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| 20080226218 | Collision detection optical fiber sensor - An optical fiber | 09-18-2008 |
| 20090183578 | CABLE-TYPE LOAD SENSOR - A cable-type load sensor having an advantage in layout and being capable of sensing the load precisely is provided. The cable-type load sensor comprises a linear member composed of electrically conductive rubber and having a hollow part extending in the longitudinal direction at the central part of the cross section, and a cladding layer composed of the same kind of rubber material as the linear member and covering the circumference on the linear member. | 07-23-2009 |
| 20100063678 | MOTION CONTROL SENSOR SYSTEM FOR A MOVING UNIT AND MOTION CONTROL SYSTEM - A motion control sensor system and motion control system for a moving unit have a physical quantity sensor in an unsprung mass of the moving unit so that physical quantities in the unsprung mass can be detected, bypassing the spring. An acceleration sensor for detecting acceleration exerted on the unsprung mass of the moving unit is placed so that its detection axis crosses the operation axis of the moving unit, so acceleration due to angular acceleration around the operation axis is not detected. Accordingly, the motion control sensor system and motion control system are suitable for running stability control during cornering of the moving unit. | 03-11-2010 |
| 20100185414 | ABNORMALITY DETECTION METHOD AND ABNORMALITY DETECTION SYSTEM FOR OPERATING BODY - A method of detecting an abnormality in an operating body, according to the present invention, comprises steps of: continuously collecting data about the operating body; detecting events for the operating body; extracting part of the data as target data, the part of the data being collected in a predetermined period delimited by times at which the events are detected; preparing comparison data in advance for abnormality detection; comparing the target data with the comparison data to obtain a comparison result; and detecting an abnormality in the operating body from the comparison result. | 07-22-2010 |
| 20110035091 | SENSOR SYSTEM FOR MOTION CONTROL OF A MOVING UNIT AND A METHOD OF INSTALLING A SENSOR SYSTEM FOR MOTION CONTROL OF A MOVING UNIT - A sensor system for motion control of a moving unit such as a vehicle, which is comprised of a uniaxial physical value sensor having a single detection axis and the uniaxial physical value sensor being installed in a unsprung mass of a suspension device provided in the moving unit, wherein the detection axis of the uniaxial physical value sensor and the working axis of a vibration-buffering member provided on the suspension device are approximately parallel. | 02-10-2011 |
| 20110088489 | Load measuring sensor for rod-shaped body and load measuring system - A load measuring sensor for a rod-shaped body includes a stress transfer member including portions tightly fixed to the rod-shaped body at two longitudinal positions and a non-fixed portion not fixed to the rod-shaped body, the rod-shaped body being deformable by a load, and a plurality of strain gauges each attached to the stress transfer member at a plurality of circumferential positions of the stress transfer member and at least two longitudinal positions of the stress transfer member. | 04-21-2011 |
| 20110143111 | Insert molding method and insert molded product - An insert molding method includes holding a plurality of insert members in a molding die to be separated from one another, and subsequently filling a resin into the molding die to fill a gap between the insert members and a periphery thereof with the resin to form an insert molded product such that the insert members are separated at a preset interval from one another. The molding die includes a space-maintaining projection for maintaining a separation interval between the insert members at the preset interval or more, the projection being formed on an inner wall surface of the molding die opposite to a longitudinal end of the insert members, and a gate for filling the resin therethrough into the molding die, the gate being formed on an inner wall surface of the molding die opposite to a side of the insert members in a width direction thereof. | 06-16-2011 |
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| 20080242539 | Phenol Compound, Reversible Thermosensitive Recording Medium, Reversible Thermosensitive Recording Label, Reversible Thermosensitive Recording Member, Image-Processing Apparatus and Image-Processing Method - The present invention provides a reversible thermosensitive recording medium including a support and a thermosensitive recording layer thereon, in which the thermosensitive recording layer contains an electron-donating coloring compound and an electron-accepting compound, and the thermosensitive recording layer is capable of forming a relatively developed condition and a relatively erased condition depending on at least one of the difference of heating temperatures and the difference of cooling rates following to heating, and in which the electron-accepting compound contains a phenol compound expressed by General Formula (1): | 10-02-2008 |
