Patent application number | Description | Published |
20110032772 | SEMICONDUCTOR DEVICE WITH VERTICAL GATE AND METHOD FOR FABRICATING THE SAME - A vertical channel type non-volatile memory device having a plurality of memory cells stacked along a channel includes the channel configured to be protruded from a substrate, a tunnel insulation layer configured to surround the channel, a plurality of floating gate electrodes and a plurality of control gate electrodes configured to be alternately stacked along the channel, and a charge blocking layer interposed between the plurality of the floating gate electrodes and the plurality of the control gate electrodes alternately stacked. | 02-10-2011 |
20120106260 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF OPERATING THE SAME - A method of operating a semiconductor memory device includes performing a first program operation in order to raise threshold voltages of memory cells, performing a program verification operation for detecting fast program memory cells, each having a threshold voltage risen higher than a first sub-verification voltage from a second sub-verification voltage or lower, by using a target verification voltage and the first sub-verification voltage and the second sub-verification voltage which are sequentially lower than the target verification voltage, and performing a second program operation under a condition that an increment of each of threshold voltages of memory cells, which is lower than the target verification voltage, is greater than an increment of the threshold voltage of each of the fast program memory cells. | 05-03-2012 |
20120140566 | PROGRAMMING METHOD OF NON-VOLATILE MEMORY DEVICE - A programming method includes setting the voltages of bit lines, performing a program operation, performing a program verify operation by supplying a program verify voltage and determining whether all of the memory cells of the selected page have been programmed with a target threshold voltage or higher, counting the number of passed memory cells corresponding to a number of pass bits, if, a result of the program verify operation, the program operation failed to program all of the memory cells of the selected page to the target threshold voltage or higher, and making a determination that determines whether the number of pass bits is greater than the first number of pass permission bits, and raising a voltage of a bit line coupled to a failed memory cell, if, as a result of the determination, the number of pass bits is greater than the first number of pass permission bits. | 06-07-2012 |
20120155183 | METHOD OF SOFT PROGRAMMING SEMICONDUCTOR MEMORY DEVICE - An operating method of a semiconductor memory device includes erasing all memory cells of a selected cell block, performing a soft program operation on the erased memory cells by supplying a soft program pulse to word lines of the selected cell block, performing a first verify operation using a first voltage level lower than a target voltage level of the soft program operation, performing a second verify operation using the target voltage level, setting voltages of bit lines, and repeating the soft program operation, the first verify operation, the second verify operation, and an operation of setting the voltages of bit lines while raising the soft program pulse gradually. | 06-21-2012 |
20120163093 | NONVOLATILE MEMORY DEVICE AND PROGRAM METHOD THEREOF - A programming method of a nonvolatile memory device includes inputting even data and odd data to be programmed into even memory cells coupled to even bit lines and odd memory cells coupled to odd bit lines, respectively, setting a sense signal as a first sense signal or a second sense signal having a lower voltage level than the first sense signal, based on odd data of odd memory cells adjacent to each of the even memory cells to be programmed, programming the even data into the even memory cells by supplying a program voltage, performing a program verify operation on each of the even memory cells in response to the set sense signal, and programming the odd data into the odd memory cells by supplying a program voltage. | 06-28-2012 |
20120170371 | PROGRAMMING METHOD OF NON-VOLATILE MEMORY DEVICE - A programming method of a non-volatile memory device that includes a string of memory cells with a plurality of floating gates and a plurality of control gates disposed alternately, wherein each of the memory cells includes one floating gate and two control gates disposed adjacent to the floating gate and two neighboring memory cells share one control gate. The programming method includes applying a first program voltage to a first control gate of a selected memory cell and a second program voltage that is higher than the first program voltage to a second control gate of the selected memory cell, and applying a first pass voltage to a third control gate disposed adjacent to the first control gate and a second pass voltage that is lower than the first pass voltage to a fourth control gate disposed adjacent to the second control gate. | 07-05-2012 |
20120170378 | READ METHODS OF SEMICONDUCTOR MEMORY DEVICE - A read method of a semiconductor memory device includes performing a read operation on target cells by using a first read voltage, terminating the read operation on the target cells if, as a result of the read operation on the target cells, error correction is feasible, performing a read operation on first cells next to the target cells along a first direction if, as a result of the read operation on the target cells, error correction is unfeasible, performing the read operation again on the target cells by selecting one of a plurality of read voltages in response to a result of the read operation on the first cells and by using the selected read voltage for reading data of the target cells, and terminating the read operation on the target cells if error correction is feasible. | 07-05-2012 |
