Patent application number | Description | Published |
20090138135 | ALIGNMENT METHOD, EXPOSURE METHOD, PATTERN FORMING METHOD, AND EXPOSURE APPARATUS - An alignment method is provided in which a substrate including first and second layers is aligned in forming a second pattern in the second layer. The method includes storing first alignment measurement data to be used in alignment performed in forming a first pattern and a second alignment mark in the second layer, the first alignment measurement data obtained by measuring a first alignment mark provided in the first layer; obtaining second alignment measurement data by measuring the second alignment mark through a resist applied over the second layer; obtaining third alignment measurement data by measuring the first alignment mark through the resist; and performing alignment of the substrate in accordance with a first difference between the first and second alignment measurement data, or in accordance with the first difference and a second difference between the first and third alignment measurement data. | 05-28-2009 |
20090220872 | DETECTING APPARATUS, EXPOSURE APPARATUS, AND DEVICE MANUFACTURING METHOD - A detecting apparatus includes a image pickup device configured to supply an output signal, an imaging optical system configured to form an image of an alignment mark formed on a substrate onto the image pickup device, and a signal processing unit including a restoration filter having a parameter that can be set, and configured to process the output signal and detect a position of the alignment mark, wherein the signal processing unit is configured to cause the restoration filter to act upon the output signal and generate a restoration signal, compute based on the restoration signal, for each of a plurality of candidate values of the parameter, a corresponding feature value relating to a form of the alignment mark, and set the parameter based on the computed feature values. | 09-03-2009 |
20090244513 | POSITION DETECTION APPARATUS, POSITION DETECTION METHOD, EXPOSURE APPARATUS, AND DEVICE FABRICATION METHOD - The present invention provides a position detection apparatus including a first obtaining unit configured to obtain imaging characteristics of an imaging optical system for a plurality of light beams, having different wavelength with each other, of the light having the wavelength width, a second obtaining unit configured to obtain optical images of a target object for the plurality of light beams, a restoration unit configured to restore optical images of the target object for the plurality of light beams by correcting, deterioration in the obtained optical images of the target object attributed to the imaging optical system, based on the obtained imaging characteristics of the imaging optical system, and a generation unit configured to generate an optical image of the target object for light including the plurality of light beams by synthesizing the restored optical images of the target object for the plurality of light beams. | 10-01-2009 |
20090286172 | SURFACE SHAPE MEASUREMENT APPARATUS AND EXPOSURE APPARATUS - A surface shape measurement apparatus is configured to measure a surface shape of an object to be measured, and includes a beam splitter configured to split white light from a light source into two light beams, a pair of prisms each configured to increase an incident angle of each light beam that has been split by the beam splitter and directed to the object or a reference surface, each prism having an antireflection part that is formed at a period of a wavelength of the white light or smaller and has a moth-eye shape, a superimposition unit configured to superimpose object light from the object with reference light from the reference surface and has passed the second prism, and to generate white interference light, and a Lyot filter configured to discretely separate the white interference light for each of a plurality of wavelengths. | 11-19-2009 |
20110242509 | POSITION DETECTING METHOD - A method detects a position of a mark based on an image signal of the mark. The method includes steps of obtaining a first position of the mark by performing a first process for the image signal, extracting plural feature values from the image signal based on the first position, and detecting the position of the mark by obtaining an offset value for the first position based on the plural feature values. | 10-06-2011 |
20130216954 | DRAWING APPARATUS, AND METHOD OF MANUFACTURING ARTICLE - A drawing apparatus, which draws a pattern on a substrate with a plurality of charged particle beams, includes: a charged particle optical system configured to emit the plurality of charged particle beams onto the substrate; and a controller configured to control an operation of the charged particle optical system. The controller is configured to control the operation so as to compensate for a distortion of the pattern that is determined based on first data of an undulation of a surface of the substrate and second data of an inclination of each of the plurality of charged particle beams with respect to an axis of the charged particle optical system. | 08-22-2013 |
20130230805 | DRAWING APPARATUS, REFERENCE MEMBER, AND METHOD OF MANUFACTURING ARTICLE - A drawing apparatus includes a charged particle optical system, a first measurement device including an image taking optical system and configured to measure a position of a reference mark in a first direction, a second measurement device configured to measure a position of the reference mark in the first direction based on an amount of charged particle beams that arrives thereat from the reference mark on which the charged particle beam are incident. The reference mark includes a first region having a first edge inclined with respect to a second direction perpendicular to the first direction and a second region having a second edge parallel to the second direction. A processor obtains a baseline based on measurement result with respect to the first region obtained by the first measurement device and measurement result with respect to the second region obtained by the second measurement device. | 09-05-2013 |
20130335503 | DRAWING APPARATUS, DATA PROCESSING METHOD, AND METHOD OF MANUFACTURING ARTICLE - A drawing apparatus performs drawing on a first partial region and a second partial region. The first and second partial regions having an overlap region in which the first and second partial regions overlap each other. The apparatus includes a transformation device configured to transform first pattern data for the first partial region into first quantized pattern data in accordance with a first transformation rule, and to transform second pattern data for the second partial region into second quantized pattern data in accordance with a second transformation rule different from the first transformation rule, and a controller configured to control the drawing on the first partial region based on the first quantized pattern data, and to control the drawing on the second partial region based on the second quantized pattern data. | 12-19-2013 |
20140209818 | LITHOGRAPHY APPARATUS, LITHOGRAPHY METHOD, AND METHOD OF MANUFACTURING ARTICLE - A lithography apparatus measures a position of each sample shot, and obtains a measurement error with respect to each second shot region of the sample shot regions based on a position of each second shot region obtained by first regression calculation based on a measurement value of a position of each first shot region of the sample shot regions, and a measurement value of a position of each second shot region. After forming the pattern in at least one shot region, the apparatus measures a position of each of shot regions of the second shot regions in a partial area, and obtains positions of shot regions in the partial area by second regression calculation based on measurement values of the positions of shot regions in the partial area and the obtained measurement error. | 07-31-2014 |
20140320836 | LITHOGRAPHY APPARATUS, LITHOGRAPHY METHOD, AND METHOD FOR MANUFACTURING DEVICE - An apparatus includes an optical system configured to irradiate a surface of a substrate with a beam, a control unit configured to control a position of the irradiation of the beam, and a first measurement unit and a second measurement unit each configured to measure a position of a mark formed on the substrate. The second measurement unit is placed at a position closer to an optical axis of the optical system than the first measurement unit is. Based on a position measurement value measured by the first measurement unit and position measurement values measured at different timings by the second measurement unit, the control unit controls the position of the beam irradiated to the substrate. The position measurement values measured at the different timings are values obtained from the same mark or values obtained from two marks adjacent to a common shot area. | 10-30-2014 |