| 20100219405 | NOVEL ARYLAMINE POLYMER, METHOD FOR PRODUCING THE SAME, INK COMPOSITION, FILM, ELECTRONIC DEVICE, ORGANIC THIN-FILM TRANSISTOR, AND DISPLAY DEVICE - A polymer containing a repeating unit expressed by General Formula (I): General Formula (I) where Ar1 represents a substituted or unsubstituted aromatic hydrocarbon group; Ar2 and Ar3 each independently represent a divalent group of a substituted or unsubstituted aromatic hydrocarbon group; and R1 and R2 each independently represent a hydrogen atom, substituted or unsubstituted alkyl group, or substituted or unsubstituted aromatic hydrocarbon group. | 09-02-2010 |
| 20110040107 | [1]BENZOTHIENO[3,2-B][1]BENZOTHIOPHENE COMPOUND AND METHOD FOR PRODUCING THE SAME, AND ORGANIC ELECTRONIC DEVICE USING THE SAME - A [1]benzothieno[3,2-b][1]benzothiophene compound expressed by General Formula (I): General Formula (I) where X and Y are each independently a hydrogen atom; a halogen atom; or a functional group having a straight or branched aliphatic alkyl group optionally having a halogen atom, a functional group having an alicyclic alkyl group optionally having a halogen atom, a functional group having a straight or branched aliphatic alkenyl group optionally having a halogen atom, a functional group having an alicyclic alkenyl group optionally having a halogen atom, a functional group having a carboxyl group, or a functional group having a thiol group, as a partial structure; and X and Y are the same or each independently different, provided that at least one of X and Y has a straight or branched aliphatic alkenyl group, an alicyclic alkenyl group, a carboxyl group or a thiol group, as a partial structure. | 02-17-2011 |
| 20110109637 | PROCESSING DEVICE, PROCESSING METHOD AND COMPUTER READABLE MEDIUM - A processing device has plural processing modules executing a processing; and plural connectors each having a linking section, an associating section, and a controller. The linking section is able to link with at least one other connector at an input side or an output side. The associating section associates the connector with one of the processing modules. In accordance with a linked state, the controller controls the processing module associated by the associating section. | 05-12-2011 |
| 20110215306 | ORGANIC SEMICONDUCTOR ELEMENT AND ORGANIC ELECTRODE - To provide an organic semiconductor element, containing: a source electrode containing a first organic compound layer and a second organic compound layer, at least one of the layers having an organic semiconductor active region; and a drain electrode containing the first organic compound layer and the second organic compound layer, as well as providing an organic electrode, containing: a laminated film, in which a layer of a tetrathiafulvalene derivative expressed by the following general formula I and a layer of an electron accepting compound are laminated: | 09-08-2011 |
| 20120035364 | TETRATHIAFULVALENE DERIVATIVE, AND ORGANIC FILM AND ORGANIC TRANSISTOR USING THE SAME - A tetrathiafulvalene derivative expressed by General Formula (I): General Formula (I) in General Formula (I), X represents an atom selected from a carbon atom, a sulfur atom, and a nitrogen atom, and Xs may be the same or different; provided that when X is the carbon atom or the nitrogen atom, R | 02-09-2012 |
| 20120119195 | NOVEL ORGANIC SEMICONDUCTIVE MATERIAL AND ELECTRONIC DEVICE USING THE SAME - To provide an organic semiconductive material, expressed by the following general formula I: General Formula I where R | 05-17-2012 |
| 20120153271 | LEAVING SUBSTITUENT-CONTAINING COMPOUND, ORGANIC SEMICONDUCTOR MATERIAL, ORGANIC SEMICONDUCTOR FILM CONTAINING THE MATERIAL, ORGANIC ELECTRONIC DEVICE CONTAINING THE FILM, METHOD FOR PRODUCING FILM-LIKE PRODUCT, PI-ELECTRON CONJUGATED COMPOUND AND METHOD FOR PRODUCING THE PI-ELECTRON CONJUGATED COMPOUND - A leaving substituent-containing compound including a partial structure represented by the following General Formula (I): where a pair of X | 06-21-2012 |
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| 20080276713 | PRESSURE SENSOR PACKAGE AND ELECTRONIC PART - A pressure sensor package of the present invention includes a pressure sensor including a cavity disposed within a semiconductor substrate, wherein a region of the substrate above the cavity comprises a diaphragm section; a plurality of pressure-sensitive elements, wherein at least of portion of each pressure-sensitive element is disposed on the diaphragm section; and a plurality of conductive portions laterally spaced from the cavity and electrically connected to the pressure sensitive elements, a plurality of electrically conductive bumps arranged on the conductive portions and electrically connected to the conductive portions, wherein a total thickness D | 11-13-2008 |