20120213009 | NONVOLATILE MEMORY DEVICE AND OPERATING METHOD THEREOF - A nonvolatile memory device includes a channel vertically extending from a substrate, a plurality of memory cells stacked along the channel; a source region connected to a first end portion of the channel, and a bit line connected to a second end portion of the channel, wherein the first end portion of the channel that adjoins the source region is formed as an undoped semiconductor layer or a semiconductor layer doped with P-type impurities. | 08-23-2012 |
20120241840 | NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME - A nonvolatile memory device includes a substrate having active regions that are defined by an isolation layer and that have first sidewalls extending upward from the isolation layer, floating gates adjoining the first sidewalls of the active regions with a tunnel dielectric layer interposed between the active regions and the floating gates and extending upward from the substrate, an intergate dielectric layer disposed over the floating gates, and control gates disposed over the intergate dielectric layer. | 09-27-2012 |
20120307565 | METHOD FOR OPERATING NON-VOLATILE MEMORY DEVICE - A method for operating a non-volatile memory device includes performing an erase operation onto a memory block including a plurality of memory cells, and performing a first soft program operation onto all the memory cells of a string, after the erase operation, grouping word lines of the string into a plurality of word line groups, and performing a second soft program operation onto memory cells coupled with the word lines of each word line group. | 12-06-2012 |
20130128660 | READING METHOD OF NON-VOLATILE MEMORY DEVICE - A reading method of a non-volatile memory device that includes a plurality memory cells that each include one floating gate and two control gates disposed adjacent to the floating gate on two alternate sides of the floating gate, respectively, and two adjacent memory cells share one control gate, the reading method comprising applying a read voltage to control gates of a selected memory cell, applying a second pass voltage to alternate control gates of the memory cells different from the control gates of the selected memory cells starting from the control gates next to the selected memory cell, and applying a first pass voltage that is lower than the second pass voltage to alternate the control gates of the memory cells different from the control gates of the selected memory cells starting from the control gates secondly next to the selected memory cell. | 05-23-2013 |
20130182504 | PAGE BUFFER CIRCUIT AND NONVOLATILE MEMORY DEVICE HAVING THE SAME - A page buffer circuit includes first and second bit lines coupled to a first sensing circuit and with a first space therebetween, and third and fourth bit lines coupled to a second sensing circuit and with the first space therebetween. The second bit line and the third bit line are adjacent to each other with a second space therebetween, and the second space is smaller than the first space. | 07-18-2013 |
20130292757 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes vertical channel layers, control gates and interlayer insulating layers stacked alternately with each other on the substrate and surrounding the vertical channel layers, floating gates interposed between the vertical channel layers and the control gates and separated from each other by the interlayer insulating layers, and charge blocking layers interposed between the floating gates and the control gates. | 11-07-2013 |
20140185387 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF OPERATING THE SAME - A method of operating a semiconductor memory device includes performing a first program operation in order to raise threshold voltages of memory cells, performing a program verification operation for detecting fast program memory cells, each having a threshold voltage risen higher than a first sub-verification voltage from a second sub-verification voltage or lower, by using a target verification voltage and the first sub-verification voltage and the second sub-verification voltage which are sequentially lower than the target verification voltage, and performing a second program operation under a condition that an increment of each of threshold voltages of memory cells, which is lower than the target verification voltage, is greater than an increment of the threshold voltage of each of the fast program memory cells. | 07-03-2014 |
20150023103 | SEMICONDUCTOR DEVICE AND METHOD OF OPERATING THE SAME - A semiconductor device includes first memory blocks arranged in a longitudinal direction, and including a plurality of strings, wherein the strings are formed along a vertical direction, and the strings adjacent to each other share bit lines or source lines with each other, each string including a drain selection transistor coupled to an odd drain selection line or an even drain selection line, memory cells coupled to word lines, and a source selection transistor coupled to an odd source selection line or an even source selection line, page buffers suitable for storing data, a selection switch unit suitable for transferring the data stored in the page buffers or various voltages supplied from an external source to the bit lines and the source lines; and a control circuit suitable for controlling the page buffers and the selection switch unit. | 01-22-2015 |
