Patent application number | Description | Published |
20080242539 | Phenol Compound, Reversible Thermosensitive Recording Medium, Reversible Thermosensitive Recording Label, Reversible Thermosensitive Recording Member, Image-Processing Apparatus and Image-Processing Method - The present invention provides a reversible thermosensitive recording medium including a support and a thermosensitive recording layer thereon, in which the thermosensitive recording layer contains an electron-donating coloring compound and an electron-accepting compound, and the thermosensitive recording layer is capable of forming a relatively developed condition and a relatively erased condition depending on at least one of the difference of heating temperatures and the difference of cooling rates following to heating, and in which the electron-accepting compound contains a phenol compound expressed by General Formula (1): | 10-02-2008 |
20100219405 | NOVEL ARYLAMINE POLYMER, METHOD FOR PRODUCING THE SAME, INK COMPOSITION, FILM, ELECTRONIC DEVICE, ORGANIC THIN-FILM TRANSISTOR, AND DISPLAY DEVICE - A polymer containing a repeating unit expressed by General Formula (I): General Formula (I) where Ar1 represents a substituted or unsubstituted aromatic hydrocarbon group; Ar2 and Ar3 each independently represent a divalent group of a substituted or unsubstituted aromatic hydrocarbon group; and R1 and R2 each independently represent a hydrogen atom, substituted or unsubstituted alkyl group, or substituted or unsubstituted aromatic hydrocarbon group. | 09-02-2010 |
20110040107 | [1]BENZOTHIENO[3,2-B][1]BENZOTHIOPHENE COMPOUND AND METHOD FOR PRODUCING THE SAME, AND ORGANIC ELECTRONIC DEVICE USING THE SAME - A [1]benzothieno[3,2-b][1]benzothiophene compound expressed by General Formula (I): General Formula (I) where X and Y are each independently a hydrogen atom; a halogen atom; or a functional group having a straight or branched aliphatic alkyl group optionally having a halogen atom, a functional group having an alicyclic alkyl group optionally having a halogen atom, a functional group having a straight or branched aliphatic alkenyl group optionally having a halogen atom, a functional group having an alicyclic alkenyl group optionally having a halogen atom, a functional group having a carboxyl group, or a functional group having a thiol group, as a partial structure; and X and Y are the same or each independently different, provided that at least one of X and Y has a straight or branched aliphatic alkenyl group, an alicyclic alkenyl group, a carboxyl group or a thiol group, as a partial structure. | 02-17-2011 |
20110109637 | PROCESSING DEVICE, PROCESSING METHOD AND COMPUTER READABLE MEDIUM - A processing device has plural processing modules executing a processing; and plural connectors each having a linking section, an associating section, and a controller. The linking section is able to link with at least one other connector at an input side or an output side. The associating section associates the connector with one of the processing modules. In accordance with a linked state, the controller controls the processing module associated by the associating section. | 05-12-2011 |
20110215306 | ORGANIC SEMICONDUCTOR ELEMENT AND ORGANIC ELECTRODE - To provide an organic semiconductor element, containing: a source electrode containing a first organic compound layer and a second organic compound layer, at least one of the layers having an organic semiconductor active region; and a drain electrode containing the first organic compound layer and the second organic compound layer, as well as providing an organic electrode, containing: a laminated film, in which a layer of a tetrathiafulvalene derivative expressed by the following general formula I and a layer of an electron accepting compound are laminated: | 09-08-2011 |
20120035364 | TETRATHIAFULVALENE DERIVATIVE, AND ORGANIC FILM AND ORGANIC TRANSISTOR USING THE SAME - A tetrathiafulvalene derivative expressed by General Formula (I): General Formula (I) in General Formula (I), X represents an atom selected from a carbon atom, a sulfur atom, and a nitrogen atom, and Xs may be the same or different; provided that when X is the carbon atom or the nitrogen atom, R | 02-09-2012 |
20120119195 | NOVEL ORGANIC SEMICONDUCTIVE MATERIAL AND ELECTRONIC DEVICE USING THE SAME - To provide an organic semiconductive material, expressed by the following general formula I: General Formula I where R | 05-17-2012 |
20120153271 | LEAVING SUBSTITUENT-CONTAINING COMPOUND, ORGANIC SEMICONDUCTOR MATERIAL, ORGANIC SEMICONDUCTOR FILM CONTAINING THE MATERIAL, ORGANIC ELECTRONIC DEVICE CONTAINING THE FILM, METHOD FOR PRODUCING FILM-LIKE PRODUCT, PI-ELECTRON CONJUGATED COMPOUND AND METHOD FOR PRODUCING THE PI-ELECTRON CONJUGATED COMPOUND - A leaving substituent-containing compound including a partial structure represented by the following General Formula (I): where a pair of X | 06-21-2012 |
20130095605 | LEAVING SUBSTITUENT-CONTAINING COMPOUND, ORGANIC SEMICONDUCTOR MATERIAL FORMED THEREFROM, ORGANIC ELECTRONIC DEVICE, ORGANIC THIN-FILM TRANSISTOR AND DISPLAY DEVICE USING THE ORGANIC SEMICONDUCTOR MATERIAL, METHOD FOR PRODUCING FILM-LIKE PRODUCT, PI-ELECTRON CONJUGATED COMPOUND AND METHOD FOR PRODUCING THE PI ELECTRON CONJUGATED COMPOUND - A leaving substituent-containing compound represented by General Formula (I), wherein the leaving substituent-containing compound can be converted to a compound represented by General Formula (Ia) and a compound represented by General Formula (II), by applying energy to the leaving substituent-containing compound, in General Formulas (I), (Ia) and (II), X and Y each represent a hydrogen atom or a leaving substituent, where one of X and Y is the leaving substituent and the other is the hydrogen atom; Q | 04-18-2013 |