| 20090235753 | PRESSURE SENSOR MODULE - A pressure sensor module of the invention includes a pressure sensor and a laminar substrate. Electrodes are arranged in the vicinity of a diaphragm portion of the pressure sensor. In the laminar substrate, a plurality of substrates are laminated, and the laminar substrate incorporates the pressure sensor. One face of the diaphragm portion is exposed by a space portion. According to the invention, it is possible to provide a pressure sensor module which facilitates smaller and thinner sizes, and which enables high-density packaging. | 09-24-2009 |
| 20090266170 | PRESSURE SENSOR, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PROVIDED THEREWITH - A pressure sensor which includes: a semiconductor substrate; a first cavity portion that spreads out approximately parallel with one surface of the semiconductor substrate in the interior of a central region thereof; a diaphragm portion of a thin plate shape that is positioned on one side of the first cavity portion; a pressure sensitive element that is disposed on the diaphragm; and a bump that is disposed in an outer edge region of the one surface of the semiconductor substrate that excludes the diaphragm portion and is electrically connected with the pressure sensitive element, wherein a second cavity portion is disposed in at least one portion of the outer edge region in the interior of the semiconductor substrate and is closed with respect to the one surface of the semiconductor substrate. | 10-29-2009 |
| 20090266171 | PRESSURE SENSOR MODULE AND ELECTRONIC COMPONENT - A pressure sensor module includes a pressure sensor, a bump, and a laminated substrate. The pressure sensor includes a semiconductor substrate; a cavity; a pressure-sensitive element; and a conductive section. The cavity is disposed inside the semiconductor substrate such that a thin-plate region of the semiconductor substrate is provided and the thin-plate region being defined as a diaphragm. The pressure-sensitive element is arranged at the diaphragm. The conductive section is electrically connected to the pressure-sensitive element and disposed on the face of the semiconductor substrate at a region excluding the diaphragm. The bump is electrically connected to the conductive section. The laminated substrate includes a wiring base material electrically connected to the pressure sensor via the bump. The wiring base material is disposed inside the laminated substrate. A face of the wiring base material is electrically connected to the bump and has an exposed area from the laminated substrate. | 10-29-2009 |
| 20100276765 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a semiconductor device includes: a bonding step of bonding a first substrate with optical transparency and a second substrate having a surface on which a functional element is provided to each other such that the functional element faces the first substrate; a thinning step of thinning at least one of the first and second substrates; and a through-hole forming step of forming a cavity and a through-hole communicated with the cavity in at least part of a bonding portion between the first and second substrates. According to the present invention, it is possible to prevent irregularities or cracks caused by the presence or absence of the cavity and more regularly thin the substrate. In addition, it is possible to manufacture a semiconductor device capable of contributing to the miniaturization of devices and electronic equipment having the devices, using a more convenient process. | 11-04-2010 |
| 20110129999 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - Provided is a method for manufacturing a semiconductor device including: an electrode formation step of forming an electrode on one surface of a semiconductor substrate; a through hole formation step of forming a through hole starting from a position on the other surface corresponding to the position of the electrode; a first insulating layer formation step of forming a first insulating layer on at least an inner circumferential surface, a periphery of an opening, and a bottom surface of the through hole; a modifying step of reforming a first portion of the first insulating layer formed on the bottom surface of the through hole; a modified region removal step of removing the modified region; and a conductive layer formation step of forming a conductive layer on the electrode exposed inside the through hole and on the first insulating layer such that the conductive layer is electrically connected with the electrode. | 06-02-2011 |