20150099354 | SEMICONDUCTOR DEVICE - A semiconductor device includes vertical channel layers, control gates and interlayer insulating layers stacked alternately with each other on the substrate and surrounding the vertical channel layers, floating gates interposed between the vertical channel layers and the control gates and separated from each other by the interlayer insulating layers, and charge blocking layers interposed between the floating gates and the control gates. | 04-09-2015 |
20150104924 | NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME - A nonvolatile memory device includes a substrate having active regions that are defined by an isolation layer and that have first sidewalls extending upward from the isolation layer, floating gates adjoining the first sidewalls of the active regions with a tunnel dielectric layer interposed between the active regions and the floating gates and extending upward from the substrate, an intergate dielectric layer disposed over the floating gates, and control gates disposed over the intergate dielectric layer. | 04-16-2015 |
20150206591 | NONVOLATILE MEMORY DEVICE AND OPERATING METHOD THEREOF - A nonvolatile memory device includes a channel vertically extending from a substrate, a plurality of memory cells stacked along the channel; a source region connected to a first end portion of the channel, and a bit line connected to a second end portion of the channel, wherein the first end portion of the channel that adjoins the source region is formed as an undoped semiconductor layer or a semiconductor layer doped with P-type impurities. | 07-23-2015 |
Patent application number | Description | Published |
20080251834 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE AND ITS MANUFACTURING METHOD - In a non-volatile semiconductor memory device and a method for manufacturing the device, each memory cell and its select Tr have the same gate insulating film as a Vcc Tr. Further, the gate electrodes of a Vpp Tr and Vcc Tr are realized by the use of a first polysilicon layer. A material such as salicide or a metal, which differs from second polysilicon (which forms a control gate layer), may be provided on the first polysilicon layer. With the above features, a non-volatile semiconductor memory device can be manufactured by reduced steps and be operated at high speed in a reliable manner. | 10-16-2008 |
20090029540 | NONVOLATILE SEMICONDUCTOR MEMORY AND MANUFACTURING METHOD THEREOF - A method for manufacturing a nonvolatile semiconductor memory device including: forming a first and a second stacked gate structures, each of which including a first polysilicon layer formed on a silicon substrate via a gate insulator, an inter-gate insulator formed on the first polysilicon layer, a second polysilicon layer formed on the inter-gate insulator, and a cap layer formed on the second polysilicon layer, respectively; forming a interlayer insulator between the first and the second stacked gate structures, the interlayer insulator covering upper surfaces of the cap layer; planarizing the interlayer insulator by using the cap layers as a stopper; removing the cap layers so that the second polysilicon layers are exposed; masking the exposed second polysilicon layer of the first stacked gate structure by a photoresist film; removing the second polysilicon layer and the inter-gate insulator of the second stacked gate structure so that the first polysilicon layer of the second stacked gate structure is exposed; removing the photoresist film so that the second polysilicon of the first stacked gate structure is exposed; and forming conductive material layers, including a metal, on the exposed first polysilicon layer of the second stacked gate structure and the exposed second polysilicon layer of the first stacked gate structure. | 01-29-2009 |
20100309722 | SEMICONDUCTOR MEMORY DEVICE CAPABLE OF REALIZING A CHIP WITH HIGH OPERATION RELIABILITY AND HIGH YIELD - A semiconductor memory device capable of preventing a defect caused by lowering the etching precision in an end area of the memory cell array is provided. A first block is constructed by first memory cell units each having of memory cells, a second block is constructed by second memory cell units each having a plurality of memory cells, and the memory cell array is constructed by arranging the first blocks on both end portions thereof and arranging the second blocks on other portions thereof. The structure of the first memory cell unit on the end side of the memory cell array is different from that of the second memory cell unit. Wirings for connecting the selection gate lines of the memory cell array to corresponding transistors in a row decoder are formed of wiring layers formed above wirings for connecting control gate lines of the memory cell array to the transistors in the row decoder. | 12-09-2010 |
20100309723 | SEMICONDUCTOR MEMORY DEVICE CAPABLE OF REALIZING A CHIP WITH HIGH OPERATION RELIABILITY AND HIGH YIELD - A semiconductor memory device capable of preventing a defect caused by lowering the etching precision in an end area of the memory cell array is provided. A first block is constructed by first memory cell units each having of memory cells, a second block is constructed by second memory cell units each having a plurality of memory cells, and the memory cell array is constructed by arranging the first blocks on both end portions thereof and arranging the second blocks on other portions thereof. The structure of the first memory cell unit on the end side of the memory cell array is different from that of the second memory cell unit. Wirings for connecting the selection gate lines of the memory cell array to corresponding transistors in a row decoder are formed of wiring layers formed above wirings for connecting control gate lines of the memory cell array to the transistors in the row decoder. | 12-09-2010 |
