Patent application number | Description | Published |
20090044972 | Circuit board, method of forming wiring pattern, and method of manufacturing circuit board - When manufacturing a circuit board, a wiring pattern is printed on a substrate with a conductive paste formed of metal powder and thermoplastic resin, and then the conductive paste is subjected to a heating treatment and a pressing treatment. | 02-19-2009 |
20090195933 | HEAD ASSEMBLY - A head assembly for writing or reading information to or from a recording medium. The head assembly includes a suspension having an electrode pad; a mounting member placed on the suspension; a head mounted on the mounting member and having an electrode, for writing or reading information; and a first bonding member made of a hot-melt adhesive and fixing the electrode to the electrode pad. | 08-06-2009 |
20090321500 | REPAIR APPARATUS AND REPAIR METHOD - A repair apparatus includes a heating head device configured to heat a soldering member, which is soldered to a circuit board. The heating head device includes a heating head and a contact member heated by the heating head. The contact member is formed of a material having a spring characteristic and a thermal conductivity higher than a thermal conductivity of the heating head. The contact member is configured to be brought into contact with a soldered surface of the soldering member with an elastic force so as to melt a solder joining the soldering member to the circuit board. | 12-31-2009 |
20100006325 | PRINTED WIRING BOARD - A printed wiring board includes a first conductive paste forming a wiring pattern, and a second conductive paste including kneaded first conductive material and second conductive material whose particles are finer than those of the first conductive material. | 01-14-2010 |
20100326726 | SOLDER JOINT STRUCTURE, ELECTRONIC DEVICE USING THE SAME, AND SOLDER BONDING METHOD - A solder joint structure include: a first terminal portion including a plurality of first terminal conductors adjacent to each other; a second terminal portion arranged opposite to the first terminal portion and including a plurality of second terminal conductors which are joined to the first terminal conductors; solders electrically connecting the first terminal conductors and the second terminal conductors; and member for suppressing flow of the solders. | 12-30-2010 |
20110303441 | BOARD REINFORCING STRUCTURE, BOARD ASSEMBLY, AND ELECTRONIC DEVICE - Disclosed is a board reinforcing structure for reinforcing a circuit board in which an electronic component is mounted on a first surface, the electronic component having an electrode arranged in a rectangular-shaped region on the first surface. The board reinforcing structure includes a reinforcing member bonded to positions corresponding to corner parts of four corners of the rectangular-shaped region on a second surface provided on a side opposite to the first surface of the circuit board. In the board reinforcing structure, corresponding one of notches is formed in the reinforcing member at a position corresponding to one of the corner parts of the four corners of the rectangular-shaped region, and at least two apexes of the reinforcing member directed to an outside are formed to shape a contour thereof with the one of the notches. | 12-15-2011 |
20110303443 | MOUNT STRUCTURE, ELECTRONIC APPARATUS, STRESS RELIEVING UNIT, AND METHOD OF MANUFACTURING STRESS RELIEVING UNIT - A mount structure for mounting an electronic component on a circuit board includes a stress relieving unit including a center portion having a smaller cross section than a cross section of ends of the stress relieving unit; a first joint portion configured to join one end of the stress relieving unit onto an electrode pad of the electronic component; a second joint portion configured to join the other end of the stress relieving unit onto a connecting pad of the circuit board. Hollow spaces are provided between plural joint structures each of which includes the first joint portion, the stress relieving unit, and the second joint portion. | 12-15-2011 |
20110303449 | PACKAGING STRUCTURE, PRINTED CIRCUIT BOARD ASSEMBLY AND FIXING METHOD - A packaging structure for mounting an electronic component on a printed circuit board is provided, which includes an external connecting terminal of the electronic component connected to an electrode pad of the printed circuit board; a through-hole penetrating through the printed circuit board, the through-hole formed in a periphery of an electronic component mounting area; and a clamping member including a middle portion extending through the through-hole, and a first end portion and a second end portion extending from the middle portion. The first end portion and the second end portion are bent such that the electronic component and the printed circuit board are sandwiched and clamped by the first end portion and the second end portion. | 12-15-2011 |
20110303450 | MOUNTING STRUCTURE, ELECTRONIC COMPONENT, CIRCUIT BOARD, BOARD ASSEMBLY, ELECTRONIC DEVICE, AND STRESS RELAXATION MEMBER - Disclosed is a mounting structure for mounting an electronic component on a circuit board. The mounting structure includes an interposer provided between the electronic component and the circuit board; and a plurality of spiral conductors formed in the interposer. The plurality of spiral conductors have one end thereof bonded to corresponding one of external connection terminals of the electronic component and the other end thereof bonded to corresponding one of electrodes of the electronic component. | 12-15-2011 |
20110304059 | CIRCUIT BOARD, CIRCUIT BOARD ASSEMBLY, AND SEMICONDUCTOR DEVICE - A disclosed circuit board includes a substrate, a plurality of electrode pads formed on the substrate, and a groove formed between adjacent electrode pads on the substrate. Further, the electrode pads are surrounded by the groove to have an air space between the adjacent electrode pads. | 12-15-2011 |