20130096320 | ORGANIC SEMICONDUCTIVE MATERIAL PRECURSOR CONTAINING DITHIENOBENZODITHIOPHENE DERIVATIVE, INK, INSULATING MEMBER, CHARGE-TRANSPORTING MEMBER, AND ORGANIC ELECTRONIC DEVICE - An organic semiconductive material precursor containing a dithienobenzodithiophene derivative expressed by General Formula I: in General Formula I, X and Y represent groups bonded together, upon application of external stimulus, to form X—Y which is eliminated from the compound expressed by General Formula I; R | 04-18-2013 |
20130134360 | METHOD FOR PRODUCING ORGANIC ELECTROLUMINESCENCE ELEMENT, AND ORGANIC ELECTROLUMINESCENCE ELEMENT - A method for producing a luminescent organic film, the method including: coating a solution containing a π-electron conjugated compound precursor A-(B)m and at least one kind of a luminescent dye, where the π-electron conjugated compound precursor A-(B)m contains a leaving substituent; and applying external stimulus to the π-electron conjugated compound precursor A-(B)m to eliminate the leaving substituent thereof, so that the π-electron conjugated compound precursor A-(B)m is converted to a π-electron conjugated compound A-(C)m and an eliminated compound X—Y as in the following reaction formula (I): | 05-30-2013 |
20130225858 | ARYLAMINE COMPOUND - An arylamine compound including: a partial structure shown in formula (1-1) or (1-2), wherein either X or Y is one of leaving substituents and the other is a hydrogen atom; either (X | 08-29-2013 |
20130253131 | POLYMER, INK AND ORGANIC FILM - A polymer including: a polyaryl backbone; and an organic side-chain group including a partial structure represented by the following General Formula (I) or (II). | 09-26-2013 |
20140024841 | ORGANIC SEMICONDUCTIVE MATERIAL PRECURSOR CONTAINING DITHIENOBENZODITHIOPHENE DERIVATIVE, INK, INSULATING MEMBER, CHARGE-TRANSPORTING MEMBER, AND ORGANIC ELECTRONIC DEVICE - An ink containing an organic semiconductive material precursor containing a dithienobenzodithiophene derivative of the following formula: | 01-23-2014 |
20140163001 | HETEROCYCLIC COMPOUND - Provided is a heterocyclic compound having an RORγt inhibitory activity. A compound represented by the formula (I): | 06-12-2014 |
20140175416 | LEAVING SUBSTITUENT-CONTAINING COMPOUND, ORGANIC SEMICONDUCTOR MATERIAL, ORGANIC SEMICONDUCTOR FILM CONTAINING THE MATERIAL, ORGANIC ELECTRONIC DEVICE CONTAINING THE FILM, METHOD FOR PRODUCING FILM-LIKE PRODUCT, PI-ELECTRON CONJUGATED COMPOUND AND METHOD FOR PRODUCING THE PI-ELECTRON CONJUGATED COMPOUND - A leaving substituent-containing compound including a partial structure represented by the following General Formula (I): | 06-26-2014 |
20140187797 | LEAVING SUBSTITUENT-CONTAINING COMPOUND, ORGANIC SEMICONDUCTOR MATERIAL, ORGANIC SEMICONDUCTOR FILM CONTAINING THE MATERIAL, ORGANIC ELECTRONIC DEVICE CONTAINING THE FILM, METHOD FOR PRODUCING FILM-LIKE PRODUCT, PI-ELECTRON CONJUGATED COMPOUND AND METHOD FOR PRODUCING THE PI-ELECTRON CONJUGATED COMPOUND - A leaving substituent-containing compound including a partial structure represented by the following General Formula (I): | 07-03-2014 |
20150331295 | ELECTROCHROMIC DISPLAY ELEMENT, DISPLAY DEVICE, INFORMATION SYSTEM, AND ELECTROCHROMIC DIMMING LENS - To provide an electrochromic display element, which contains: a display substrate; a display electrode; an electrochromic layer provided in contact with the display electrode; a counter substrate provided to face the display substrate; a counter electrode; a charge retention layer provided in contact with the counter electrode; and an electrolyte layer filling between the display substrate and the counter substrate, wherein the electrochromic layer contains titanium oxide particles, and metal hydroxide is dispersed on surfaces and in inner parts of the titanium oxide particles. | 11-19-2015 |
Patent application number | Description | Published |
20080276713 | PRESSURE SENSOR PACKAGE AND ELECTRONIC PART - A pressure sensor package of the present invention includes a pressure sensor including a cavity disposed within a semiconductor substrate, wherein a region of the substrate above the cavity comprises a diaphragm section; a plurality of pressure-sensitive elements, wherein at least of portion of each pressure-sensitive element is disposed on the diaphragm section; and a plurality of conductive portions laterally spaced from the cavity and electrically connected to the pressure sensitive elements, a plurality of electrically conductive bumps arranged on the conductive portions and electrically connected to the conductive portions, wherein a total thickness D | 11-13-2008 |
20090235753 | PRESSURE SENSOR MODULE - A pressure sensor module of the invention includes a pressure sensor and a laminar substrate. Electrodes are arranged in the vicinity of a diaphragm portion of the pressure sensor. In the laminar substrate, a plurality of substrates are laminated, and the laminar substrate incorporates the pressure sensor. One face of the diaphragm portion is exposed by a space portion. According to the invention, it is possible to provide a pressure sensor module which facilitates smaller and thinner sizes, and which enables high-density packaging. | 09-24-2009 |
20090266170 | PRESSURE SENSOR, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PROVIDED THEREWITH - A pressure sensor which includes: a semiconductor substrate; a first cavity portion that spreads out approximately parallel with one surface of the semiconductor substrate in the interior of a central region thereof; a diaphragm portion of a thin plate shape that is positioned on one side of the first cavity portion; a pressure sensitive element that is disposed on the diaphragm; and a bump that is disposed in an outer edge region of the one surface of the semiconductor substrate that excludes the diaphragm portion and is electrically connected with the pressure sensitive element, wherein a second cavity portion is disposed in at least one portion of the outer edge region in the interior of the semiconductor substrate and is closed with respect to the one surface of the semiconductor substrate. | 10-29-2009 |
