Patent application number | Description | Published |
20110314200 | BALANCED ON-DIE TERMINATION - Termination of a high-speed signaling link is effected by simultaneously engaging on-die termination structures within multiple integrated-circuit memory devices disposed on the same memory module, and/or within the same integrated-circuit package, and coupled to the high-speed signaling link. | 12-22-2011 |
20130194881 | AREA-EFFICIENT MULTI-MODAL SIGNALING INTERFACE - One or more pins may be modally assigned to either the command/address (C/A) or data (DQ) blocks of a uniform-package, multi-modal PHY (physical signaling interface) of a memory controller, thus enabling those pins to be used as C/A pins when the PHY is connected to some memory types, and as DQ pins when the PHY is connected to other memory types. | 08-01-2013 |
20130320560 | DISTRIBUTED ON-CHIP DECOUPLING APPARATUS AND METHOD USING PACKAGE INTERCONNECT - An integrated circuit device is disclosed. The integrated circuit device includes a semiconductor die fabricated by a front-end semiconductor process and having oppositely disposed planar surfaces. The semiconductor die is formed with semiconductor devices, power supply circuitry coupled to the semiconductor devices, decoupling capacitance circuitry, and through-vias. The through-vias include a first group of vias coupled to the power supply circuitry and a second group of vias coupled to the decoupling capacitance circuitry. Conductors are formed in a first metal layer disposed on the semiconductor die in accordance with a back-end semiconductor process. The conductors are configured to couple to the first and second groups of through-vias to establish conductive paths from the power supply circuitry to the decoupling capacitance circuitry. | 12-05-2013 |
20150221589 | DISTRIBUTED ON-CHIP DECOUPLING APPARATUS AND METHOD USING PACKAGE INTERCONNECT - An integrated circuit device is disclosed. The integrated circuit device includes a semiconductor die fabricated by a front-end semiconductor process and having oppositely disposed planar surfaces. The semiconductor die is formed with semiconductor devices, power supply circuitry coupled to the semiconductor devices, decoupling capacitance circuitry, and through-vias. The through-vias include a first group of vias coupled to the power supply circuitry and a second group of vias coupled to the decoupling capacitance circuitry. Conductors are formed in a first metal layer disposed on the semiconductor die in accordance with a back-end semiconductor process. The conductors are configured to couple to the first and second groups of through-vias to establish conductive paths from the power supply circuitry to the decoupling capacitance circuitry. | 08-06-2015 |
Patent application number | Description | Published |
20130194854 | MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DATA INTERFACES - A memory device comprising a programmable command-and-address (CA) interface and/or a programmable data interface is described. In an operational mode, two or more CA interfaces may be active. In another operational mode, at least one, but not all, CA interfaces may be active. In an operational mode, all of the data interfaces may be active. In another operational mode, at least one, but not all, data interfaces may be active. The memory device can include circuitry to select: an operational mode; a sub-mode within an operational mode; one or more CA interfaces as the active CA interface(s); a main CA interface from multiple active CA interfaces; and/or one or more data interfaces as the active data interfaces. The circuitry may perform these selection(s) based on one or more bits in one or more registers and/or one or more signals received on one or more pins. | 08-01-2013 |
20140043069 | POWER SAVING DRIVER DESIGN - In an asymmetrically terminated communication system, the power consumed to transmit a particular bit value is adjusted based on whether the bit being output is the second, third, fourth, etc. consecutive bit with the same value after a transition to output the particular bit value. The adjustment of the power consumed to transmit the two or more consecutive bits with the same value may be made by adjusting the driver strength during the second, or subsequent, consecutive bits with the same value. The adjustment of the power consumed is performed on the bit value that consumes the most DC power and the other value is typically not adjusted. | 02-13-2014 |
20140237152 | Folded Memory Modules - A memory module comprises a data interface including a plurality of data lines and a plurality of configurable switches coupled between the data interface and a data path to one or more memories. The effective width of the memory module can be configured by enabling or disabling different subsets of the configurable switches. The configurable switches may be controlled by manual switches, by a buffer on the memory module, by an external memory controller, or by the memories on the memory module. | 08-21-2014 |
20150108656 | STACKED DIE PACKAGE - Disclosed is a package-on-package (PoP) assembly comprises a two-tiered windowed ball grid array (BGA) and a system on a chip (SoC) package. Window openings in the two tiers of the BGA are of different sizes to allow for wirebond landing pads on the first tier. A DRAM die is mounted to the BGA flipped over (i.e., wirebond pads facing the BGA package.) The DRAM die is wirebonded through the window in the BGA. For multi-channel systems and higher memory capacity, the DRAM die will have low-cost through-silicon vias (TSVs) that connect to stacked DRAM die(s). The stacked DRAM dies may be offset or rotated to align active TSVs with passive TSVs thereby enabling unique connections to certain DRAM dies in the stack. | 04-23-2015 |
