Patent application number | Description | Published |
20090095949 | Low Area Contact Phase-Change Memory - A memory device includes a first electrode and a second electrode. A phase-change material is disposed between the first and second electrodes. The phase-change material is in electrical communication with the first and second electrodes at a first contact region and a second contact region respectively. The first and second contact regions are similar in contact area. The device enables scaling of reset current to smaller dimensions without encountering a limitation imposed by an offset current. | 04-16-2009 |
20090095951 | Memory Device With Low Reset Current - An electronic device includes a first electrode and a second electrode. The device also includes a resistive material between the first and second electrodes. An active material is between the first electrode and the resistive material. The active material is in electrical communication with the first electrode and the active material is in electrical communication with the second electrode through the resistive layer. | 04-16-2009 |
20090298222 | Method for manufacturing Chalcogenide devices - A method of chalcogenide device formation includes treatment of the surface upon which the chalcogenide material is deposited. The treatment reduces or eliminates native oxides and other contaminants from the surface, thereby increasing the adhesion of the chalcogenide layer to the treated surface, eliminating voids between the chalcogenide layer and deposition surface and reducing the degradation of chalcogenide material due to the migration of contaminants into the chalcogenide. | 12-03-2009 |
20100182827 | High Margin Multilevel Phase-Change Memory via Pulse Width Programming - An electronic device and method of programming for binary and multilevel memory operation. The active material of the device is a phase-change material. The method includes utilization of the pulse duration of electrical pulses as a programming variable to program a phase-change device to two or more memory states that differ in the relative proportion and/or spatial arrangement of crystalline and amorphous phase regions. Pulse width programming, in conjunction with a device electrical contact having a resistivity within a particular range, enables fine control over the crystalline-amorphous phase-change process by facilitating control over the spatial distribution of thermal energy produced by Joule heating. The degree of control over the phase-change process enables reliable multilevel memory operation by providing for reproducible programming of memory states that are well-resolved in both resistance and programming variable. | 07-22-2010 |
20110070715 | MANUFACTURING A PHASE CHANGE MEMORY DEVICE HAVING A RING HEATER - A ring shaped heater surrounds a chalcogenide region along the length of a cylindrical solid phase portion thereof defining a change phase memory element. The chalcogenide region is formed in a sub-lithographic pore, so that a relatively compact structure is achieved. Furthermore, the ring contact between the heater and the cylindrical solid phase portion results in a more gradual transition of resistance versus programming current, enabling multilevel memories to be formed. | 03-24-2011 |
20110227027 | Memory Device and Method of Making Same - A radial memory device includes a phase-change material, a first electrode in electrical communication with the phase-change material, the first electrode having a substantially planar first area of electrical communication with the phase-change material. The radial memory device also includes a second electrode in electrical communication with the phase-change material, the second electrode having a second area of electrical communication with the phase-change material, the second area being laterally spacedly disposed from the first area and substantially circumscribing the first area. | 09-22-2011 |
20140098604 | Immunity of Phase Change Material to Disturb in the Amorphous Phase - Disturb from the reset to the set state may be reduced by creating an amorphous phase that is substantially free of crystal nuclei when programming the reset state in a phase change memory. In some embodiments, this can be achieved by using a current or a voltage to program that exceeds the threshold voltage of the phase change memory element, but does not exceed a safe current voltage which would cause a disturb. | 04-10-2014 |
20140328121 | Immunity of Phase Change Material to Disturb in the Amorphous Phase - Disturb from the reset to the set state may be reduced by creating an amorphous phase that is substantially free of crystal nuclei when programming the reset state in a phase change memory. In some embodiments, this can be achieved by using a current or a voltage to program that exceeds the threshold voltage of the phase change memory element, but does not exceed a safe current voltage which would cause a disturb. | 11-06-2014 |