20090266171 | PRESSURE SENSOR MODULE AND ELECTRONIC COMPONENT - A pressure sensor module includes a pressure sensor, a bump, and a laminated substrate. The pressure sensor includes a semiconductor substrate; a cavity; a pressure-sensitive element; and a conductive section. The cavity is disposed inside the semiconductor substrate such that a thin-plate region of the semiconductor substrate is provided and the thin-plate region being defined as a diaphragm. The pressure-sensitive element is arranged at the diaphragm. The conductive section is electrically connected to the pressure-sensitive element and disposed on the face of the semiconductor substrate at a region excluding the diaphragm. The bump is electrically connected to the conductive section. The laminated substrate includes a wiring base material electrically connected to the pressure sensor via the bump. The wiring base material is disposed inside the laminated substrate. A face of the wiring base material is electrically connected to the bump and has an exposed area from the laminated substrate. | 10-29-2009 |
20100276765 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a semiconductor device includes: a bonding step of bonding a first substrate with optical transparency and a second substrate having a surface on which a functional element is provided to each other such that the functional element faces the first substrate; a thinning step of thinning at least one of the first and second substrates; and a through-hole forming step of forming a cavity and a through-hole communicated with the cavity in at least part of a bonding portion between the first and second substrates. According to the present invention, it is possible to prevent irregularities or cracks caused by the presence or absence of the cavity and more regularly thin the substrate. In addition, it is possible to manufacture a semiconductor device capable of contributing to the miniaturization of devices and electronic equipment having the devices, using a more convenient process. | 11-04-2010 |
20110129999 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - Provided is a method for manufacturing a semiconductor device including: an electrode formation step of forming an electrode on one surface of a semiconductor substrate; a through hole formation step of forming a through hole starting from a position on the other surface corresponding to the position of the electrode; a first insulating layer formation step of forming a first insulating layer on at least an inner circumferential surface, a periphery of an opening, and a bottom surface of the through hole; a modifying step of reforming a first portion of the first insulating layer formed on the bottom surface of the through hole; a modified region removal step of removing the modified region; and a conductive layer formation step of forming a conductive layer on the electrode exposed inside the through hole and on the first insulating layer such that the conductive layer is electrically connected with the electrode. | 06-02-2011 |
20110303993 | SEMICONDUCTOR SENSOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR SENSOR DEVICE, PACKAGE, METHOD OF MANUFACTURING PACKAGE, MODULE, METHOD OF MANUFACTURING MODULE, AND ELECTRONIC DEVICE - A semiconductor sensor device is provided which is composed of: a semiconductor sensor chip that includes a first substrate, a sensor circuit formed on the first substrate, a first conductive portion electrically connected to the sensor circuit, and a first redistribution layer electrically connected to the first conductive portion; a semiconductor chip that includes a second substrate, a processing circuit, formed on the second substrate, that processes an electrical signal output from the sensor circuit, a second conductive portion electrically connected to the processing circuit, and a second redistribution layer electrically connected to the second conductive portion; and a conductive connection component that electrically connects the first redistribution layer and the second redistribution layer, wherein at least one of the thickness of the first redistribution layer and the thickness of the second redistribution layer is 8 to 20 μm. | 12-15-2011 |
20120031657 | ELECTRONIC DEVICE MOUNTING STRUCTURE AND ELECTRONIC DEVICE MOUNTING METHOD - An electronic device mounting structure including: a supporting member that includes a supporting substrate, and a through electrode that penetrates the supporting substrate from a first principal surface that is one principal surface of the supporting substrate to a second principal surface that is the other principal surface, and that includes a projecting portion that projects from the second principal surface; and an electronic device that includes a device substrate on which a circuit is formed, and a through hole that penetrates between both principal surfaces of the device substrate, wherein the electronic device is arranged on the second principal surface of the supporting substrate so that the projecting portion of the supporting member is inserted into the through hole, and the circuit of the electronic device is electrically connected with the projecting portion. | 02-09-2012 |
