Patent application number | Description | Published |
20100109040 | CHIP COATED LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF - A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production. | 05-06-2010 |
20100112735 | CHIP COATED LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF - A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production. | 05-06-2010 |
20100289051 | CHIP COATED LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF - A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production. | 11-18-2010 |
Patent application number | Description | Published |
20150043239 | LAMP FOR VEHICLE AND VEHICLE HAVING THE SAME - Provided is a lamp for a vehicle. The lamp includes: an LED array; and an aspherical lens disposed in front of the LED array, in which a first stepped portion is provided on a light incident surface of the aspherical lens, and a second stepped portion is provided on a light exit surface of the aspherical lens, thereby reducing a brightness difference between a central portion and both side portions of a lighting image, and preventing light blurring. | 02-12-2015 |
20150146448 | MULTI-ARRAY LED CHIP FOR VEHICLE AND HEAD LAMP HAVING THE SAME - The present invention relates to a multi-array chip for a vehicle, including a plurality of LED element having different sizes arranged and installed to emit light, and a head lamp having the multi-array chip for a vehicle. Accordingly, with variable LED elements which are individually turned on and off so as to correspond to a location of an oncoming vehicle, and have different sizes, visibility at the front side of a vehicle may be secured, and light blindness to a driver in the oncoming vehicle, may be prevented. | 05-28-2015 |
20160084464 | LAMP LENS WITH REDUCED CHROMATIC ABERRATION AND LAMP FOR VEHICLE USING THE SAME - The present disclosure relates to a lamp lens with a reduced chromatic aberration, and a lamp for a vehicle using the same. In the lamp lens with a reduced chromatic aberration, a thin film formed of a predetermined material is coated or deposited on a surface of the lamp lens and the thin film is formed within | 03-24-2016 |
Patent application number | Description | Published |
20140316944 | ESL SYSTEM USING SMART PHONE AND OPERATING METHOD THEREOF - Embodiments of the invention provide an ESL system using a smart phone and an operating method thereof. In accordance with at least one embodiment, the operating method of an ESL system using a smart phone includes listing purchase target product items and transmitting a product purchase item list through a smart phone of a user, and receiving the product purchase item list through a gateway, searching products of purchase items, and transmitting position information of each product to the smart phone, by an ESL server. The method further includes calculating an optimal path from a current position of the smart phone to a position of each product based on the position information of each product by the smart phone, and transmitting final position information of a corresponding product to the smart phone by the ESL server, when the smart phone approaches the corresponding product of a purchase target depending on a movement of the user based on the optimal path. | 10-23-2014 |
20150117421 | ADAPTIVE DUAL BAND MIMO WI-FI APPARATUS, AND OPERATING METHOD THEREOF - An adaptive dual band Multiple-Input Multiple-Output (MIMO) wireless-fidelity (Wi-Fi) apparatus may include an application processor, an interface unit transmitting data and a control signal from the application processor, a first dual band wireless communications unit performing wireless communications using at least one of a first band and a second band; a second dual band wireless communications unit performing wireless communications using at least one of the first band and the second band upon being operated, a first selecting unit providing a first path between the first dual band wireless communications unit and a first antenna and providing a second path between the second dual band wireless communications unit and the first antenna, and a second selecting unit providing a first path between the second dual band wireless communications unit and the second antenna and providing a second path between the first dual band wireless communications unit and the second antenna. | 04-30-2015 |
