Sekito
Shinobu Sekito, Tokyo JP
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20100073012 | METHOD FOR DETECTING WATER LEAKAGE OF COIL AND WATER LEAKAGE DETECTOR APPLICABLE TO THIS METHOD - According to the present invention, a method of detecting water leakage in a coil, which determines whether or not cooling water leaks into an insulation layer, the water being supplied to a conductor of a coil covered with the insulation layer, including: applying an AC voltage to the conductor; bringing a surface electrode device into pressure contact with the insulation layer; grounding the surface electrode device through an impedance; measuring a potential of the surface electrode device; and determining that the cooling water leaks from the conductor into the insulation layer when a measured potential is higher than a potential of a normal coil | 03-25-2010 |
Shinobu Sekito, Yokohama-Shi JP
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20090072654 | COIL INSULATOR, ARMATURE COIL INSULATED BY THE COIL INSULATOR AND ELECTRICAL ROTATING MACHINE HAVING THE ARMATURE COIL - A coil insulator of an electrical rotating machine used as a main insulator for insulating a bundle of conductors formed of a plurality of insulated wires to form an armature coil provided in a slot of a rotor core or a stator core of an electrical rotating machine, wherein the coil insulator includes a mica layer including at least one of a peeled-off mica and a composite mica, a woven- or unwoven cloth including at least one of inorganic and organic materials, hexagonal crystal boron nitride particles having a graphitization index of 1.8 or more, and thermosetting polymer organic resin which integrally connects the mica layer and the hexagonal crystal boron nitride particles to each other, and the hexagonal crystal boron nitride particles is oriented in a longitudinal direction of the coil. | 03-19-2009 |
Takashi Sekito, Kakegawa-Shi JP
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20130216952 | POSITIVE PHOTOSENSITIVE SILOXANE COMPOSITION - A positive photosensitive siloxane composition containing: a polysiloxane (Ia), which is obtained by hydrolyzing and condensing the silane compound represented by RSi(OR | 08-22-2013 |
20140024758 | COATING COMPOSITION CONTAINING SILOXANE RESIN | 01-23-2014 |
20140335448 | PHOTOSENSITIVE SILOXANE RESIN COMPOSITION - [Object] To provide a photosensitive siloxane resin composition excellent in alkali-solubility and in sensitivity, and also to provide a pattern-formation method employing that. | 11-13-2014 |
Takashi Sekito, Shizouka JP
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20140335452 | POSITIVE PHOTOSENSITIVE SILOXANE COMPOSITION - A positive photosensitive siloxane composition comprising at least three types of following polysiloxanes (A), (B) and (C) obtained by hydrolyzing and condensing a silane compound represented by general formula (1) R | 11-13-2014 |
Takashi Sekito, Shizuoka JP
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20150017587 | COMPOSITION FOR FORMING FINE RESIST PATTERN AND PATTERN FORMING METHOD USING SAME - [Object] To provide a composition enabling to form a fine negative photoresist pattern free from troubles, such as, surface roughness, bridge defects, and resolution failure; and also to provide a pattern formation method using that composition. | 01-15-2015 |
Takeshi Sekito, Kariya-Aichi JP
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20130192999 | WATER OXIDATION CATALYST - A process for oxidizing water using amorphous cobalt tungstate is disclosed. A plurality of amorphous cobalt tungstate nanoparticles are supported on an electrode and are able to catalytically interact with water molecules generating oxygen. The catalyst can be used as part of a electrochemical or photo-electrochemical cell for the generation of electrical energy. | 08-01-2013 |
Yasuhiro Sekito, Obu-City JP
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20110162409 | Air conditioning system for vehicle - A driving apparatus for an air conditioning system has a first and a second electrical actuators for driving air control doors, wherein the first and second actuators are accommodated in a common housing so that they are modularized to each other. The driving apparatus further has a third electrical actuator for driving another air control door, wherein the third actuator is provided at a position separated from the housing. Driving circuits for the first to third actuators are formed on a single IC chip or on a single electrical circuit board. The driving circuits formed on the IC chip or the electrical circuit board is accommodated in the housing for the first and second actuators. | 07-07-2011 |