20120036936 | PRESSURE SENSOR MODULE AND ELECTRONIC COMPONENT - A pressure sensor module includes a pressure sensor, a bump, and a laminated substrate. The pressure sensor includes a semiconductor substrate; a cavity; a pressure-sensitive element; and a conductive section. The cavity is disposed inside the semiconductor substrate such that a thin-plate region of the semiconductor substrate is provided and the thin-plate region being defined as a diaphragm. The pressure-sensitive element is arranged at the diaphragm. The conductive section is electrically connected to the pressure-sensitive element and disposed on the face of the semiconductor substrate at a region excluding the diaphragm. The bump is electrically connected to the conductive section. The laminated substrate includes a wiring base material electrically connected to the pressure sensor via the bump. The wiring base material is disposed inside the laminated substrate. A face of the wiring base material is electrically connected to the bump and has an exposed area from the laminated substrate. | 02-16-2012 |
20120039055 | DEVICE MOUNTING STRUCTURE AND DEVICE MOUNTING METHOD - Provided is a device mounting structure that includes: a interposer substrate including a substrate and a plurality of through-hole interconnection; a first device including a plurality of electrodes arranged so as to face the first principal surface of the substrate; and a second device including a plurality of electrodes whose arrangement is different from that of the first device, with the electrodes arranged so as to face the second principal surface of the substrate. Each through-hole interconnection includes a first conductive portion provided at a position on the first principal surface corresponding to the electrode of the first device, and a second conductive portion provided at a position on the second principal surface corresponding to the electrode of the second device. Each electrode of the first device is electrically connected with the first conductive portion. Each electrode of the second device is electrically connected with the second conductive portion. | 02-16-2012 |
20120103677 | THROUGH WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - A through wiring substrate includes a substrate including a first face and a second face, and a plurality of through-wires formed by filling, or forming a film of, an electrically-conductive substance in through-holes that penetrate between the first face and the second face. The through-wires are separated from each other, and, include at least one overlap section in a plan view of the substrate. | 05-03-2012 |
20120103679 | THROUGH WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - A through wiring substrate includes a substrate having a first face and a second face; and a through-wire formed by filling, or forming a film of, an electrically-conductive substance into a through-hole, which penetrates between the first face and the second face. The through-hole has a bend part comprising an inner peripheral part that is curved in a recessed shape and an outer peripheral part that is curved in a protruding shape, in a longitudinal cross-section of the through-hole, and at least the inner peripheral part is formed in a circular arc shape in the longitudinal cross-section. | 05-03-2012 |
20120205148 | DEVICE PACKAGING STRUCTURE AND DEVICE PACKAGING METHOD - Provided is a device packaging structure including: an interposer substrate including a substrate, and a plurality of through-hole interconnections formed inside a plurality of through-holes passing through the substrate from a first main surface toward a second main surface, the first main surface being one main surface of the substrate, the second main surface being the other main surface thereof; a first device which includes a plurality of electrodes and is arranged so that these electrodes face the first main surface; and a second device which includes a plurality of electrodes of which an arrangement is different from an arrangement of each of the electrodes of the first device, and is arranged so that these electrodes face the second main surface. | 08-16-2012 |
20120261177 | DEVICE PACKAGING STRUCTURE AND DEVICE PACKAGING METHOD - Provided is a device packaging structure including: an interposer substrate including a substrate, and a plurality of through-hole interconnections formed inside a plurality of through-holes passing through the substrate from a first main surface toward a second main surface, the first main surface being one main surface of the substrate, the second main surface being the other main surface thereof; a first device which includes a plurality of electrodes and is arranged so that these electrodes face the first main surface; and a second device which includes a plurality of electrodes of which an arrangement is different from an arrangement of each of the electrodes of the first device, and is arranged so that these electrodes face the second main surface. | 10-18-2012 |
20120261179 | INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - An interposer substrate of the present invention includes a planar substrate, and through hole wiring that is formed by filling a through hole that connects together a first main surface and a second main surface of this substrate with a conductor. When the through hole is viewed in a vertical cross-sectional view of the substrate, the through hole has a trapezoidal shape whose side walls are formed by an inside surface of the through hole, and two side faces of the trapezoid are not parallel to each other. The two side faces of the trapezoid are both inclined towards the same side relative to two perpendicular lines that are perpendicular to the first main surface or the second main surface at two apex points forming a top face or a bottom face of the trapezoid. | 10-18-2012 |