20150319580 | WIRELESS POSITION ESTIMATION APPARATUS AND METHOD - A wireless position estimation apparatus may include a wireless communications unit receiving radio signals including positional information related to a plurality of APs from the plurality of APs including a plurality of antennas, a radio signal processing unit combining radio signals received from the plurality of antennas or selecting one of the radio signals, depending on whether or not channel gains of the respective antennas are changed, for a respective AP, a distance calculating unit measuring received signal strength indication (RSSI) values of the radio signals combined or selected by the radio signal processing unit and calculating distance values to the APs using the measured RSSI values, and a position estimating unit estimating a position of a terminal using the calculated distance values and the positional information. | 11-05-2015 |
20150319847 | WIRING SUBSTRATE - A wiring substrate may include an insulating layer; a differential signal transmission line including a first wiring formed on a first surface of the insulating layer and a second wiring formed on a second surface of the insulating layer, the first wiring and the second wiring transmitting differential signals; and a ground part including a first ground layer and a second ground layer disposed to be spaced apart from the first wiring by the predetermined distance on the first surface of the insulating layer and a third ground layer and a fourth ground layer disposed to be spaced apart from the second wiring by the predetermined distance on the second surface of the insulating layer. | 11-05-2015 |
20150325534 | SEMICONDUCTOR PACKAGE FOR RADIO COMMUNICATION AND METHOD OF MANUFACTURING THE SAME - A semiconductor package for radio communication may include a substrate, and a plurality of electronic devices mounted on both surfaces of the substrate. The electronic devices running on the same frequency band among the plurality of electronic devices may be separately mounted on the both surfaces of the substrate. A method of manufacturing a semiconductor package for radio communication may include preparing a substrate, mounting at least one or more electronic devices on an upper surface of the substrate, and mounting at least one or more electronic devices on a lower surface of the substrate. The electronic devices of the same frequency band among the electronic devices may be separately mounted on the upper and lower surfaces of the substrate. | 11-12-2015 |
Patent application number | Description | Published |
20100125860 | OPTICAL DISC DRIVE HAVING TRAY FOR LOADING DISC - Provided is an optical disc drive having a tray to receive a disc. The tray includes a hollow portion having a bottom corresponding to the disc and a wall surrounding a portion of the bottom, and a plurality of supporting portions formed on the bottom of the hollow portion to locally support a bottom surface of the disc. | 05-20-2010 |
20130061255 | OPTICAL DISC DRIVE INCLUDING GUIDE SHAFT SUPPORTING STRUCTURE - Provided is a shaft supporting structure, an optical pickup moving structure including the shaft supporting structure, and an optical disc drive. The shaft supporting structure includes a base chassis, a shaft installed on the base chassis, an axis support that supports an end of the shaft, and a rotatable locker for preventing the shaft from being separated from the axis support. | 03-07-2013 |
20130111508 | DISC CHUCKING STRUCTURE AND OPTICAL DISC DRIVE INCLUDING THE SAME | 05-02-2013 |
20140223457 | OPTICAL DISK DRIVE INCLUDING SPINDLE UNIT AND CHUCKING STRUCTURE - Provided is a spindle unit. The spindle unit includes: a spindle motor having a rotation shaft; a turntable that is coupled to the rotation shaft and supports a data storage device; and a sliding cone coupled to the turntable so as to elastically move up and down and to be inserted into a hole formed at the data storage device. The sliding cone includes a bump protruding from a surface thereof, and the bump has a concave portion recessed downward from a center thereof. | 08-07-2014 |
20140237491 | OPTICAL DISC DRIVE AND MAIN FRAME OF OPTICAL DISC DRIVE - Provided is an optical disc drive that may prevent an optical disc from dropping during an unclamping operation. The optical disc drive includes a main frame to support the optical disc drive and a disc tray in which the optical disc is disposed, and one or more stopper mechanisms to prevent the optical disc disposed on the disc tray from dropping. | 08-21-2014 |
20140245330 | TILT ADJUSTING APPARATUS AND OPTICAL DISC DRIVE USING THE SAME - Provided is a tilt adjusting apparatus of an optical disc drive for adjusting a tilt of an optical pickup unit. The tilt adjusting apparatus includes an optical pickup unit moving in a radial direction of the disc, along first and second guide shafts. The tilt adjusting unit also includes a fixing support unit that fixes the first guide shaft and an adjustment supporting unit that supports the second guide shaft and enables the height of both ends of the second guide shaft to be adjusted. | 08-28-2014 |