Yasuhiro Sekito, Kariya-City JP
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20140284023 | CONTROL DEVICE FOR AIR CONDITIONER - The present disclosure simplifies the H-bridge circuit of the direct current motor for driving the damper (door) that switches the air passages in the indoor unit of an air conditioning device. The control device for an air conditioner that takes in inside or outside air and conditions the air inside an air conditioning unit using an evaporator and a heater core is provided with: a first actuator and a second actuator that drive the multiple dampers installed inside the air conditioning unit for switching the air passages; and three half-bridge circuits that control the first actuator and the second actuator sharing one of the half-bridge circuits. Of the multiple dampers, the first actuator is connected to the inside/outside air switching damper. Of the multiple dampers, the second actuator is connected to at least one air mix damper. | 09-25-2014 |
Yoshihide Sekito, Shiga JP
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20100132989 | NOVEL POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF - An object of the present invention is to provide a polyimide precursor composition solution that (i) uses no siloxane diamine, (ii) is curable at low temperature (not more than 250° C.) and (iii) has low viscosity regardless of its high concentration, and a photosensitive resin composition, photosensitive resin film, a thermosetting resin composition, a polyimide insulating film, and a printed wiring board with an insulating film, each of which has good physical properties and is obtained by use of the polyimide precursor composition solution. The foregoing object is attained by using a polyimide precursor composition solution which includes at least a (A) urethane imide oligomer having a terminal carboxylic acid group and a (B) diamino compound and/or isocyanate compound. | 06-03-2010 |
20110061914 | NOVEL POLYIMIDE PRECURSOR COMPOSITION, USE OF THE SAME, AND PRODUCTION METHOD OF THE SAME - An object of the present invention is to provide (i) a polyimide precursor composition which is curable at a low temperature (not more than 250° C.) and which has a low viscosity despite having a high concentration, and a production method thereof, (ii) a polyimide coating film obtained from the polyimide precursor composition and having good properties, and a production method thereof, (iii) a photosensitive resin composition prepared by use of the polyimide precursor composition, and a production method thereof. The object of the present invention can be attained by a polyimide precursor composition containing an imidized tetracarboxylic acid having a specific structure and an isocyanate compound having a specific structure, or optionally a diamine. | 03-17-2011 |
20110061915 | NOVEL RESIN COMPOSITION AND USE THEREOF - An object of the present invention is to provide: a (a) thermosetting resin composition, a photosensitive resin composition, a resin composition solution, a resin film, and an insulating film, each of which (i) is curable at a low temperature (not more than 200° C.), (ii) has excellent flexibility, electrical insulating reliability, solder heat resistance, and resistance to organic solvent, (iii) causes less warpage of a substrate after curing, and (iv) has excellent adhesiveness to a sealing agent; and a (b) printed wiring board provided with the insulating film mentioned above. The object of the present invention is attainable by using a thermosetting resin composition containing at least a (A) urethane imide oligomer having a terminal carboxylic acid group and a (B) thermosetting resin. | 03-17-2011 |
20110083884 | NOVEL POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF - An object of the present invention is to provide (a) a polyimide precursor solution which is curable at low temperatures (not more than 200° C.) and which has excellent long-term storage stability, (b) a photosensitive resin composition, a photosensitive resin film, a thermosetting resin composition, and a polyimide insulating film, each of which is obtainable from the polyimide precursor solution and each of which is preferably usable as an insulating material for electric and electronic purposes, and (c) a printed wiring board provided with the insulating film. The above object is achievable by use of a polyimide precursor composition solution containing at least a partially imidized polyimide precursor having a urethane bond. | 04-14-2011 |
