Patent application number | Description | Published |
20080197171 | BOND HEAD LINK ASSEMBLY FOR A WIRE BONDING MACHINE - A bond head assembly for use with a bonding machine includes a wire bonding tool and a link mechanism coupled between the wire bonding tool and the wire bonding machine. The link mechanism includes a frame, a plurality of arm links pivotably connected to the frame, and a tool support member supporting the wire bonding tool and pivotably connected to each of the arm links. | 08-21-2008 |
20090250503 | Z-AXIS MOTION SYSTEM FOR A WIRE BONDING MACHINE - A coil assembly configured to provide motion of a bonding tool of a wire bonding machine along a substantially vertical axis is provided. The coil assembly includes a first coil portion having a first force constant, the first coil portion being configured to receive energy to provide a first motion of the bonding tool. The coil assembly also includes a second coil portion having a second force constant, the second coil portion being configured to receive energy to provide a second motion of the bonding tool, the second force constant being different from the first force constant. | 10-08-2009 |
20110114703 | Z-AXIS MOTION SYSTEM FOR A WIRE BONDING MACHINE - A coil assembly configured to provide motion of a bonding tool of a wire bonding machine along a substantially vertical axis is provided. The coil assembly includes a first coil portion having a first force constant, the first coil portion being configured to receive energy to provide a first motion of the bonding tool. The coil assembly also includes a second coil portion having a second force constant, the second coil portion being configured to receive energy to provide a second motion of the bonding tool, the second force constant being different from the first force constant. | 05-19-2011 |
20110121053 | Z-AXIS MOTION SYSTEM FOR A WIRE BONDING MACHINE - A coil assembly configured to provide motion of a bonding tool of a wire bonding machine along a substantially vertical axis is provided. The coil assembly includes a first coil portion having a first force constant, the first coil portion being configured to receive energy to provide a first motion of the bonding tool. The coil assembly also includes a second coil portion having a second force constant, the second coil portion being configured to receive energy to provide a second motion of the bonding tool, the second force constant being different from the first force constant. | 05-26-2011 |
20150155254 | SYSTEMS AND METHODS FOR DETERMINING AND ADJUSTING A LEVEL OF PARALLELISM RELATED TO BONDING OF SEMICONDUCTOR ELEMENTS - A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure configured to support a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; and a calibration tool including a contact portion configured to be positioned between the bonding tool and the support structure, the contact portion configured to be contacted by each of the bonding tool and the support structure simultaneously during a calibration operation. | 06-04-2015 |
20150287693 | BOND HEADS FOR THERMOCOMPRESSION BONDERS, THERMOCOMPRESSION BONDERS, AND METHODS OF OPERATING THE SAME - A bond head for a thermocompression bonder is provided. The bond head includes a tool configured to hold a workpiece to be bonded, a heater configured to heat the workpiece to be bonded, and a chamber proximate the heater. The chamber is configured to receive a cooling fluid for cooling the heater. | 10-08-2015 |
20150380380 | SYSTEMS AND METHODS FOR DETERMINING AND ADJUSTING A LEVEL OF PARALLELISM RELATED TO BONDING OF SEMICONDUCTOR ELEMENTS - A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure configured to support a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; and a calibration tool including a contact portion configured to be positioned between the bonding tool and the support structure, the contact portion configured to be contacted by each of the bonding tool and the support structure simultaneously during a calibration operation. | 12-31-2015 |