20120295066 | SURFACE NANOSTRUCTURE FORMING METHOD AND BASE HAVING SURFACE NANOSTRUCTURE - A surface nanostructure forming method includes: preparing a substrate having an appropriate processing value; a first process of irradiating a part which is close to a surface of the substrate with laser light having a pulse duration of picosecond order or shorter at an irradiation intensity being close to the appropriate processing value of the substrate, or greater than or equal to the appropriate processing value and less than or equal to an ablation threshold and forming periodic nanostructures in which first modified portions and second modified portions are periodically arranged in a self-assembled manner at a focus at which the laser light is concentrated and in a region being close to the focus; and a second process of performing an etching treatment on the surface of the substrate having the periodic nanostructures formed thereon to form an uneven structure having the first modified portions as valleys. | 11-22-2012 |
20130140976 | METHOD OF MANUFACTURING MICROFLUIDIC CHIP, MICROFLUIDIC CHIP, AND APPARATUS FOR GENERATING SURFACE PLASMON RESONANT LIGHT - A method of manufacturing a microfluidic chip includes: irradiating, with a laser light, an area to be provided with a valley for storing a fluid on a surface of a substrate so as to form a modified region having a periodic pattern formed in a self-organizing manner in a light-collecting area of the laser light, the laser light having a pulse width for which the pulse duration is on the order of picoseconds or less; carrying out an etching treatment on the substrate in which the modified region is formed, removing at least some of the modified portion so as to provide the valley, and forming a periodic structure having a plurality of groove portions along one direction which have a surface profile based on the periodic pattern on at least a bottom surface of the valley; and forming a metal layer that covers the periodic structure of the bottom surface. | 06-06-2013 |
20130196426 | BASE BODY AND METHOD OF MANUFACTURING BASE BODY - Disclosed is a substrate ( | 08-01-2013 |
20130230912 | BASE BODY AND METHOD FOR MANUFACTURING BASE BODY - A base body includes: a base member; a channel provided in the base member, the channel having an inner wall surface and flowing a fluid; a fine vacuum hole provided in the inner wall, the fine vacuum hole causing the channel to communicate the outside of the base member other and having an opening; and a slow flow portion disposed at a position close to the opening of the fine vacuum hole in the inner wall surface, the slow flow portion slows a flow of the fluid, wherein at least a portion that configures the fine vacuum hole in the base member is formed of a single member. | 09-05-2013 |
20130309445 | METHOD OF MANUFACTURING BASE BODY HAVING MICROSCOPIC HOLE, AND BASE BODY - A method of manufacturing a base body having a microscopic hole, includes: forming at least one of a first modified region and a second modified region by scanning inside of a base body with a focal point of a first laser light having a pulse duration on order of picoseconds or less; forming a periodic modified group formed of a plurality of third modified regions and fourth modified regions by scanning an inside of the base body with a focal point of a second laser light having a pulse duration on order of picoseconds or less; obtaining the base body which is formed so that the first modified region and the second modified region overlap or come into contact with the modified group; and forming a microscopic hole by removing the first modified region and the third modified regions by etching. | 11-21-2013 |
20130335936 | INTERPOSER SUBSTRATE, ELECTRONIC DEVICE PACKAGE, AND ELECTRONIC COMPONENT - An interposer substrate of the invention includes: a single substrate having a first main surface and a second main surface; and a plurality of through-hole interconnections having first portions formed so as to extend in parallel with each other and connecting the first main surface to the second main surface, wherein the through-hole interconnections adjacent to each other are provided so that ideal axes are parallel to each other with a distance therebetween, and the ideal axes extend perpendicular to at least one of the first main surface and the second main surface and penetrate through centers of the first portions. | 12-19-2013 |
20140009898 | INTERPOSER SUBSTRATE, ELECTRONIC DEVICE PACKAGE, AND ELECTRONIC COMPONENT - An interposer substrate of the invention includes: a single substrate having a first main surface and a second main surface; a plurality of through-hole interconnections having at least a first portion formed so as to extend in a direction different from the thickness direction of the substrate, a second portion constituting one of end portions of a through-hole interconnection, and a third portion constituting the other of the end portions of the through-hole interconnection, the through-hole interconnections being provided inside the substrate so as to connect the first main surface to the second main surface, wherein the second portion is substantially perpendicular to the first main surface and is exposed to the first main surface, the third portion is substantially perpendicular to the second main surface and is exposed to the second main surface, and lengths of the through-hole interconnections are the same as each other. | 01-09-2014 |
20140193573 | APPARATUS OF FORMING ELECTROCONDUCTIVE SUBSTANCE AND METHOD OF FORMING THE SAME - An apparatus forms an electroconductive substance in micro holes, the apparatus introduces a fluid, that includes at least a metal complex dissolved in a supercritical fluid or a subcritical fluid, into a reaction chamber including a first space and a second space, allows a planar substrate to be disposed in the fluid that continuously moves in a specific direction in the reaction chamber. A second surface of the substrate is vertical to the specific direction in which the fluid that is introduced into the first space moves; the substrate is supported throughout the entire first surface so that the fluid travels in the micro holes of the substrate from the second surface toward the first space of the substrate; and a support member including a fine communication hole through which the fluid passes toward the second space is disposed. | 07-10-2014 |