20130333931 | NOVEL INSULATING FILM AND PRINTED WIRING BOARD PROVIDED WITH INSULATING FILM - The present invention provides an insulating film including: a (A) binder polymer; (B) spherical organic beads; and (C) fine particles containing at least one element selected from the group consisting of phosphorus, aluminum, and magnesium, both the (B) spherical organic bead and the (C) fine particles being dispersed in a predetermined state in the insulating film. | 12-19-2013 |
20140048314 | FLEXIBLE PRINTED CIRCUIT INTEGRATED WITH REINFORCING PLATE - A stiffener-integrated flexible printed circuit board includes: (A) a stiffener; (B) a thermosetting adhesive on the stiffener (A); (C) an insulator film on the thermosetting adhesive (B); and (D) a wiring-pattern-equipped film on the insulator film (C), the insulator film (C) containing at least (a) a binder polymer and (b) spherical organic beads. This provides a stiffener-integrated FPC which is excellent in adhesion between a thermosetting adhesive of a stiffener and an insulator film and which is small in warpage. | 02-20-2014 |
20140054081 | NOVEL FLEXIBLE PRINTED CIRCUIT INTEGRATED WITH CONDUCTIVE LAYER - A conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film on the electromagnetic-shielding conductive film (A); and (C) a wiring-pattern-equipped film on the insulator film (B), the insulator film (B) containing at least (a) a binder polymer and (b) spherical organic beads. | 02-27-2014 |
20140069702 | NOVEL PHOTOSENSITIVE RESIN COMPOSITION AND USE THEREOF - The photosensitive resin composition contains a (A) binder polymer, (B) cross-linked polymer particles, (C) thermosetting resin, (D) photo-polymerization initiator, and a (E) phosphoric flame retardant, in which a content of the (B) cross-linked polymer particles is 30 parts by weight to 100 parts by weight with respect to the 100 parts by weight of the (A) binder polymer, and an average particle diameter of the (B) cross-linked polymer particles is 1 μm to 10 μm. Therefore, the photosensitive resin composition (i) obtains an excellent tack-free property after being applied and dried, (ii) can be subjected to fine processing, (iii) is formed into a cured film having excellent flexibility, flame retardancy, and electrical insulation reliability, and (iv) causes a substrate to have a small warpage after being cured. | 03-13-2014 |
20140158412 | NOVEL CONDUCTIVE LAYER INTEGRATED FPC - A conductive-layer-integrated flexible printed circuit includes: (A) an electromagnetic-shielding conductive layer; (B) a photosensitive resin composition layer; and (C) a wiring-pattern-equipped film, (A) the electromagnetic-shielding conductive layer, (B) the photosensitive resin composition layer, and (C) the a wiring-pattern-equipped film being laminated in this order, and (B) the photosensitive resin composition layer being formed from a photosensitive resin composition containing at least (a) carboxyl-group-containing resin, (b) a photo-polymerization initiator, and (c) thermosetting resin. | 06-12-2014 |
20140363639 | NOVEL RESIN COMPOSITION FOR INSULATING FILM, AND USE THEREOF - The present invention provides a resin composition for an insulating film which resin composition is excellent in tack property after drying and allows a resultant insulating film to be excellent in flexibility and electrical insulation reliability and to be small in warpage after curing, a resin film for an insulating film, an insulating film, and a printed wiring board provided with an insulating film. The resin composition for an insulating film contains at least: a (A) binder polymer; and (B) cross-linked polymer particles, whose polymer has a urethane bond and a carbonate skeleton in its molecule. | 12-11-2014 |
20140370301 | NOVEL RESIN COMPOSITION FOR PIGMENT-CONTAINING INSULATING FILM, AND USE THEREOF - According to a resin composition for a pigment-containing insulating film which resin composition contains at least a (A) binder polymer and (B) pigment-containing cross-linked polymer particles, it is possible to provide a resin composition for a pigment-containing insulating film which resin composition is excellent in tack property after drying and allows a resultant pigment-containing insulating film to be excellent in flexibility and electrical insulation reliability and to be small in warpage after curing, a resin film for a pigment-containing insulating film, a pigment-containing insulating film, and a printed wiring board provided with a pigment-containing insulating film. | 12-18-2014 |