20110108906 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE AND ITS MANUFACTURING METHOD - In a non-volatile semiconductor memory device and a method for manufacturing the device, each memory cell and its select Tr have the same gate insulating film as a Vcc Tr. Further, the gate electrodes of a Vpp Tr and Vcc Tr are realized by the use of a first polysilicon layer. A material such as salicide or a metal, which differs from second polysilicon (which forms a control gate layer), may be provided on the first polysilicon layer. With the above features, a non-volatile semiconductor memory device can be manufactured by reduced steps and be operated at high speed in a reliable manner. | 05-12-2011 |
20110134700 | Nonvolatile Semiconductor Memory - A select gate transistor has a select gate electrode composed of a first-level conductive layer and a second-level conductive layer. The first-level conductive layer has contact areas. The second-level conductive layer has its portions removed that are located above the contact areas. Two adjacent select gate electrodes that are adjacent to each other in the column direction are arranged such that the contact areas of one select gate electrode are not opposed to the contact areas of the other select gate electrode. One select gate electrode has its first- and second-level conductive layers removed in their portions that are opposed to the contact areas of the other select gate electrode. | 06-09-2011 |
20120075903 | Nonvolatile Semiconductor Memory - A select gate transistor has a select gate electrode composed of a first-level conductive layer and a second-level conductive layer. The first-level conductive layer has contact areas. The second-level conductive layer has its portions removed that are located above the contact areas. Two adjacent select gate electrodes that are adjacent to each other in the column direction are arranged such that the contact areas of one select gate electrode are not opposed to the contact areas of the other select gate electrode. One select gate electrode has its first- and second-level conductive layers removed in their portions that are opposed to the contact areas of the other select gate electrode. | 03-29-2012 |
20120314497 | SEMICONDUCTOR MEMORY DEVICE CAPABLE OF REALIZING A CHIP WITH HIGH OPERATION RELIABILITY AND HIGH YIELD - A semiconductor memory device capable of preventing a defect caused by lowering the etching precision in an end area of the memory cell array is provided. A first block is constructed by first memory cell units each having of memory cells, a second block is constructed by second memory cell units each having memory cells, and the memory cell array is constructed by arranging the first blocks on both end portions thereof and arranging the second blocks on other portions thereof. The structure of the first memory cell unit on the end side of the memory cell array is different from the second memory cell unit. Wirings for connecting the selection gate lines of the memory cell array to corresponding transistors in a row decoder are formed of wiring layers formed above wirings for connecting control gate lines of the memory cell array to the transistors in the row decoder. | 12-13-2012 |
20140183617 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE AND ITS MANUFACTURING METHOD - In a non-volatile semiconductor memory device and a method for manufacturing the device, each memory cell and its select Tr have the same gate insulating film as a Vcc Tr. Further, the gate electrodes of a Vpp Tr and Vcc Tr are realized by the use of a first polysilicon layer. A material such as salicide or a metal, which differs from second polysilicon (which forms a control gate layer), may be provided on the first polysilicon layer. With the above features, a non-volatile semiconductor memory device can be manufactured by reduced steps and be operated at high speed in a reliable manner. | 07-03-2014 |
Patent application number | Description | Published |
20090135654 | MEMORY READ METHODS, APPARATUS, AND SYSTEMS - Some embodiments include first memory cells and a first line used to access the first memory cells, second memory cells and at least one second line used to access the second memory cells. The first and second memory cells have a number of threshold voltage values corresponding to a number of states. The states represent values of information stored in the memory cells. During a read operation to read the first memory cells, a first voltage may be applied to the first line and a second voltage may be applied to the second line. At least one of the first and second voltages may include a value based on a change of at least one of the threshold voltage values changing from a first value to a second value. The first and second values may correspond to a unique state selected from all of the states. Other embodiments including additional apparatus, systems, and methods are disclosed. | 05-28-2009 |
20090147572 | METHOD, APPARATUS, AND SYSTEM FOR ERASING MEMORY - Methods, apparatus, and systems may operated such as to perform a pre-programming operation on a plurality of multiple level memory cells of a memory device. One such pre-programming operation involves applying a series of voltage pulses to the plurality of multiple level memory cells, verifying a charge stored in the plurality of multiple level memory cells, and erasing the plurality of multiple level memory cells of the memory block based on a result from verifying the charge stored in the plurality of multiple level memory cells. | 06-11-2009 |