| 20110303993 | SEMICONDUCTOR SENSOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR SENSOR DEVICE, PACKAGE, METHOD OF MANUFACTURING PACKAGE, MODULE, METHOD OF MANUFACTURING MODULE, AND ELECTRONIC DEVICE - A semiconductor sensor device is provided which is composed of: a semiconductor sensor chip that includes a first substrate, a sensor circuit formed on the first substrate, a first conductive portion electrically connected to the sensor circuit, and a first redistribution layer electrically connected to the first conductive portion; a semiconductor chip that includes a second substrate, a processing circuit, formed on the second substrate, that processes an electrical signal output from the sensor circuit, a second conductive portion electrically connected to the processing circuit, and a second redistribution layer electrically connected to the second conductive portion; and a conductive connection component that electrically connects the first redistribution layer and the second redistribution layer, wherein at least one of the thickness of the first redistribution layer and the thickness of the second redistribution layer is 8 to 20 μm. | 12-15-2011 |
| 20120031657 | ELECTRONIC DEVICE MOUNTING STRUCTURE AND ELECTRONIC DEVICE MOUNTING METHOD - An electronic device mounting structure including: a supporting member that includes a supporting substrate, and a through electrode that penetrates the supporting substrate from a first principal surface that is one principal surface of the supporting substrate to a second principal surface that is the other principal surface, and that includes a projecting portion that projects from the second principal surface; and an electronic device that includes a device substrate on which a circuit is formed, and a through hole that penetrates between both principal surfaces of the device substrate, wherein the electronic device is arranged on the second principal surface of the supporting substrate so that the projecting portion of the supporting member is inserted into the through hole, and the circuit of the electronic device is electrically connected with the projecting portion. | 02-09-2012 |
| 20120036936 | PRESSURE SENSOR MODULE AND ELECTRONIC COMPONENT - A pressure sensor module includes a pressure sensor, a bump, and a laminated substrate. The pressure sensor includes a semiconductor substrate; a cavity; a pressure-sensitive element; and a conductive section. The cavity is disposed inside the semiconductor substrate such that a thin-plate region of the semiconductor substrate is provided and the thin-plate region being defined as a diaphragm. The pressure-sensitive element is arranged at the diaphragm. The conductive section is electrically connected to the pressure-sensitive element and disposed on the face of the semiconductor substrate at a region excluding the diaphragm. The bump is electrically connected to the conductive section. The laminated substrate includes a wiring base material electrically connected to the pressure sensor via the bump. The wiring base material is disposed inside the laminated substrate. A face of the wiring base material is electrically connected to the bump and has an exposed area from the laminated substrate. | 02-16-2012 |
| 20120039055 | DEVICE MOUNTING STRUCTURE AND DEVICE MOUNTING METHOD - Provided is a device mounting structure that includes: a interposer substrate including a substrate and a plurality of through-hole interconnection; a first device including a plurality of electrodes arranged so as to face the first principal surface of the substrate; and a second device including a plurality of electrodes whose arrangement is different from that of the first device, with the electrodes arranged so as to face the second principal surface of the substrate. Each through-hole interconnection includes a first conductive portion provided at a position on the first principal surface corresponding to the electrode of the first device, and a second conductive portion provided at a position on the second principal surface corresponding to the electrode of the second device. Each electrode of the first device is electrically connected with the first conductive portion. Each electrode of the second device is electrically connected with the second conductive portion. | 02-16-2012 |
| 20120103677 | THROUGH WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - A through wiring substrate includes a substrate including a first face and a second face, and a plurality of through-wires formed by filling, or forming a film of, an electrically-conductive substance in through-holes that penetrate between the first face and the second face. The through-wires are separated from each other, and, include at least one overlap section in a plan view of the substrate. | 05-03-2012 |