20140231390 | METHOD OF MANUFACTURING SUBSTRATE INCLUDING MICRO HOLE - A method of manufacturing a substrate including a micro hole, includes: setting a scanning rate (μm/sec) of pulsed laser light to 1×10 | 08-21-2014 |
20140233348 | FLUID CONTROL DEVICE AND FLUID MIXER - A fluid control device for mixing liquids, includes at least: a monolithic base body; and a plurality of micro holes disposed in the base body. Also, the micro holes in a flow channel group α that configures a specific group have opening portions in a region A and a region B on surfaces being outer surfaces of the base body, the micro holes in a flow channel group β (n) that configures the other specific group have opening portions in the region A and a region C (n) on the surfaces being outer surfaces of the base body, and in the base body, the micro holes are disposed apart from the micro holes belonging to the different flow channel group throughout entire lengths. Here, the n refers to a natural number. | 08-21-2014 |
20140254120 | DEVICE PACKAGING STRUCTURE AND DEVICE PACKAGING METHOD - Provided is a device packaging structure including: an interposer substrate including a substrate, and a plurality of through-hole interconnections formed inside a plurality of through-holes passing through the substrate from a first main surface toward a second main surface, the first main surface being one main surface of the substrate, the second main surface being the other main surface thereof; a first device which includes a plurality of electrodes and is arranged so that these electrodes face the first main surface; and a second device which includes a plurality of electrodes of which an arrangement is different from an arrangement of each of the electrodes of the first device, and is arranged so that these electrodes face the second main surface. | 09-11-2014 |
20140326702 | METHOD OF MANUFACTURING BASE BODY HAVING MICROSCOPIC HOLE, AND BASE BODY - A method of manufacturing a base body having a microscopic hole, includes: forming at least one of a first modified region and a second modified region by scanning inside of a base body with a focal point of a first laser light having a pulse duration on order of picoseconds or less; forming a periodic modified group formed of a plurality of third modified regions and fourth modified regions by scanning an inside of the base body with a focal point of a second laser light having a pulse duration on order of picoseconds or less; obtaining the base body which is formed so that the first modified region and the second modified region overlap or come into contact with the modified group; and forming a microscopic hole by removing the first modified region and the third modified regions by etching. | 11-06-2014 |
20150260929 | OPTICAL MODULE | 09-17-2015 |
Patent application number | Description | Published |
20090040652 | MAGNETIC RECORDING DISK AND DISK DRIVE WITH PATTERNED PHASE-TYPE SERVO FIELDS FOR READ/WRITE HEAD POSITIONING - A magnetic recording disk drive uses a disk having pre-patterned servo sectors extending generally radially across the data tracks. The servo sectors include at least two position error signal (PES) bursts or fields. The phases of the PES fields in the servo readback signal are demodulated to generate a PES to control the disk drive actuator for positioning the read/write heads. Each field contains generally radially directed magnetized stripes, with each stripe comprising a plurality of islands forming a zigzag pattern. The stripes have alternating polarity of magnetizations in the along-the-track direction. In one implementation there are four fields: a first pair of fields A and B wherein the zigzag pattern of the radial stripes in field A is the mirror image about a radial line of the zigzag pattern of the radial stripes in field B, and a second like pair of fields C and D, but wherein the radial stripes in fields C and D are shifted radially by one-half the island radial height from the radial stripes in fields A and B. | 02-12-2009 |
20090046385 | MAGNETIC RECORDING DISK AND DISK DRIVE WITH AMPLITUDE-TYPE SERVO FIELDS HAVING PATTERNED ALTERNATING-POLARITY SERVO ISLANDS FOR READ/WRITE HEAD POSITIONING - A magnetic recording disk drive has a disk with pre-patterned nondata servo sectors extending generally radially across the data tracks for use in positioning the read/write heads on the data tracks. The servo sectors include a synchronization pattern of generally radially directed magnetized marks, a first field of generally radially directed magnetized stripes, and a second field of generally radially directed magnetized stripes. Each stripe in each of the two fields comprises a plurality of radially spaced discrete islands, each island having a radial height of approximately Tp, where Tp is the spacing of the track centerlines in the radial direction. In the first field, the islands are centered at a track centerline, and in the second field the islands are centered at the midline between two adjacent track centerlines. The marks and islands are discrete magnetized regions separated by nonmagnetic spaces. The marks in the synchronization pattern and the stripes in the two fields have alternating polarity of magnetizations in the along-the-track direction. | 02-19-2009 |