20090147582 | Adjusting program and erase voltages in a memory device - There is provided a method and apparatus for adjusting threshold program and erase voltages in a memory array, such as a floating gate memory array, for example. One such method includes applying a first voltage level to a first edge word line of a memory block string and applying a second voltage level to a second edge word line of the memory block string. Such a method might also include applying a third voltage level to non-edge word lines of the memory block string. | 06-11-2009 |
20090147588 | MEMORY DEVICES HAVING REDUCED WORD LINE CURRENT AND METHOD OF OPERATING AND MANUFACTURING THE SAME - There is provided a memory array and methods for manufacturing the same. In one embodiment, there is provided a string comprising a plurality of transistors. Each of the plurality of transistors includes: a charge storage node, a control gate, and at least one resistive element coupled to the string. The control gate of at least one of the plurality of transistors can be selectively coupled to a reference potential via a corresponding one of the at least one resistive element. | 06-11-2009 |
20090231923 | REDUCTION OF PUNCH-THROUGH DISTURB DURING PROGRAMMING OF A MEMORY DEVICE - In one or more of the disclosed embodiments, a punch-through disturb effect in a memory device can be reduced by biasing a selected word line at a program voltage to program a selected memory cell, biasing word lines on the drain side of the series string with a V | 09-17-2009 |
20100271877 | METHOD, APPARATUS, AND SYSTEM FOR ERASING MEMORY - Methods, apparatus, and systems may operate to perform a pre-programming operation on a plurality of multiple level memory cells of a memory device. An example of applying such a pre-programming operation involves applying a series of voltage pulses to the plurality of multiple level memory cells, verifying a charge stored in the plurality of multiple level memory cells, and erasing the plurality of multiple level memory cells of the memory block based on a result from verifying the charge stored in the plurality of multiple level memory cells. | 10-28-2010 |
20100309728 | MEMORY READ METHODS, APPARATUS, AND SYSTEMS - Some embodiments include first memory cells and a first line used to access the first memory cells, second memory cells and at least one second line used to access the second memory cells. The first and second memory cells have a number of threshold voltage values corresponding to a number of states. The states represent values of information stored in the memory cells. During a read operation to read the first memory cells, a first voltage may be applied to the first line and a second voltage may be applied to the second line. At least one of the first and second voltages may include a value based on a change of at least one of the threshold voltage values changing from a first value to a second value. The first and second values may correspond to a unique state selected from all of the states. Other embodiments including additional apparatus, systems, and methods are disclosed. | 12-09-2010 |
20110228607 | ADJUSTING PROGRAM AND ERASE VOLTAGES IN A MEMORY DEVICE - A system and apparatus for adjusting threshold program and erase voltages in a memory array, such as a floating gate memory array, for example. One such method includes applying a first voltage level to a first edge word line of a memory block string and applying a second voltage level to a second edge word line of the memory block string. Such a method might also include applying a third voltage level to non-edge word lines of the memory block string. | 09-22-2011 |
20110317491 | MEMORY READ METHODS, APPARATUS, AND SYSTEMS - Some embodiments include first memory cells and a first line used to access the first memory cells, second memory cells and at least one second line used to access the second memory cells. The first and second memory cells have a number of threshold voltage values corresponding to a number of states. The states represent values of information stored in the memory cells. During a read operation to read the first memory cells, a first voltage may be applied to the first line and a second voltage may be applied to the second line. At least one of the first and second voltages may include a value based on a change of at least one of the threshold voltage values changing from a first value to a second value. The first and second values may correspond to a unique state selected from all of the states. Other embodiments including additional apparatus, systems, and methods are disclosed. | 12-29-2011 |
20130272064 | METHOD, APPARATUS, AND SYSTEM FOR IMPROVED READ OPERATION IN MEMORY - Various embodiments include methods, apparatus, and systems for reading an adjacent cell of a memory array in an electronic device to determine a threshold voltage value of the adjacent cell, the adjacent cell being adjacent a target cell, and reading the target cell of the memory array using a wordline voltage value based on the threshold voltage value of the adjacent cell. Additional apparatus, systems, and methods are described. | 10-17-2013 |
20140119121 | ADJUSTING PROGRAM AND ERASE VOLTAGES IN A MEMORY DEVICE - A system and apparatus for adjusting threshold program and erase voltages in a memory array, such as a floating gate memory array, for example. One such method includes applying a first voltage level to a first edge word line of a memory block string and applying a second voltage level to a second edge word line of the memory block string. Such a method might also include applying a third voltage level to non-edge word lines of the memory block string. | 05-01-2014 |
Patent application number | Description | Published |
