Seiki, JP
Hiroyuki Seiki, Tokyo JP
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20140124967 | OPTICAL ELEMENT MANUFACTURING METHOD AND SURFACE PROCESSING DEVICE - A method includes: a main body processing step of forming a lens main body having the concave lens surface; a molding step of coating a molding resin on the concave lens surface, pressing a microstructure forming mold, having a molding surface portion transferring the reflection preventing part formed on the surface of a deformable base body part thereof, against the concave lens surface, and curing the molding resin; and a mold release step of exerting a moment of a force relating to the surface top of the molding surface portion so as to deform the base body part to gradually separate the microstructure forming mold from an outer peripheral side thereof in a direction in which the concavo-convex shape of the reflection preventing part extends, thereby performing mold release. | 05-08-2014 |
Kazuhiro Seiki, Kai JP
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20090170290 | SEMICONDUCTOR MANUFACTURING METHOD OF DIE PICK-UP FROM WAFER - A manufacturing method of a semiconductor device comprising the steps of: affixing a die attach film and a dicing film to a back surface of a semiconductor wafer: thereafter dicing the semiconductor wafer and the die attach film to divide the semiconductor wafer into a plurality of semiconductor chips: thereafter pulling the dicing film from the center toward the outer periphery of the dicing film with a first tensile force to cut the die attach film chip by chip; and thereafter picking up the semiconductor chips together with the die attach film while pulling the dicing film from the center toward the outer periphery of the dicing film with a second tensile force smaller than the first tensile force. | 07-02-2009 |
20100279465 | SEMICONDUCTOR MANUFACTURING METHOD OF DIE PICK-UP FROM WAFER - A manufacturing method of a semiconductor device comprising the steps of: affixing a die attach film and a dicing film to a back surface of a semiconductor wafer: thereafter dicing the semiconductor wafer and the die attach film to divide the semiconductor wafer into a plurality of semiconductor chips: thereafter pulling the dicing film from the center toward the outer periphery of the dicing film with a first tensile force to cut the die attach film chip by chip; and thereafter picking up the semiconductor chips together with the die attach film while pulling the dicing film from the center toward the outer periphery of the dicing film with a second tensile force smaller than the first tensile force. | 11-04-2010 |
Kazuo Seiki, Aichi JP
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20090051249 | Ultrasonic Motor - Provided is an ultrasonic motor capable of realizing high torque. When two terminals are selected from a first terminal ( | 02-26-2009 |
20090267450 | Vibration Actuator - It is an subject of the present invention to provide a vibration actuator in which a plurality of rotors can be driven by a single vibration unit. | 10-29-2009 |
20090267455 | Vibration Actuator - Provided is a vibration actuator in which a plurality of rotors can be driven by a single vibration unit. | 10-29-2009 |
Kazuo Seiki, Kariya-Shi JP
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20120001519 | VIBRATION ACTUATOR - A vibration actuator includes a roller, a vibrating element having a contact portion that is in contact with the roller, a vibrator for vibrating the vibrating element, a pressing device for pressing the roller against the vibrating element, and a lubricator disposed close to the contact portion and in contact with the roller. | 01-05-2012 |
Kosuke Seiki, Ibaraki JP
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20080233597 | Method of Detecting or Differentiating Rheumatoid Arthritis and Method of Determining Stage of Disease or Degree of Dysfunction with Regard to Rheumatoid Arthritis - A method of readily detecting or differentiating rheumatoid arthritis, which has so far been diagnosed in a comprehensive manner based on various tests and clinical symptoms, and a method of readily and objectively estimating the stage of disease and the degree of dysfunction with regard to rheumatoid arthritis are provided. | 09-25-2008 |
20100112709 | HIGHLY SENSITIVE METHOD FOR DETECTING PROTEIN IN FOOD - A method for accurate and precise measurement of target proteins such as food allergen proteins in the specific foods is provided. The method is a method for immunological measurement of a food allergen protein in a processed food using an antibody against the food allergen protein, comprising adding animal tropomyosin to an assay solution upon measurement. | 05-06-2010 |
Masashi Seiki, Kyoto-Shi JP
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20100287380 | WRITING AREA SECURITY SYSTEM - A writing area security system ( | 11-11-2010 |
Motoharu Seiki, Tokyo JP
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20140045196 | METHODS OF PROGNOSIS AND DIAGNOSIS OF CANCER - Provided are methods of diagnosing cancer in a patient by detecting the presence and/or amount of a biomarker of cancer in a sample from the patient. The methods and biomarkers may be used to develop an accurate prognosis for a patient having cancer or suspected of having cancer, or to accurately diagnose a patient having, or suspected of having cancer. The methods and biomarkers may be used to identify and/or classify a patient as a candidate for a cancer therapy. | 02-13-2014 |
Takashi Seiki, Tsukuba-Shi JP
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20100168014 | Screening method - The present inventors have found that relaxin-3 has a feeding-stimulating activity, a body weight increasing activity, and fat weight increasing activity by intracerebroventricularly administering relaxin-3 to rats and observing the amount of feeding, body weight and fat weight, and so on after the administration. According to the present invention, a polypeptide having useful effects in stimulating feeding, increasing body weight, and fattening; a therapeutic agent containing said polypeptide; a method of screening for a compound, a substance, or a salt thereof which activates or suppresses a receptor of said polypeptide; a kit for said screening; and an agent which comprises a substance which inhibits expression of said polypeptide, such as a feeding-surpressing agent, a therapeutic agent for the treatment of obesity, and a therapeutic agent for the treatment of diabetes. | 07-01-2010 |
Wataru Seiki, Tokyo JP
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20120103262 | APPARATUS OF MANUFACTURING SILICON CARBIDE SINGLE CRYSTAL - A apparatus ( | 05-03-2012 |