| 20120103679 | THROUGH WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - A through wiring substrate includes a substrate having a first face and a second face; and a through-wire formed by filling, or forming a film of, an electrically-conductive substance into a through-hole, which penetrates between the first face and the second face. The through-hole has a bend part comprising an inner peripheral part that is curved in a recessed shape and an outer peripheral part that is curved in a protruding shape, in a longitudinal cross-section of the through-hole, and at least the inner peripheral part is formed in a circular arc shape in the longitudinal cross-section. | 05-03-2012 |
| 20120205148 | DEVICE PACKAGING STRUCTURE AND DEVICE PACKAGING METHOD - Provided is a device packaging structure including: an interposer substrate including a substrate, and a plurality of through-hole interconnections formed inside a plurality of through-holes passing through the substrate from a first main surface toward a second main surface, the first main surface being one main surface of the substrate, the second main surface being the other main surface thereof; a first device which includes a plurality of electrodes and is arranged so that these electrodes face the first main surface; and a second device which includes a plurality of electrodes of which an arrangement is different from an arrangement of each of the electrodes of the first device, and is arranged so that these electrodes face the second main surface. | 08-16-2012 |
| 20120261177 | DEVICE PACKAGING STRUCTURE AND DEVICE PACKAGING METHOD - Provided is a device packaging structure including: an interposer substrate including a substrate, and a plurality of through-hole interconnections formed inside a plurality of through-holes passing through the substrate from a first main surface toward a second main surface, the first main surface being one main surface of the substrate, the second main surface being the other main surface thereof; a first device which includes a plurality of electrodes and is arranged so that these electrodes face the first main surface; and a second device which includes a plurality of electrodes of which an arrangement is different from an arrangement of each of the electrodes of the first device, and is arranged so that these electrodes face the second main surface. | 10-18-2012 |
| 20120261179 | INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - An interposer substrate of the present invention includes a planar substrate, and through hole wiring that is formed by filling a through hole that connects together a first main surface and a second main surface of this substrate with a conductor. When the through hole is viewed in a vertical cross-sectional view of the substrate, the through hole has a trapezoidal shape whose side walls are formed by an inside surface of the through hole, and two side faces of the trapezoid are not parallel to each other. The two side faces of the trapezoid are both inclined towards the same side relative to two perpendicular lines that are perpendicular to the first main surface or the second main surface at two apex points forming a top face or a bottom face of the trapezoid. | 10-18-2012 |
| 20120295066 | SURFACE NANOSTRUCTURE FORMING METHOD AND BASE HAVING SURFACE NANOSTRUCTURE - A surface nanostructure forming method includes: preparing a substrate having an appropriate processing value; a first process of irradiating a part which is close to a surface of the substrate with laser light having a pulse duration of picosecond order or shorter at an irradiation intensity being close to the appropriate processing value of the substrate, or greater than or equal to the appropriate processing value and less than or equal to an ablation threshold and forming periodic nanostructures in which first modified portions and second modified portions are periodically arranged in a self-assembled manner at a focus at which the laser light is concentrated and in a region being close to the focus; and a second process of performing an etching treatment on the surface of the substrate having the periodic nanostructures formed thereon to form an uneven structure having the first modified portions as valleys. | 11-22-2012 |
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| 20090040652 | MAGNETIC RECORDING DISK AND DISK DRIVE WITH PATTERNED PHASE-TYPE SERVO FIELDS FOR READ/WRITE HEAD POSITIONING - A magnetic recording disk drive uses a disk having pre-patterned servo sectors extending generally radially across the data tracks. The servo sectors include at least two position error signal (PES) bursts or fields. The phases of the PES fields in the servo readback signal are demodulated to generate a PES to control the disk drive actuator for positioning the read/write heads. Each field contains generally radially directed magnetized stripes, with each stripe comprising a plurality of islands forming a zigzag pattern. The stripes have alternating polarity of magnetizations in the along-the-track direction. In one implementation there are four fields: a first pair of fields A and B wherein the zigzag pattern of the radial stripes in field A is the mirror image about a radial line of the zigzag pattern of the radial stripes in field B, and a second like pair of fields C and D, but wherein the radial stripes in fields C and D are shifted radially by one-half the island radial height from the radial stripes in fields A and B. | 02-12-2009 |