20090097156 | MAGNETIC RECORDING DISK AND DISK DRIVE WITH PATTERNED PHASE-TYPE SERVO FIELDS FOR READ/WRITE HEAD POSITIONING - A magnetic recording disk drive uses a disk having pre-patterned servo sectors extending generally radially across the data tracks. The servo sectors include at least two position error signal (PES) bursts or fields. The phases of the PES fields in the servo readback signal are demodulated to generate a PES to control the disk drive actuator for positioning the read/write heads. Each field contains generally radially directed magnetized stripes, with each stripe comprising a plurality of discrete radially-spaced generally parallelogram-shaped islands, each island having its length oriented at an acute angle relative to a track centerline. The stripes have alternating polarity of magnetizations in the along-the-track direction. In one implementation there are four fields: a first pair of fields A and B wherein the pattern of the radial stripes in field A is the mirror image about a radial line of the pattern of the radial stripes in field B, and a second like pair of fields C and D, but wherein the radial stripes in fields C and D are shifted radially from the radial stripes in fields A and B. | 04-16-2009 |
20090097160 | MAGNETIC RECORDING DISK AND DISK DRIVE WITH AMPLITUDE-TYPE SERVO FIELDS HAVING PATTERNED SERVO ISLANDS FOR READ/WRITE HEAD POSITIONING - A magnetic recording disk drive has a disk with pre-patterned nondata servo sectors extending generally radially across the data tracks. The disk may be a patterned-media disk with both pre-patterned data islands and pre-patterned nondata servo sectors. The servo sectors include a synchronization pattern of generally radially directed discrete magnetized marks, and first and second position error signal (PES) fields of generally radially directed discrete magnetized stripes. Each stripe in each of the two fields comprises a plurality of radially spaced discrete servo islands, each island having a radial height of approximately Tp, where Tp is the radial spacing of the track centerlines. In each field, the servo islands in alternating stripes in the along-the-track direction are shifted radially by approximately Tp. In the first PES field, the islands are centered at the midline between two adjacent track centerlines, and in the second PES field the islands are centered at a track centerline. All of the servo islands in the two PES fields have the same magnetization direction. | 04-16-2009 |
20090161246 | Random Number Generation Using Hard Disk Drive Information - A hard disk drive enhances random number generation. In particular embodiments, the hard disk drive includes a controller, a hard disk, and a head. The head includes a read sensor for reading patterns on the hard disk. The controller generates a random number based on information associated with the position of the head relative to at least one track of the hard disk. | 06-25-2009 |
20100172048 | Servo patterns for patterned media - Servo patterns for patterned media. The servo pattern includes specification of cylinder/track ID with and without a Gray code. The servo pattern space is minimized by the optimum usage of the islands. This is achieved by island allocation rules to take advantage of non-magnetic island. The island allocation also provides for easier lift-off. Logic is used to encode and decode the Gray code. Further, the Gray code is designed to stabilize the magnetic island/non-magnetic island ratio to allow for easier manufacture. | 07-08-2010 |
20120149433 | SMART PHONE DISPLAY AND KEYBOARD EXTENSION - A device for providing an external display and keypad for a smart-phone. The device has a port for receiving the smart phone. The device does not have its own computing power, but uses the computing power of the smart phone itself, thereby allowing the device to be smaller, lighter and less expensive than a standard lap-top computer not notebook device. The device is configured with a port for receiving a smart-phone and preferably holds the smart phone so that does not extend above the surface of the device or is flush with the surface of the device. The device can also be configured to allow the smart phone itself to act as a numerical keypad adjacent to the keypad provided on the device. | 06-14-2012 |
20130100550 | IMPLEMENTING MAGNETIC DEFECT CLASSIFICATION USING PHASE MODULATION - A method, apparatus, and system are provided for implementing magnetic defect classification using phase modulation for hard disk drives. A magnetic media readback signal of a hard disk drive is processed to identify predefined phase modulation (PM) characteristics to implement magnetic defect classification of magnetic media bump and pit defects. | 04-25-2013 |
20130335841 | IMPLEMENTING COMBINED PHASE AND AMPLITUDE MAGNETIC DEFECT DETECTION ON-THE-FLY - A method, apparatus, and system are provided for implementing magnetic defect location detection on-the-fly for hard disk drives. A magnetic media readback signal of a hard disk drive is demodulated to generate phase modulation (PM) and amplitude modulation (AM) signals. A new coordinate plane defined by a combined phase modulation (PM) and amplitude modulation (AM) phasor-defect detector calculation function used to locate magnetic defects on-the-fly. | 12-19-2013 |
20140320995 | IMPLEMENTING DATA FREQUENCY AND DATA BITS PER SECTOR (BPS) CALIBRATION FOR NON-CIRCULAR DISK TRACKS - A method, apparatus and a data storage device are provided for implementing data frequency and data bits per sector (BPS) calibration for data written on a recordable surface including non-circular disk tracks of a storage device. A sector based BPS profile is created for data sectors on the recordable surface. The sector based BPS profile is used for modifying a number of data clock cycles based upon longer or shorter data sectors; and data clock frequency is dynamically adjusted based upon velocity jitter. | 10-30-2014 |
20150128008 | TRACK-BAND SQUEEZED-SECTOR ERROR CORRECTION IN MAGNETIC DATA STORAGE DEVICES - Data storage devices using a two-level ECC scheme are described. Embodiments of the invention allow the recovery of sectors in a squeezed group of tracks in a that includes both a single track level ECC scheme and a track band ECC scheme that functions across the set of tracks in the band. The track band ECC scheme uses additional parity information calculated using input data from multiple tracks to allow correction across tracks. | 05-07-2015 |
