light source; and an elastic member which elastically biases the light source unit toward the light guiding plate so that the gap maintaining unit maintains a gap between the light source and the light guiding plate. | 07-19-2012 |
Patent application number | Description | Published |
20130280596 | CASE OF POUCH TYPE CELL - Provided is a case of pouch type cells, which is capable of stably protecting pouch type cells constituting a secondary battery used as a high power supply, and having excellent heat dissipation performance. | 10-24-2013 |
20140050954 | BATTERY MODULE - Provided is a battery module in which at least one battery cell including an electrode tab including an anode tab and a cathode tab is stacked, including: a sensing assembly installed in a space between the anode tab and the cathode tab at a side of the battery module at which the electrode tab is positioned; and a terminal installed at the side of the battery module at which the electrode tab is positioned and connected to each of the electrode tabs of the battery cells positioned at the outermost portions, wherein the terminal is bonded and connected to a surface positioned at an inner side of the battery module in both sides of the anode tab and the cathode tab. | 02-20-2014 |
20140093768 | PARTITION OF POUCH TYPE SECONDARY BATTERY - Provided is a partition of a pouch type secondary battery provided between at least two pouch type secondary batteries stacked in order to configure a secondary battery module to prevent damage of a surface of the pouch type secondary battery and shaking of the pouch type secondary battery at the time of vibration while preventing damage of the pouch type secondary battery due to a short-circuit. | 04-03-2014 |
20140247858 | SUBSTRATE FOR SENSING BATTERY CELL - Provided is a substrate for sensing voltage and temperature of battery cells, and more particularly, a substrate for sensing battery cells firmly fixed to the battery cells by a clip coupling method and easily detached and attached therefrom. | 09-04-2014 |