| 20090046385 | MAGNETIC RECORDING DISK AND DISK DRIVE WITH AMPLITUDE-TYPE SERVO FIELDS HAVING PATTERNED ALTERNATING-POLARITY SERVO ISLANDS FOR READ/WRITE HEAD POSITIONING - A magnetic recording disk drive has a disk with pre-patterned nondata servo sectors extending generally radially across the data tracks for use in positioning the read/write heads on the data tracks. The servo sectors include a synchronization pattern of generally radially directed magnetized marks, a first field of generally radially directed magnetized stripes, and a second field of generally radially directed magnetized stripes. Each stripe in each of the two fields comprises a plurality of radially spaced discrete islands, each island having a radial height of approximately Tp, where Tp is the spacing of the track centerlines in the radial direction. In the first field, the islands are centered at a track centerline, and in the second field the islands are centered at the midline between two adjacent track centerlines. The marks and islands are discrete magnetized regions separated by nonmagnetic spaces. The marks in the synchronization pattern and the stripes in the two fields have alternating polarity of magnetizations in the along-the-track direction. | 02-19-2009 |
| 20090097156 | MAGNETIC RECORDING DISK AND DISK DRIVE WITH PATTERNED PHASE-TYPE SERVO FIELDS FOR READ/WRITE HEAD POSITIONING - A magnetic recording disk drive uses a disk having pre-patterned servo sectors extending generally radially across the data tracks. The servo sectors include at least two position error signal (PES) bursts or fields. The phases of the PES fields in the servo readback signal are demodulated to generate a PES to control the disk drive actuator for positioning the read/write heads. Each field contains generally radially directed magnetized stripes, with each stripe comprising a plurality of discrete radially-spaced generally parallelogram-shaped islands, each island having its length oriented at an acute angle relative to a track centerline. The stripes have alternating polarity of magnetizations in the along-the-track direction. In one implementation there are four fields: a first pair of fields A and B wherein the pattern of the radial stripes in field A is the mirror image about a radial line of the pattern of the radial stripes in field B, and a second like pair of fields C and D, but wherein the radial stripes in fields C and D are shifted radially from the radial stripes in fields A and B. | 04-16-2009 |
| 20090097160 | MAGNETIC RECORDING DISK AND DISK DRIVE WITH AMPLITUDE-TYPE SERVO FIELDS HAVING PATTERNED SERVO ISLANDS FOR READ/WRITE HEAD POSITIONING - A magnetic recording disk drive has a disk with pre-patterned nondata servo sectors extending generally radially across the data tracks. The disk may be a patterned-media disk with both pre-patterned data islands and pre-patterned nondata servo sectors. The servo sectors include a synchronization pattern of generally radially directed discrete magnetized marks, and first and second position error signal (PES) fields of generally radially directed discrete magnetized stripes. Each stripe in each of the two fields comprises a plurality of radially spaced discrete servo islands, each island having a radial height of approximately Tp, where Tp is the radial spacing of the track centerlines. In each field, the servo islands in alternating stripes in the along-the-track direction are shifted radially by approximately Tp. In the first PES field, the islands are centered at the midline between two adjacent track centerlines, and in the second PES field the islands are centered at a track centerline. All of the servo islands in the two PES fields have the same magnetization direction. | 04-16-2009 |
| 20090161246 | Random Number Generation Using Hard Disk Drive Information - A hard disk drive enhances random number generation. In particular embodiments, the hard disk drive includes a controller, a hard disk, and a head. The head includes a read sensor for reading patterns on the hard disk. The controller generates a random number based on information associated with the position of the head relative to at least one track of the hard disk. | 06-25-2009 |
