Patent application number | Description | Published |
20120068734 | Integrated Circuit Leakage Power Reduction using Enhanced Gated-Q Scan Techniques - Specific logic gates for q-gating are selected by determining the minimum leakage state for a circuit design and then selecting logic gates that hold the circuit design in its lowest leakage state. Depending on the input desired to implement the minimum leakage state, the gate may be selected as a NOR or OR gate. Q-gating that is implemented with gates chosen to implement the minimum leakage state may be enabled during selected operating modes. The minimum leakage state of a circuit can be determined with an automatic test pattern generation (ATPG) tool. | 03-22-2012 |
20130043897 | TESTING STACKED DIE - An integrated circuit configured for at-speed testing is described. The integrated circuit includes a first die. The first die includes a transition launch point. The integrated circuit also includes a second die. The second die includes a first observe point. The integrated circuit further includes a first through silicon via. The first through silicon via couples the first die to the second die. | 02-21-2013 |
20130241593 | INTEGRATED CIRCUIT LEAKAGE POWER REDUCTION USING ENHANCED GATED-Q SCAN TECHNIQUES - Specific logic gates for Q-gating are selected by determining the minimum leakage state for a circuit design and then selecting logic gates that hold the circuit design in its lowest leakage state. Depending on the input desired to implement the minimum leakage state, the gate may be selected as a NOR or OR gate. Q-gating that is implemented with gates chosen to implement the minimum leakage state may be enabled during selected operating modes. The minimum leakage state of a circuit can be determined with an automatic test pattern generation (ATPG) tool. | 09-19-2013 |
20130285687 | METHOD AND APPARATUS FOR CHARACTERIZING THERMAL MARGINALITY IN AN INTEGRATED CIRCUIT - Apparatus and methods are described herein for emulating the hot spot distribution of a functional test by applying vectors for structural test to an integrated circuit (IC). The affects of the hot spots can then be tested and characterized. The vectors may be generated on the IC, or may be fed to the IC via an external source. | 10-31-2013 |