20130010547 | SEMICONDUCTOR DEVICE AND METHODS OF OPERATING THE SAME - A method of operating a semiconductor device includes programming selected memory cells by supplying a selected word line with a program voltage which increases and supplying the remaining unselected word lines with a first pass voltage which is substantially constant; and programming the selected memory cells while supplying first unselected word lines adjacent to the selected word line with a second pass voltage increasing in proportion to the program voltage, when a difference between the program voltage and the first pass voltage reaches a critical voltage difference. | 01-10-2013 |
20130010549 | METHODS OF OPERATING SEMICONDUCTOR DEVICE - A method of operating a semiconductor device according to an embodiment of the present invention includes programming selected memory cells by applying a first program voltage, which gradually rises, to a selected word line and applying a first pass voltage, which is constant, to remaining unselected word lines; and programming the selected memory cells while applying a second program voltage, which is constant, to the selected word line and applying a second pass voltage, which gradually rises, to first unselected word lines adjacent to the selected word line, when a difference between the first program voltage and the first pass voltage reaches a critical voltage difference. | 01-10-2013 |
20130107602 | 3-D NONVOLATILE MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME | 05-02-2013 |
20140189257 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes stacked memory strings in which at least some adjacent memory strings share a common source line. During a read operation for a selected memory string, a first current path is formed from a bit line of the selected memory string to the common source line through the selected memory string. A second current path is formed from the bit line of the selected memory string, through the common source line, to a bit line of an adjacent unselected memory string. This reduced path resistance enhances device reliability in read mode. | 07-03-2014 |
20140189258 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a memory array including memory blocks stacked in a plurality of layers over a substrate, first lines coupling word lines of memory blocks arranged in even-numbered layers, and second lines coupling word lines of memory blocks arranged in odd-numbered layers. | 07-03-2014 |
20140192584 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first memory block including first vertical strings, a second memory block including second vertical strings coupled in series with the first vertical strings, wherein the second memory block is stacked on the first memory block, first bit lines located between the first memory block and the second memory block and electrically coupled to the first and second vertical strings, first source lines located under the first memory block and electrically coupled to the first vertical strings, and second source lines located above the second memory block and electrically coupled to the second vertical strings. | 07-10-2014 |
20140369131 | METHOD OF OPERATING SEMICONDUCTOR DEVICE - A semiconductor device is operated by, inter alia: programming selected memory cells by applying a first program voltage which is increased by a first step voltage to a selected word line and by applying a first pass voltage having a constant level to unselected word lines, and when a voltage difference between the first program voltage and the first pass voltage reaches a predetermined voltage difference, programming the selected memory cells by applying a second program voltage which is increased by a second step voltage lower than the first step voltage to the selected word line and by applying a second pass voltage which is increased in proportion to the second program voltage to first unselected word lines adjacent to the selected word line among the unselected word lines. | 12-18-2014 |
20150162341 | NON-VOLATILE MEMORY DEVICE HAVING INCREASED MEMORY CAPACITY - A non-volatile memory device according to an embodiment of the present invention includes a first memory layer including a plurality of memory cells stacked between a first conductive line and a second conductive line over a semiconductor substrate. In addition, a second memory layer including the plurality of memory cells stacked between the second conductive line and a third conductive line. Further, the second memory layer is extended over the page buffer and the peripheral circuit sequentially arranged from the first memory layer. | 06-11-2015 |
20150187422 | SEMICONDUCTOR DEVICE - A semiconductor device includes first memory strings coupled between a first common source line formed on a substrate and bit lines formed over the first common source line, and second memory strings coupled between the bit lines and a second common source line formed over the bit lines, wherein each of the bit lines includes a stacked structure of a conductive layer and a silicon layer formed on the conductive layer. | 07-02-2015 |
20150221379 | SEMICONDUCTOR SYSTEM AND METHOD OF OPERATING THE SAME - A semiconductor system includes a data storage unit including memory blocks, a circuit group and a control circuit, wherein the memory blocks store data therein and are arranged in a longitudinal direction and a vertical direction. The circuit group is suitable for performing a program, read or erase operation on the memory blocks, and the control circuit controls the circuit group. A memory control unit is suitable for controlling the data storage unit, wherein each of the memory blocks includes a plurality of sub-memory blocks. The sub-memory blocks arranged in the longitudinal direction share bit lines and do not share word lines and source lines. Further, the sub-memory arranged in the vertical direction share the bit lines or the source lines. | 08-06-2015 |