| 20100172048 | Servo patterns for patterned media - Servo patterns for patterned media. The servo pattern includes specification of cylinder/track ID with and without a Gray code. The servo pattern space is minimized by the optimum usage of the islands. This is achieved by island allocation rules to take advantage of non-magnetic island. The island allocation also provides for easier lift-off. Logic is used to encode and decode the Gray code. Further, the Gray code is designed to stabilize the magnetic island/non-magnetic island ratio to allow for easier manufacture. | 07-08-2010 |
| 20120149433 | SMART PHONE DISPLAY AND KEYBOARD EXTENSION - A device for providing an external display and keypad for a smart-phone. The device has a port for receiving the smart phone. The device does not have its own computing power, but uses the computing power of the smart phone itself, thereby allowing the device to be smaller, lighter and less expensive than a standard lap-top computer not notebook device. The device is configured with a port for receiving a smart-phone and preferably holds the smart phone so that does not extend above the surface of the device or is flush with the surface of the device. The device can also be configured to allow the smart phone itself to act as a numerical keypad adjacent to the keypad provided on the device. | 06-14-2012 |
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| 20100062365 | CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION - The present invention provides a chemically amplified positive composition comprising: | 03-11-2010 |
| 20110171586 | RESIST PROCESSING METHOD - A resist processing method having the steps of: (1) forming a first resist film by applying a first resist composition comprising: a resin (A) having an acid-labile group, being insoluble or poorly soluble in alkali aqueous solution, and being rendered soluble in alkali aqueous solution through the action of an acid, a photo acid generator (B) and a cross-linking agent (C) onto a substrate and drying; (2) prebaking the first resist film; (3) exposing to a whole surface of the first resist film, and then exposing the first resist film through a mask; (4) post-exposure baking of the first resist film; (5) developing with a first alkali developer to obtain a first resist pattern; (6) hard-baking the first resist pattern, (7) obtaining a second resist film by applying a second resist composition onto the first resist pattern, and then drying; (8) pre baking the second resist film; (9) exposing the second resist film through a mask; (10) post-exposure baking the second resist film; and (11) developing with a second alkali developer to obtain a second resist pattern. | 07-14-2011 |
| 20110183264 | RESIST PROCESSING METHOD AND USE OF POSITIVE TYPE RESIST COMPOSITION - A resist processing method has the steps of: (1) forming a first resist film by applying a first resist composition comprising: a resin (A) including a structural unit represented by the formula (XX), and having an acid-labile group, being insoluble or poorly soluble in alkali aqueous solution, and being rendered soluble in alkali aqueous solution through the action of an acid, and a photo acid generator (B) onto a substrate and drying; (2) prebaking the first resist film; (3) exposing the first resist film; (4) post-exposure baking of the first resist film; (5) developing with a first alkali developer to obtain a first resist pattern; (6) hard-baking the first resist pattern, (7) obtaining a second resist film by applying a second resist composition onto the first resist pattern, and then drying; (8) pre-baking the second resist film; (9) exposing the second resist film; (10) post-exposure baking the second resist film; and (11) developing with a second alkali developer to obtain a second resist pattern. | 07-28-2011 |
| 20110189618 | RESIST PROCESSING METHOD - A resist processing method comprises the steps of: (1) forming a first resist film by applying a first resist composition comprising: a resin (A) having an acid-labile group, being insoluble or poorly soluble in alkali aqueous solution, and being rendered soluble in alkali aqueous solution through the action of an acid, a photo acid generator (B), a cross-linking agent (C) and an acid amplifier (D) onto a substrate and drying; (2) prebaking the first resist film; (3) exposing to the first resist film; (4) post-exposure baking of the first resist film; (5) developing with a first alkali developer to obtain a first resist pattern; (6) hard-baking the first resist pattern, (7) obtaining a second resist film by applying a second resist composition onto the first resist pattern, and drying; (8) pre-baking the second resist film; (9) exposing the second resist film; (10) post-exposure baking the second resist film; and (11) developing with a second alkali developer to obtain a second resist pattern. | 08-04-2011 |