20150044451 | BLACK PHOTOSENSITIVE RESIN COMPOSITION AND USE OF SAME - Provided is a black photosensitive resin composition being microfabricatable due to its photosensitivity, allowing a cured film obtainable therefrom to be excellent in flexibility, being small in post-curing warpage of a substrate, being excellent in flame retardancy and electric insulation reliability, allowing a reduction in process contamination due to less outgassing during a reflow process, and avoiding a reduction in film thickness. The black photosensitive resin composition contains at least (A) a binder polymer, (B) a thermosetting resin, (C) a flame retardant substantially insoluble in an organic solvent, (D) a photopolymerization initiator, (E) a black colorant reflecting light having a wavelength falling within an infrared range, and (F) an organic solvent, or contains at least (A) a binder polymer, (B) a thermosetting resin, (G) spherical organic beads, (D) a photopolymerization initiator, (E) a black colorant reflecting light having a wavelength falling within an infrared range, and (F) an organic solvent. | 02-12-2015 |
Yoshihide Sekito, Otsu-Shi JP
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20100084171 | NOVEL POLYIMIDE PRECURSOR COMPOSITION, USE THEREOF AND PRODUCTION METHOD THEREOF - An object of the present invention is to provide a polyimide precursor composition that can be cured at low temperatures (250° C. or lower), while having a low viscosity even at a high concentration, and a method of producing the same. Another object of the present invention is to provide a polyimide coating film obtained from the polyimide precursor composition and having good physical properties, and a method of producing the same. Furthermore, another object of the present invention is to provide a photosensitive resin composition containing the polyimide precursor composition, and a method of producing the same. These objects can be achieved by the polyimide precursor composition containing an imidized tetracarboxylic acid having a specific structure and a diamine having a specific structure. | 04-08-2010 |
20130183499 | FLEXIBLE PRINTED CIRCUIT BOARD INTEGRATED WITH REINFORCING PLATE, AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD INTEGRATED WITH REINFORCING PLATE - An object of the present invention is to provide (i) a stiffener-integrated flexible printed circuit board in which a defect such as a blistering is not generated during a reflow process even though a stiffener is attached to a photosensitive resin composition, and (ii) a method for manufacturing the stiffener-integrated flexible printed circuit board. The object can be attained by causing a stiffener-integrated flexible printed circuit board to have a structure in which (A) a stiffener ( | 07-18-2013 |
20130189624 | NOVEL PHOTOSENSITIVE RESIN COMPOSITION PRODUCTION KIT, AND USE THEREOF - The object of the present invention is to provide a photosensitive resin composition which is excellent in: storage stability in a long-term storage; microfabricability; developability; low-temperature curability; flexibility in a cured film; electrical insulation reliability; solder heat resistance; resistance to an organic solvent; and flame retardancy and low in post-curing warpage when processed into a substrate. The object can be attained by use of a photosensitive resin composition production kit which includes at least two or more components including an A component and a B component. The A component contains a (A) compound having a carboxyl group. The B component contains a (B) compound having a reactive group which is reactive to a carboxyl group, a (C) oxime ester photopolymerization initiator, and a (D) compound having a photosensitive group but no carboxyl group. | 07-25-2013 |
Yoshihito Sekito, Tokyo JP
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20130095347 | HOT-STAMPED STEEL, METHOD OF PRODUCING OF STEEL SHEET FOR HOT STAMPING, AND METHOD OF PRODUCING HOT-STAMPED STEEL - A hot-stamped steel according to the present invention includes, by mass %, C: 0.20% to 0.35%, Si: 0.1% to 0.5%, the total of at least one selected from Mn and Cr: 1% to 3%, Al: 0.005% to 0.06%, Ti: 0.002% to 0.1%, Nb: 0.002% to 0.1%, O: 0.003% to 0.007%, and a balance of iron and inevitable impurities, wherein P is limited to 0.015% or less, S is limited to 0.01% or less, N is limited to 0.004% or less, the dimensional ratio of the lengths of prior austenite grains in a rolling direction to the lengths of the prior austenite grains in the sheet thickness direction is 1.3 to 2.5, the average grain size of the prior austenite grains is 6 μm or less, the microstructure includes 98% or more of martensite, and the tensile strength is 1470 MPa or more. | 04-18-2013 |