20150254135 | ERROR CORRECTION WITH ON-DEMAND PARITY SECTORS IN MAGNETIC DATA STORAGE DEVICES - Data storage devices are described with an ECC system that generate additional on-demand ECC information for a previously written track to provide for correction of data errors in the track and thereby avoid having to rewrite the track. Embodiments of the invention address the squeeze-error problem that arises when writing the next (second) track in a sequence causes errors to be introduced in the adjacent previously written (first) track. In alternative embodiments the existence of the data errors in the first track can be detected by reading the track or by estimating the number of likely errors using head position data measured while writing the first and second tracks. The additional on-demand ECC information can be written on any track that is available. | 09-10-2015 |
Patent application number | Description | Published |
20120312420 | FILLING PORT STRUCTURE FOR FUEL TANK - A filling port structure for a fuel tank includes a filling port member that defines a filling port, an open/close valve that opens and closes the filling port, a rotary member that attaches the open/close valve to the filling port member in a manner such that the open/close valve is rotatable between an open position and a closed position, a locking member that is provided in the filling port member and is movable between a locking position to lock the open/close valve in the closed position and an unlocking position to unlock the open/close valve, an unlocking member that moves the locking member to the unlocking position when pressed by a fuel gun, and a retention portion that holds the locking member in the unlocking position at least when the open/close valve is in the open position. | 12-13-2012 |
20130193140 | FUEL TANK OPENING-CLOSING DEVICE - A fuel tank opening-closing device has a tank opening forming member, a flap valve mechanism that has an opening-closing member, and an opening-closing activation mechanism that switches between the locked position and the unlocked position that does the opening operation of the opening-closing member. The opening-closing activation mechanism has a nozzle detection mechanism which has introductory push parts mounted on the opening-closing member and adapted to receive force of motion in the insertion direction of the fueling nozzle, and a lock member that is mounted on the tank opening forming member and that selectively shifts between the locked position and the unlocked position by engaging and disengaging with the opening-closing member, and a locking mechanism that moves the locking member from the locked position to the unlocked position by being pushed by the introductory push parts. | 08-01-2013 |
20130327768 | FUEL TANK FUEL FILLER STRUCTURE - A fuel tank fuel filler structure with which even a fuel nozzle having a large diameter portion can be inserted easily into a fuel fill inlet and which can highly demonstrate the action of guiding the fuel nozzle to the fuel fill inlet. One end of a guide plate is rotatably supported on a rotational shaft disposed on a flapper valve. The guide plate is biased by a guide plate biasing spring toward a withdrawal region in which the guide plate withdraws from a passage region of a fuel nozzle. In a state where the flapper valve is in an open position, the entire guide plate is positioned in the withdrawal region. In a state where the flapper valve is in a closed position, the guide plate can be placed near a fuel fill inlet. | 12-12-2013 |
20140346171 | FUELING PORTION STRUCTURE OF FUEL TANK - A fueling portion structure of a fuel tank can reliably close a fueling port, and at which pulling-out of a fueling gun from the fueling port is easier. A center of a rotation shaft and a contact position when valve is closed, that a spring for the flapper valve contacts when a flapper valve is at a closed-valve position, are connected, and a reference segment when the valve is closed is assumed. The center of the rotation shaft and a contact position when the valve is open, at a time when the flapper valve is at open-valve position HP, are connected, and a reference segment when the valve is open is assumed. A spring shaft is provided further toward the contact position when valve is closed side than a bisector of an angle formed by the reference segment when valve is closed and the reference segment when valve is open. | 11-27-2014 |
20150083722 | FUEL FILLER STRUCTURE FOR FUEL TANK - To obtain a fuel filler structure for a fuel tank wherein when causing an opening and closing valve to close, it can be ensured that the opening and closing valve does not rapidly rotate to a closed position in which it closes a fuel fill inlet, and when causing the opening and closing valve to open, the opening and closing valve can be opened with a small force. A fuel filler structure is equipped with a damper on the near side of a flapper valve in the insertion direction of a fuel nozzle. When the flapper valve rotates to an open position, the damper does not act on the flapper valve, and when the flapper valve rotates to a closed position, the damper acts on the flapper valve. | 03-26-2015 |
20150240772 | LEAK DIAGNOSIS DEVICE FOR EVAPORATED FUEL PROCESSING SYSTEM - It is a task of the invention to provide a leak diagnosis device for an evaporated fuel processing system, which is able to carry out a leak diagnosis irrespective of a temperature inside a fuel tank. A leak diagnosis device that is used in an evaporated fuel processing system including a canister ( | 08-27-2015 |