20150181746 | CIRCUIT BOARD ASSEMBLY CONFIGURATION - A rack unit configuration is described that includes a first printed circuit board (PCB) assembly interleaved with a second PCB assembly that is inverted with respect to the first PCB assembly. The configuration of the first PCB assembly and the second PCB assembly allow for increased component and power densities within computing systems, memory systems, etc. The increased density may be achieved while allowing sufficient mechanical clearance to allow easy component replacement and servicing (e.g., and hot pluggability). Power density may also be increased with PCB assemblies including nested and interleaved power modules. | 06-25-2015 |
20150332746 | MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DATA INTERFACES - A memory device comprising a programmable command-and-address (CA) interface and/or a programmable data interface is described. In an operational mode, two or more CA interfaces may be active. In another operational mode, at least one, but not all, CA interfaces may be active. In an operational mode, all of the data interfaces may be active. In another operational mode, at least one, but not all, data interfaces may be active. The memory device can include circuitry to select: an operational mode; a sub-mode within an operational mode; one or more CA interfaces as the active CA interface(s); a main CA interface from multiple active CA interfaces; and/or one or more data interfaces as the active data interfaces. The circuitry may perform these selection(s) based on one or more bits in one or more registers and/or one or more signals received on one or more pins. | 11-19-2015 |
Patent application number | Description | Published |
20110080985 | Synchronization Distribution in Microwave Backhaul Networks - In some embodiments, a system comprises a clock, a root node, a radio channel network, and first and second child nodes. The clock may be configured to generate a clock signal. The root node may be configured to generate a first frame including a first payload and a first overhead and generate a second frame including a second payload and a second overhead. The first and second overheads may comprise a synchronization value based on the clock signal. The radio channel network may be in communication with the root node for transmitting the first and second frames. Each first and second child nodes may be configured to perform clock recovery including frequency synchronization using the synchronization value and a respective phase-lock loop. | 04-07-2011 |
20130100967 | Systems and Methods for Synchronization of Clock Signals - A terminal of an exemplary transmitting device is configured to receive an initial clock signal. A first phase lock loop is configured to lock a phase of an initial periodic signal with a phase of the initial clock signal. A transmitting data block interface is configured to provide the plurality of data blocks with samples of the initial periodic signal to a receiving device. An exemplary receiving device includes a receiving data block interface configured to receive the plurality of data blocks. A second phase lock loop is configured to recreate the initial periodic signal and lock a phase of the recreated periodic signal with a phase of the samples of the initial periodic signal. The clock signal generator is configured to recreate and provide the initial clock signal. The recreated clock signal is synchronized to the initial clock signal based on the phase of the recreated periodic signal. | 04-25-2013 |
20140086375 | SYNCHRONIZATION DISTRIBUTION IN MICROWAVE BACKHAUL NETWORKS - In some embodiments, a system comprises a clock, a root node, a radio channel network, and first and second child nodes. The clock may be configured to generate a clock signal. The root node may be configured to generate a first frame including a first payload and a first overhead and generate a second frame including a second payload and a second overhead. The first and second overheads may comprise a synchronization value based on the clock signal. The radio channel network may be in communication with the root node for transmitting the first and second frames. Each first and second child nodes may be configured to perform clock recovery including frequency synchronization using the synchronization value and a respective phase-lock loop. | 03-27-2014 |
20150156741 | SYNCHRONIZATION DISTRIBUTION IN MICROWAVE BACKHAUL NETWORKS - In some embodiments, a system comprises a clock, a root node, a radio channel network, and first and second child nodes. The clock may be configured to generate a clock signal. The root node may be configured to generate a first frame including a first payload and a first overhead and generate a second frame including a second payload and a second overhead. The first and second overheads may comprise a synchronization value based on the clock signal. The radio channel network may be in communication with the root node for transmitting the first and second frames. Each first and second child nodes may be configured to perform clock recovery including frequency synchronization using the synchronization value and a respective phase-lock loop. | 06-04-2015 |
20150180600 | SYSTEMS AND METHODS FOR SYNCHRONIZATION OF CLOCK SIGNALS - A system may include a transmitting device. The transmitting device may include one or more terminals for receiving a data signal and a first clock signal. A first phase lock loop may lock a phase of an initial periodic signal with a phase of the first clock signal, the first phase lock loop including a divider to generate the initial periodic signal based on the first clock signal. A decimation module may sample the initial periodic signal at a decimated rate of a backplane clock, the backplane clock being asynchronous with a clock that generated the first clock signal. A transmitting data block interface may construct data blocks and provide the data blocks to a receiving device, each of one or more of the data blocks including a portion of the data signal and at least one sample of the initial periodic signal. | 06-25-2015 |